Engineered for next-generation telecom infrastructure, the RO4003C 2.0mm 3oz Immersion Silver 14-Layer Telecom Switching Board delivers the high-frequency performance, signal integrity, and thermal stability demanded by modern 5G, microwave, and RF switching applications. Manufactured at PCBSync to IPC Class 2/3 standards, this multilayer PCB is built around Rogers RO4003C high-frequency laminate—an industry-trusted material renowned for its low dielectric loss, stable Dk, and excellent dimensional stability across the full telecom operating range.
Premium Rogers RO4003C Laminate for High-Frequency Telecom
At the core of this 14-layer board is Rogers RO4003C hydrocarbon ceramic laminate, offering a tightly controlled dielectric constant (Dk 3.38 ± 0.05) and an ultra-low dissipation factor (Df 0.0027 @ 10 GHz). These properties make RO4003C ideal for telecom switching equipment, base station antennas, point-to-point microwave links, and active phased array systems where signal fidelity is non-negotiable. Unlike PTFE-based laminates, RO4003C processes like standard FR-4—enabling consistent yields, accurate impedance control, and cost-effective manufacturing without sacrificing RF performance.
Robust 3oz Copper for High-Current Switching
With 3oz (105µm) copper on signal and power layers, this board is engineered to handle the elevated current loads typical of telecom switching fabrics, power distribution planes, and high-density routing nodes. Heavier copper improves heat dissipation, reduces voltage drop across long traces, and enhances long-term reliability under continuous duty cycles—critical for carrier-grade telecom hardware operating 24/7.
Immersion Silver (ImAg) Surface Finish
The Immersion Silver finish delivers a flat, RoHS-compliant solderable surface optimized for fine-pitch BGAs, QFNs, and high-frequency components. ImAg offers superior signal performance compared to HASL and ENIG at high frequencies, with lower insertion loss and excellent solderability. Its planar surface ensures consistent coplanarity for press-fit connectors and high-speed SMT assembly common in telecom backplanes.
Technical Specifications
- Base Material: Rogers RO4003C high-frequency laminate
- Board Thickness: 2.0mm (±10%)
- Layer Count: 14 layers
- Copper Weight: 3oz inner & outer
- Surface Finish: Immersion Silver (ImAg)
- Min Trace/Space: 4/4 mil
- Min Drilled Hole: 0.2mm mechanical
- Impedance Tolerance: ±5% (controlled impedance available)
- Solder Mask: Green LPI (custom colors on request)
- Standards: IPC-A-600 / IPC-6012 Class 2 or 3
- Testing: 100% Flying Probe / E-test, AOI, X-Ray for blind/buried vias
Telecom & RF Applications
This 14-layer telecom switching board is purpose-built for:
- 5G base stations, small cells, and macro radios
- Optical transport network (OTN) switches
- Microwave backhaul radios
- High-speed Ethernet line cards and switching backplanes
- RF/IF switching matrices and beamforming networks
- Phased array radar and SATCOM modules
Why Order from PCBSync
PCBSync specializes in high-frequency, high-layer-count PCB manufacturing for telecom OEMs and EMS providers worldwide. Every RO4003C order undergoes strict in-process inspection, controlled impedance verification, and TDR testing where required. With competitive lead times on prototypes and production runs, transparent online quoting, and dedicated RF engineering support, PCBSync helps you move from design to deployment without compromise on quality or schedule.
Upload your Gerbers and request an instant quote today—and bring your telecom switching design to market faster with manufacturing precision you can trust.
