Engineered for the next generation of connected vehicles, the RO4360G2 0.6mm 1oz Hard Gold 2-Layer Automotive V2X Communication Board delivers the signal integrity, thermal stability, and surface durability demanded by modern Vehicle-to-Everything (V2X) systems. Manufactured by PCBSync to strict automotive-grade tolerances, this high-frequency PCB is purpose-built for DSRC and C-V2X applications operating in the 5.9 GHz ITS band.
Premium Rogers RO4360G2 Substrate
At the heart of this board is Rogers RO4360G2 — a glass-reinforced, ceramic-filled thermoset laminate with a dielectric constant (Dk) of 6.15 ± 0.15 and an exceptionally low dissipation factor (Df) of 0.0038 at 10 GHz. These electrical properties ensure minimal insertion loss and tightly controlled impedance, making the material ideal for automotive radar, V2X antennas, and millimeter-wave communication front-ends. Unlike PTFE-based alternatives, RO4360G2 processes like standard FR-4, allowing PCBSync to deliver high-frequency performance without the cost or lead-time penalties of exotic laminates.
Optimized Specifications
- Material: Rogers RO4360G2 (Dk 6.15, Df 0.0038)
- Layer Count: 2 layers
- Board Thickness: 0.6 mm
- Copper Weight: 1 oz outer
- Surface Finish: Hard Gold (electroplated, 30–50 µ” Au over 100–200 µ” Ni)
- Solder Mask: Green (other colors on request)
- Silkscreen: White
- Quality Class: IPC-A-600 Class 3 / IATF 16949-aligned
Why Hard Gold Matters in Automotive Applications
Hard Gold plating delivers outstanding wear resistance and contact reliability — critical for V2X modules that connect via edge fingers, test pads, or repeatedly mated connectors over a 15-year vehicle service life. The cobalt-hardened gold layer resists fretting corrosion, mechanical abrasion, and the temperature cycling typical of under-hood and roof-mounted shark-fin antenna installations. For automotive OEMs and Tier 1 suppliers, that translates to fewer field returns and longer mean time between failures.
Designed for V2X and ADAS Integration
This board is optimized for a wide range of next-generation automotive electronics:
- C-V2X PC5 sidelink 5.9 GHz transceiver modules
- DSRC On-Board Units (OBU) and Roadside Units (RSU)
- 77 GHz radar interconnect carriers and feeder boards
- Telematics Control Units (TCU) with cellular + V2X co-existence
- ADAS sensor-fusion gateways and infotainment connectivity hubs
The 0.6 mm thinner core supports compact module designs, tighter trace-to-ground coupling, and improved thermal pathing — essential for densely packed automotive electronics where every millimeter of stack-up matters.
Manufactured at PCBSync — Built for Production
Every RO4360G2 V2X board from PCBSync is fabricated in IATF 16949-certified facilities, with full electrical test, AOI inspection, and impedance coupon verification on every panel. We support prototype runs from a single piece through to series production, with typical lead times of 5–10 working days. Stack-up engineering, controlled impedance modeling, and Gerber DFM review are included with every order at no extra cost.
Order with Confidence
Whether you are validating a V2X reference design, scaling a connected-car product line, or building intelligent roadside infrastructure, PCBSync’s RO4360G2 Hard Gold 2-Layer Automotive Board provides a proven, automotive-qualified foundation. Upload your Gerber files for an instant quote, or contact our engineering team for stack-up consultation and custom configurations.
