Ventec VT-5235 PTFE Woven Glass Laminate Dk 2.35: Precision RF Circuit Performance Deep-Dive

Ask any microwave circuit engineer what separates a precision RF board that works first time from one that needs two or three fabrication spins to hit spec, and the honest answer almost always comes back to substrate selection. Not just picking PTFE over FR-4 — that part is obvious once you’re above a few gigahertz — but choosing the right architecture within the PTFE family. The Ventec VT-5235 PTFE woven glass laminate Dk 2.35 is built around one of the most important material decisions at this level: woven glass reinforcement rather than random or ceramic fill. That choice has real engineering consequences that this article covers in full.

This guide is written from a working RF PCB design perspective. We’ll cover the electrical properties and why Dk 2.35 is a meaningful target, what woven-glass reinforcement does for dimensional stability and circuit predictability, the applications where VT-5235 performs well, fabrication specifics your shop needs to know, and an honest comparison against competing materials. If you’re qualifying substrate options for a precision filter, phased array feed, or satellite transceiver board, this is the level of detail that informs a defensible material choice.

What Is the Ventec VT-5235 PTFE Woven Glass Laminate Dk 2.35?

The VT-5235 is a woven-glass reinforced PTFE laminate — not ceramic-filled, not random-fiber, but woven. That distinction matters more than it sounds. The material sits within Ventec’s tec-speed 30.0 RF product family, which is Ventec’s ceramic-filled and glass-reinforced PTFE range designed for high-speed, high-frequency applications requiring the highest signal-integrity characteristics for the most advanced RF systems.

The “5235” designation encodes the material’s defining characteristic: a dielectric constant (Dk) of approximately 2.35 at 10 GHz. This Dk target is not arbitrary. It places VT-5235 in a specific tier of PTFE laminates — above the ultra-low-Dk ceramic-filled materials like a VT-5220 (Dk ~2.20) and below the glass-ceramic composite materials approaching Dk 3.0. At Dk 2.35, you get trace geometries that are manageable at frequencies from 5 GHz through Ka-band and beyond, combined with the electrical stability that comes from the woven-glass reinforcement structure.

Ventec International Group (TWSE: 6672) built its PTFE manufacturing capability around a purpose-designed high-temperature press line to meet the growing global demand for PTFE laminates. The tec-speed 30.0 family covers a Dk range from 3.0 down to approximately 2.17, with different reinforcement architectures targeting different application priorities. VT-5235 sits in the woven-glass branch of this family — optimized for dimensional stability, controlled-impedance repeatability, and applications where X/Y plane consistency is as important as raw loss performance.

The Engineering Logic Behind Dk 2.35 in Woven-Glass PTFE

Pure PTFE has a Dk of approximately 2.0. When you add woven E-glass reinforcement to a PTFE matrix, the glass (Dk ~6.0) raises the composite Dk. The amount of glass by weight percentage, weave pattern, and fiber diameter all influence the final Dk value. At Dk 2.35, VT-5235 contains a relatively low glass content — enough to deliver meaningful dimensional stability improvements over unreinforced PTFE, but not so much that the glass contribution degrades loss performance or creates significant Dk inhomogeneity at the fibre bundle scale.

The practical result: you get a dielectric constant stable to within ±0.02 across the panel, a material that handles and fabricates much like other woven-glass PTFE products, and electrical performance that is competitive with the Rogers RT/duroid 5870 (Dk 2.33) class of materials that RF engineers have trusted for decades. For circuits where achieving a precise Dk value is the primary design constraint — phase-matched transmission lines, tight-tolerance filter elements, antenna patch arrays — the Dk 2.35 target of VT-5235 offers predictable circuit behavior across production lots.

Why Woven Glass Reinforcement Changes the Engineering Equation

This is the section most material selection guides skip, but it’s where a lot of real engineering value lives.

Dimensional Stability in the X/Y Plane

Woven-glass reinforcement dramatically improves in-plane dimensional stability compared to ceramic-filled or random-fiber PTFE composites. Pure PTFE is soft and prone to dimensional change under temperature cycling and processing stress. Woven-glass reinforced PTFE laminates are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. This stability is critical during fabrication — specifically during the etching step, where dimensional instability can shift trace positions relative to the drilled hole pattern, degrading controlled-impedance accuracy and antenna element positioning.

For a 10-element patch antenna array at 24 GHz, where element spacing must be held to ±0.05 mm or better for acceptable array gain pattern, the in-plane stability difference between woven-glass PTFE and random-fiber PTFE is not academic — it’s the difference between first-article success and a re-layout cycle.

Copper Adhesion and Peel Strength

Woven-glass PTFE laminates generally provide better peel strength than ceramic-filled or unreinforced PTFE, because the glass weave creates a textured mechanical interface for copper bonding. Typical peel strength for woven-glass PTFE with treated copper is 4–6 lb/in, compared to 3–4 lb/in for some ceramic-filled PTFE grades. In fine-line RF work where trace widths are narrow (sometimes below 0.15 mm for 50 Ω lines at high frequencies), adequate peel strength is a functional requirement, not just a reliability metric.

Dk Isotropy and Weave-Induced Variation

One well-known issue with woven-glass laminates of any type — including PTFE woven-glass — is the potential for Dk variation caused by the glass weave pattern. The difference in Dk between the resin-rich zones and the glass-rich zones of the weave can create periodic variation in electrical path length, particularly for signals propagating parallel to the weave direction. This effect is most significant for high-density woven glass (high glass fraction) and becomes less significant as glass content decreases. At the low glass loadings used in Dk 2.35 PTFE woven-glass laminates like VT-5235, weave-induced Dk variation is relatively small — typically much less than ±0.02 — but it is worth understanding when designing phase-critical circuits at millimeter-wave frequencies.

Complete Electrical and Mechanical Specifications

Property	Test Method	Typical Value	Notes
Dielectric Constant (Dk) @ 10 GHz	IPC-TM-650 2.5.5.5	2.35 ± 0.02	Woven-glass reinforced PTFE
Dissipation Factor (Df) @ 10 GHz	IPC-TM-650 2.5.5.5	≤0.0012	Ultra-low loss
Dk @ 1 GHz	IPC-TM-650 2.5.5.3	~2.38	Very low Dk dispersion
Temperature Coefficient of Dk (TCDk)	—	~-40 to -50 ppm/°C	Stable vs. temperature
X/Y CTE (below Tg)	IPC-TM-650 2.4.24	~15–22 ppm/°C	Woven glass improves vs. pure PTFE
Z-Axis CTE	IPC-TM-650 2.4.24	~150–170 ppm/°C	PTFE matrix dominates Z-axis
Tg (Glass Transition Temperature)	DSC	~160–200°C	PTFE system
Td (Decomposition Temperature)	ASTM D3850	≥400°C	Excellent thermal stability
Thermal Conductivity	ISO 22007-2	~0.26 W/m·K	Typical for PTFE-glass
Moisture Absorption	IPC-TM-650 2.6.2	≤0.10%	Key PTFE advantage vs. epoxy
Peel Strength (1 oz RTF Cu)	IPC-TM-650 2.4.8	≥4.5 lb/in	Post surface treatment
Tensile Strength (warp)	IPC-TM-650 2.4.19	~100 MPa	Woven glass contribution
UL Flammability	UL 94	V-0	Standard compliance
Lead-Free Assembly Compatible	—	Yes	High Td supports this
Available Panel Sizes	—	12×18″ to 24×36″	Confirm with Ventec

All values are typical. Verify against the current official Ventec VT-5235 datasheet for design-specific applications.

Key Performance Characteristics for Precision RF Circuit Design

Insertion Loss Budget at Common Frequencies

At Dk 2.35, a 50 Ω microstrip line on a 0.030″ (0.762 mm) VT-5235 core with 1 oz RTF copper would require a trace width of approximately 2.1–2.2 mm. The resulting insertion loss for this transmission line configuration would be approximately 0.12–0.18 dB/cm at 10 GHz — dominated by dielectric loss from the PTFE matrix (very low) and copper conductor loss from the skin effect and surface roughness.

To compare against standard FR-4 at the same frequency: the dielectric contribution to insertion loss alone is approximately 4–5x higher on FR-4 than on VT-5235. On a 15 cm microstrip run at 10 GHz, that difference is 2–3 dB. In RF systems with tight noise figure or output power budgets, that margin is significant.

Phase Stability vs. Temperature

For phased-array antenna systems, the phase of each element’s signal must be held within a fraction of a degree across the operating temperature range. TCDk (temperature coefficient of dielectric constant) directly controls how much the electrical length of a transmission line changes with temperature. VT-5235’s TCDk of approximately -40 to -50 ppm/°C means a 100°C temperature swing produces a Dk change of approximately 0.012 — translating to about 0.25% electrical length change. For a λ/4 feed line at 10 GHz (roughly 16 mm long), that corresponds to approximately 0.9° of phase shift — well within the ±5° budget typical for most phased array designs.

Signal Velocity and Propagation Delay

At Dk 2.35, signal propagation velocity in VT-5235 is approximately 65% of the speed of light in free space (c/√Dk). This translates to a propagation delay of approximately 51 ps/cm — roughly 45% faster than signal propagation on standard FR-4 (Dk ~4.5). For designs where signal timing is critical, such as true time delay beamforming networks or phase-matched corporate feed structures, this faster propagation means physically shorter transmission line lengths for a given time delay budget, leading to more compact board layouts.

Application Areas for Ventec VT-5235 PTFE Woven Glass Laminate Dk 2.35

Phased Array Antennas — Defense and Commercial

This is the primary high-volume application for Dk 2.35 woven-glass PTFE class materials. A phased array antenna feed network requires a corporate power-divider tree where phase matching between channels is tightly controlled across temperature and production lots. The combination of VT-5235’s stable Dk (±0.02 tolerance), consistent TCDk, and woven-glass dimensional stability makes it well-suited for producing corporate feed networks where channel-to-channel phase tracking is a pass/fail criterion. Both defense radar and commercial 5G mmWave base station Massive MIMO arrays drive demand for this material class. Materials such as the Taconic TL family of products — direct competitors to VT-5235 — have a low dissipation factor that is perfect for radar applications designed at 77 GHz as well as other antennas in millimeter-wave frequencies.

Satellite Uplink/Downlink Terminal Boards — Ku and Ka Band

Satellite terminal boards for Ku-band (12–18 GHz) and Ka-band (26–40 GHz) operation require substrates that maintain consistent electrical properties across the outdoor temperature range these terminals operate in — typically -40°C to +70°C ambient. VT-5235’s low moisture absorption (≤0.10%) is particularly valuable here: installed outdoor terminals face humidity variations that can shift the Dk of moisture-sensitive materials, degrading insertion loss and impedance control in ways that are temperature-dependent and difficult to characterize. PTFE’s chemical inertness protects against this failure mode.

High-Power RF Amplifier Substrates

Power amplifier (PA) output matching networks in base station transmitters and satellite uplink modules carry significant RF power. The substrate must dissipate the heat generated by resistive losses (even at VT-5235’s low Df, some power is converted to heat in the dielectric) and must not degrade at elevated temperatures. VT-5235’s PTFE matrix provides stable Dk up to and beyond 150°C, and the high Td (≥400°C) provides a comfortable margin against thermal degradation during soldering and operation.

Precision Microwave Filter Manufacturing

Coupled-resonator bandpass filters and stepped-impedance lowpass filters for satellite channelization and radar signal processing demand substrates where the Dk is exactly as specified and exactly repeatable lot-to-lot. A 1% Dk error in a narrow-band filter substrate shifts the resonant frequency by approximately 0.5%. For a 100 MHz bandwidth filter centered at 10 GHz, that’s a 50 MHz center frequency error — completely unacceptable. VT-5235’s ±0.02 Dk tolerance at Dk 2.35 (less than 1% variation) directly enables first-pass filter fabrication success.

Defense and Avionics — EW and Radar

Electronic warfare systems, airborne radar, and signal intelligence (SIGINT) receivers operate across broad bandwidths at frequencies from L-band through Ka-band. VT-5235’s very low moisture absorption, chemical resistance, and thermal stability across wide temperature ranges make it suitable for the demanding operational profiles of defense hardware. The material’s qualification compatibility with AS9100D supply chains — Ventec maintains AS9100 Revision D certification — is a baseline requirement for aerospace and defense procurement.

Competitive Landscape: How VT-5235 Stacks Up

Material	Supplier	Dk @ 10 GHz	Df @ 10 GHz	Reinforcement Type	X/Y CTE
VT-5235	Ventec	2.35 ± 0.02	≤0.0012	Woven glass PTFE	~16–22 ppm/°C
RT/duroid 5870	Rogers	2.33 ± 0.02	0.0012	Random glass PTFE	~150 ppm/°C
TLY-5A	Taconic	2.17 ± 0.02	0.0009	Woven glass PTFE	~14 ppm/°C
TLY-5	Taconic	2.17 ± 0.02	0.0009	Woven glass PTFE	~14 ppm/°C
RO3003	Rogers	3.00 ± 0.04	0.0010	Ceramic PTFE	~17 ppm/°C
RT/duroid 5880	Rogers	2.20 ± 0.02	0.0009	Random micro-fiber	~237 ppm/°C
AD250C	Arlon	2.50 ± 0.04	0.0015	Woven glass PTFE	~90 ppm/°C
RF-30	Taconic	2.97 ± 0.05	0.0014	Woven glass PTFE	~14 ppm/°C

The most direct competitor to VT-5235 is Rogers RT/duroid 5870 (Dk 2.33, Df 0.0012). These materials are essentially equivalent in electrical performance — the Dk difference of 0.02 is within manufacturing tolerance and of no practical significance for circuit design. The meaningful distinction lies elsewhere:

RT/duroid 5870 uses random glass microfiber rather than woven glass, which gives it a higher Z-axis CTE (~150 ppm/°C vs. VT-5235’s ~160 ppm/°C — similar but slightly different depending on glass content) and slightly less in-plane dimensional uniformity. VT-5235’s woven glass structure provides a more mechanically ordered reinforcement, which translates into better panel-to-panel dimensional consistency during the etching process — particularly relevant for large-panel, multi-circuit production runs.

The Taconic TLY family at Dk 2.17 is the ultra-low-Dk woven-glass alternative. The 0.18 difference in Dk between TLY-5 and VT-5235 means trace widths on TLY-5 are slightly wider for the same impedance target — marginally better for conductor loss — but the Dk difference also affects antenna element sizing. For a patch antenna at 24 GHz, the difference in patch length between a Dk 2.17 and a Dk 2.35 substrate is approximately 3.8%, which is significant enough to require distinct layouts.

Fabrication Guidance for Woven-Glass PTFE Laminates

The fabrication learning curve for PTFE laminates is steeper than for FR-4, and woven-glass PTFE has some specific characteristics that differ from ceramic-filled grades. Most PTFE PCB laminates require special equipment and processes to manufacture the highest reliability PCBs along with significant expertise in the material properties, as many of the materials behave differently during PCB processing.

Pre-Treatment for Copper Adhesion

PTFE surfaces are chemically inert — they will not bond to adhesive or plating chemistry without surface activation. The two primary approaches are sodium etching (sodium naphthalene etch, converting surface PTFE to a bondable fluorocarbon layer) and plasma activation (oxygen or argon plasma). VT-5235’s process guide specifies the validated approach. Surface treatment must be applied before any oxide treatment for multilayer inner layers and before direct metallization for through-hole plating. Inadequate surface treatment is the most common cause of peel strength failures and delamination in PTFE builds.

Lamination — High Temperature Required

Process Step	Standard FR-4	VT-5235 PTFE Woven Glass
Press Temperature	~185°C	~370°C (PTFE bondply required)
Pressure	200–400 psi	200–500 psi
Heat Rate	1.5–3°C/min	2–5°C/min (controlled)
Cool Rate	2–5°C/min	Controlled, important for dimensional stability
Bonding Film	FR-4 prepreg	PTFE-compatible bondply only
Press Equipment	Standard	High-temperature capable press

Standard FR-4 press equipment does not reach the temperatures required for PTFE lamination. Confirm your fabricator has documented capability for PTFE-class lamination before committing VT-5235 to a shop that primarily handles epoxy-based materials.

Drilling Considerations

PTFE’s softness relative to FR-4 means it “grabs” drill bits differently. Gummy material smear onto the hole wall is a real risk with worn tooling or incorrect drill parameters (speed, feed, hit count). For VT-5235:

Entry material helps guide the drill entry and prevents surface peeling. Aluminum entry foil is commonly used. Drill bit geometry matters — sharp, dedicated PTFE-type drill bits with appropriate point angle and helix are recommended. Reduce per-hit count compared to FR-4 baselines by 30–50% for VT-5235. Hole wall quality directly affects plating reliability and RF performance at through-holes. Back-drilling to remove via stubs is important for frequencies above 10 GHz.

Controlled-Impedance Testing

For every VT-5235 production panel, include TDR (time-domain reflectometry) test coupons in the panel array. Given that Dk 2.35 laminates produce different trace widths than FR-4 designs, the first production run from a new fab or a new material lot should include correlation between TDR coupon data and VNA S-parameter measurements on a representative circuit. This correlation data validates your electromagnetic simulation model against actual hardware — a process that pays dividends on every subsequent production run.

Engineer’s Selection Guide: When VT-5235 Is the Right Choice

Design Requirement	VT-5235 Suitable?
Operating frequency: 5–40 GHz	✅ Core application range
Phased array phase matching	✅ Excellent — stable Dk, good TCDk
Precision microwave filter (Q > 1000)	✅ Very good choice
Satellite Ku/Ka-band transceiver	✅ Strong candidate
Defense avionics, EW systems	✅ AS9100 supply chain available
Operating frequency < 3 GHz	⚠️ Hydrocarbon laminate may suffice
Maximum dimensional stability needed	✅ Woven glass structure helps
Budget-sensitive volume production	⚠️ Consider tec-speed 20.0 hydrocarbon family
Very high Dk needed for miniaturization	❌ Choose higher Dk variant
High layer count multilayer (>8 layers)	⚠️ Validate PTFE hybrid construction

Useful Resources for Engineers Working with VT-5235

Getting the most out of the Ventec VT-5235 PTFE woven glass laminate Dk 2.35 requires access to accurate technical information at every stage from design through production. The following resources provide the data you need:

Ventec Official Sources:

• tec-speed/RF Product Family: ventec-group.com/products/tec-speed-rf/ — Full PTFE and hydrocarbon RF laminate portfolio
• All Products Database: ventec-group.com/products/all-products/ — Search by product name
• Official Datasheets: Per-product pages at ventec-group.com — always use the current revision
• Process Guidelines (PGL): Download from product pages; these specify the validated fabrication process parameters for PTFE lamination, drilling, and surface activation
• aerolam Aerospace Portfolio: ventec-group.com/aerolam-base-material-solutions-for-aerospace-electronics/ — Defense/aerospace qualified builds

Industry Standards:

• IPC-4103B — Specification for Base Materials for High Speed/High Frequency Applications (woven and non-woven PTFE-class materials)
• IPC-TM-650 2.5.5.5 — Dielectric constant and dissipation factor test method at microwave frequencies using the cavity resonator method
• IPC-TM-650 2.4.24 — CTE measurement method using TMA
• IPC-6018C — Qualification and performance specification for high frequency (microwave) printed boards

RF Design Reference:

• IPC-2141A — Controlled impedance circuit board design guide
• IPC-7711/7721 — Rework and repair guide (relevant for PTFE assembly processes)

Ventec Regional Contacts:

• Americas: saleseast@ventec-usa.com | +1 630-422-1627
• EMEA: sales@ventec-europe.com | +44 1926-889822
• Asia/HQ: sales@ventec.com.cn | +86 512-68091810

For a comprehensive view of how VT-5235 fits within the full Ventec PCB material portfolio — covering FR-4, polyimide, tec-speed signal integrity, tec-speed RF, and tec-thermal families — the PCBSync Ventec material guide provides the full selection framework for engineers.

5 Frequently Asked Questions About VT-5235

1. What is the difference between VT-5235 woven-glass PTFE and a ceramic-filled PTFE at the same Dk?

At the same nominal Dk, woven-glass and ceramic-filled PTFE laminates have meaningfully different mechanical behavior. Woven-glass PTFE (like VT-5235) delivers much better in-plane (X/Y) dimensional stability because the glass weave resists thermal expansion in the plane of the board. This is critical for multi-element array designs where accurate element positioning across the panel depends on minimal in-plane movement during processing. Ceramic-filled PTFE composites — where ceramic particles are dispersed randomly through the PTFE matrix — behave more isotropically, with relatively high and nearly equal CTE in all directions. For circuits where X/Y dimensional control is critical (large arrays, multi-chip module substrates), woven-glass is the preferred architecture. For applications where Z-axis CTE is the primary concern — via reliability in thick multilayer builds — ceramic-filled materials with low Z-axis CTE may be preferable.

2. Why is Dk 2.35 specifically a meaningful target rather than simply using the lowest possible Dk PTFE?

Ultra-low-Dk materials (Dk ~2.17–2.20) produce very wide trace widths for a given impedance target. While wide traces reduce conductor loss, they also consume more board real estate and create challenges at transitions to connectors and components (which typically have interface geometries optimized for Dk ~2.2–3.5 range). At Dk 2.35, VT-5235 offers trace widths that are still wider than FR-4-class materials (better conductor loss than FR-4) but narrower than the extreme end of the PTFE Dk range (better for integration density). For most 5–30 GHz precision RF circuit designs, Dk 2.35 sits in a practical sweet spot where insertion loss is excellent, trace width is manageable, and circuit element sizing is convenient.

3. How does moisture absorption affect VT-5235’s RF performance in outdoor deployment?

PTFE is one of the most chemically inert polymer materials known, with moisture absorption typically below 0.10%. To understand why this matters: a Dk increase of 0.03 due to moisture uptake (which is modest by FR-4 standards) on a Dk 2.35 substrate shifts your quarter-wave resonator frequency by approximately 0.64% — roughly 64 MHz at 10 GHz. For narrowband filter circuits, that’s an unacceptable shift. Epoxy-based substrates can absorb 0.3–1.0% moisture by weight, producing Dk shifts of 0.1–0.3 that create far larger frequency errors. VT-5235’s PTFE matrix effectively eliminates moisture-induced Dk drift, which is why outdoor RF infrastructure, maritime radar, and satellite terminal boards consistently specify PTFE-class substrates regardless of cost.

4. Can VT-5235 be assembled using standard lead-free reflow soldering?

Yes, but with important caveats. VT-5235’s PTFE matrix has a very high Td (≥400°C), which means the material itself is not at risk during standard lead-free reflow cycles peaking at 245–260°C. However, PTFE’s high CTE relative to standard FR-4 means the board will expand significantly more in the Z-axis during reflow. For plated-through holes in a pure VT-5235 build, this Z-axis expansion imposes stress on the hole barrel. High-aspect-ratio through-holes (aspect ratio > 8:1) in pure PTFE builds should be reviewed carefully for barrel fatigue risk. In hybrid PTFE/FR-4 constructions, the FR-4 inner layers help moderate Z-axis CTE. Additionally, PTFE surfaces require pre-treatment before soldering component leads, as the inert fluoropolymer surface can impede solder wetting — ensure soldermask opening and surface finish specifications are appropriate for the assembly process.

5. Where can I download the official VT-5235 datasheet?

The official and most current datasheet for VT-5235 is available through Ventec’s product database at ventec-group.com/products/all-products/. Navigate to the tec-speed/RF product family and search by product name. For the specific IPC-4103 slash sheets covered, laminate and prepreg thickness availability, and available panel sizes, the product page provides the complete specification. When downloading any PTFE material datasheet, pay close attention to the frequency at which Dk and Df are reported — values at 1 MHz, 2.5 GHz, and 10 GHz are not interchangeable, and datasheets from different sources often report at different frequencies. For RF circuit design above 1 GHz, always use the 10 GHz (or higher) cavity resonator measurement values, not the lower-frequency values.

Closing Notes for the RF Design Engineer

The Ventec VT-5235 PTFE woven glass laminate Dk 2.35 earns its position in the precision RF material shortlist for one reason that supersedes most of the other specifications: consistency. Ultra-low loss is necessary but not sufficient for precision RF circuit work. What separates first-time-right designs from iterative spins is knowing that the Dk you designed to matches the Dk the material actually delivers, panel after panel, lot after lot. Woven-glass PTFE architecture contributes to that consistency in ways that ceramic-filled and random-fiber alternatives cannot match in the X/Y plane.

For engineers building systems where frequency precision, array phase coherence, and outdoor environmental stability are operational requirements — satellite communications, military radar, 5G infrastructure — VT-5235 is the kind of material specification that makes RF design predictable rather than empirical. The fabrication process demands a capable shop and validated PTFE process documentation. Confirm process capability before your first engineering build, and treat the process guide as a mandatory input, not an optional reference.

Reach out to Ventec’s technical support team early in your material qualification process. Ventec’s global distribution network and AS9100D certification mean that whatever volume of production your program ultimately demands, the supply chain behind VT-5235 is built for it.