The XC7A75T-1FGG676C is a powerful Artix-7 family FPGA from AMD Xilinx, designed to deliver high logic density, abundant I/O, and excellent power efficiency in a single 28nm device. Featuring the larger 676-pin FBGA package, this variant unlocks more user I/Os and additional GTP transceivers compared to smaller-package alternatives, making it ideal for I/O-intensive designs in industrial imaging, broadcast video, networking equipment, software-defined radio, and high-speed data acquisition systems.
Key Features and Benefits
The XC7A75T-1FGG676C combines 75,520 logic cells, 3,780 Kb of Block RAM, and 180 DSP48E1 slices, providing ample fabric for parallel signal processing, protocol bridging, and embedded control. The 8 GTP transceivers support line rates up to 6.6 Gb/s, enabling PCIe Gen2, Gigabit Ethernet, JESD204B, and custom serial protocols. The -1 speed grade suits cost-sensitive designs that still require solid timing performance, while the C (Commercial) temperature rating of 0 °C to +85 °C fits indoor and controlled-environment deployments.
This device is part of the broader Xilinx FPGA portfolio and is fully supported by the Vivado Design Suite, which streamlines IP integration, high-level synthesis, and timing closure for production designs.
Technical Specifications
Core Logic Resources
| Parameter |
Specification |
| Family |
Artix-7 |
| Logic Cells |
75,520 |
| Configurable Logic Blocks (CLBs) |
11,800 |
| Slices |
11,800 |
| Maximum Distributed RAM |
892 Kb |
| Block RAM (36 Kb blocks) |
105 (3,780 Kb total) |
| DSP Slices (DSP48E1) |
180 |
| Clock Management Tiles (CMTs) |
6 |
I/O, Transceivers, and Package
| Parameter |
Specification |
| Package |
FGG676 (FBGA, 676-pin) |
| Package Dimensions |
27 mm × 27 mm |
| Ball Pitch |
1.0 mm |
| Maximum User I/O |
300 |
| GTP Transceivers |
8 (up to 6.6 Gb/s) |
| Integrated PCIe Blocks |
1 (Gen2 x4) |
| XADC (12-bit ADC) |
Yes, dual channel |
Electrical and Environmental
| Parameter |
Specification |
| Speed Grade |
-1 |
| Temperature Range |
0 °C to +85 °C (Commercial) |
| Core Voltage (V<sub>CCINT</sub>) |
1.0 V |
| Auxiliary Voltage (V<sub>CCAUX</sub>) |
1.8 V |
| Process Technology |
28 nm HPL |
| Configuration Modes |
JTAG, Master/Slave SPI, BPI, SelectMAP |
Typical Applications
The XC7A75T-1FGG676C excels in applications that demand a large pin count and high serial bandwidth in a compact footprint. Common deployments include machine vision cameras with multi-sensor inputs, broadcast video processors, 4K image scalers, medical ultrasound front-ends, LiDAR signal processing boards, software-defined radio platforms, and PCIe-based data acquisition cards. The combination of 8 GTP transceivers and 300 user I/Os makes it especially well-suited to designs that bridge multiple high-speed serial links with parallel sensor or memory interfaces.
Why Source the XC7A75T-1FGG676C from Us
We supply genuine, traceable XC7A75T-1FGG676C devices with original AMD Xilinx packaging, transparent date codes, and full lot documentation. Whether you need a handful of units for prototyping or reel quantities for production runs, our inventory is ready to ship worldwide via express courier with full shipment tracking.
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