RT/Duroid 5870 | 1.6mm | 3oz Copper | 100μ” Gold Plating | 2-Layer High-Reliability RF PCB
Engineered for mission-critical RF and microwave applications, this PCBSync 2-layer circuit board is built on genuine Rogers RT/Duroid® 5870 — the industry benchmark for low-loss, high-frequency laminate performance. Every aspect of this board is specified for demanding environments where signal integrity, thermal stability, and long-term reliability are non-negotiable.
Substrate: Rogers RT/Duroid® 5870 PTFE Composite
At the heart of this PCB is the RT/Duroid 5870 laminate, a glass microfiber-reinforced PTFE composite manufactured by Rogers Corporation. With an ultra-low dielectric constant (Dk) of 2.33 ±0.02 at 10 GHz and an exceptionally low dissipation factor, RT/Duroid 5870 delivers the lowest electrical loss of any reinforced PTFE material on the market. Its isotropic structure ensures uniform electrical properties from panel to panel and across a wide frequency range — from L-band through Ku-band and beyond. Low moisture absorption further guarantees stable performance in humid or harsh operating conditions.
1.6mm Dielectric Thickness
The 1.6mm (62 mil) board thickness provides a robust mechanical profile while enabling precise impedance control for microstrip and stripline transmission line designs. This standard thickness simplifies integration into existing enclosures, connectors, and mounting hardware, reducing system-level design effort and cost.
3oz (105μm) Copper Cladding
Heavy 3oz electrodeposited copper cladding delivers superior current-carrying capacity and significantly lower conductor losses at high frequencies compared to standard 1oz foil. This makes the board an excellent choice for high-power amplifier stages, combiner networks, and feed structures where thermal dissipation from RF currents must be managed aggressively. The thicker copper also improves mechanical durability during assembly and rework cycles.
100μ” Hard Gold Surface Finish
A 100 micro-inch (2.54μm) electrolytic hard gold plating is applied over nickel barrier to all pads and exposed conductors. This finish is specified for high-reliability applications requiring repeated mating cycles on edge connectors, wire bonding compatibility, and long shelf life without oxidation. Gold plating also ensures consistently low contact resistance and excellent solderability, critical for defense, aerospace, and instrumentation-grade assemblies.
2-Layer Stackup — Purpose-Built Simplicity
The clean 2-layer construction eliminates interlayer registration concerns and parasitic coupling paths, delivering predictable RF performance that is straightforward to simulate, fabricate, and test. This stackup is ideal for microstrip patch antennas, couplers, filters, power dividers, and high-frequency evaluation boards.
Target Applications
This board is purpose-built for commercial and defense RF systems including broadband antenna arrays, phased array feed networks, millimeter-wave circuits, satellite communication modules, radar front-ends, missile guidance electronics, point-to-point digital radio links, and precision RF test fixtures.
Why PCBSync?
PCBSync specializes in high-frequency and specialty-material PCB fabrication with full impedance control, DFM review, and lot traceability. Every RT/Duroid board ships with electrical test certification and is manufactured under strict process controls to meet MIL-grade and IPC Class 3 workmanship standards.
Order with confidence — whether you need prototypes or production volumes, PCBSync delivers Rogers-based RF boards with the quality, lead time, and technical support your project demands.
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