The XC7A75T-2CSG324I is a mid-density Artix-7 family FPGA from AMD Xilinx, purpose-built for space-constrained, cost-sensitive embedded designs that still demand serious processing power. Housed in a compact 15 mm × 15 mm CSBGA-324 package, this device packs 75K logic cells, integrated GTP transceivers, and PCIe support into one of the smallest footprints available in the Artix-7 lineup. It is a go-to choice for portable instruments, drones, automotive electronics, machine vision modules, and industrial IoT gateways where board real estate is tight but performance cannot be compromised.
Key Features and Benefits
Manufactured on a 28 nm HPL (High-Performance, Low-Power) process, the XC7A75T-2CSG324I delivers an excellent balance between throughput and energy efficiency. With 75,520 logic cells, 3,780 Kb of Block RAM, and 180 DSP48E1 slices, it has the muscle for real-time signal processing, motor control, video pipelines, and high-speed protocol bridging. The integrated GTP transceivers support serial line rates up to 6.6 Gb/s, while the embedded PCIe Gen2 hard block simplifies host-side connectivity without external IP cores.
The -2 speed grade offers a balanced performance tier, and the I (Industrial) temperature rating guarantees stable operation across −40 °C to +100 °C — well-suited for outdoor, automotive, and factory-floor deployments. As part of the broader Xilinx FPGA portfolio, the device is fully supported by the Vivado Design Suite, with mature IP libraries, HLS workflows, and timing-closure tools.
Technical Specifications
Core Logic Resources
| Parameter |
Specification |
| Family |
Artix-7 |
| Logic Cells |
75,520 |
| Configurable Logic Blocks (CLBs) |
11,800 |
| Maximum Distributed RAM |
892 Kb |
| Block RAM (36 Kb blocks) |
105 (3,780 Kb total) |
| DSP Slices (DSP48E1) |
180 |
| Clock Management Tiles (CMTs) |
6 |
I/O, Transceivers, and Package
| Parameter |
Specification |
| Package |
CSG324 (CSBGA, 324-ball) |
| Package Dimensions |
15 mm × 15 mm |
| Ball Pitch |
0.8 mm |
| Maximum User I/O |
210 |
| GTP Transceivers |
2 (up to 6.6 Gb/s) |
| Integrated PCIe Blocks |
1 (Gen2 x4) |
| XADC (12-bit ADC) |
Yes, dual channel |
Electrical and Environmental
| Parameter |
Specification |
| Speed Grade |
-2 |
| Temperature Range |
−40 °C to +100 °C (Industrial) |
| Core Voltage (V<sub>CCINT</sub>) |
1.0 V |
| Auxiliary Voltage (V<sub>CCAUX</sub>) |
1.8 V |
| Process Technology |
28 nm HPL |
| Configuration Modes |
JTAG, SPI, BPI, Slave SelectMAP |
Typical Applications
Thanks to its compact CSG324 footprint, the XC7A75T-2CSG324I is widely adopted in handheld test instruments, software-defined radios, drone flight controllers, automotive ADAS sensor fusion modules, smart cameras, medical ultrasound front-ends, and LiDAR processors. Its mix of integrated PCIe, GTP transceivers, and industrial-grade reliability makes it particularly attractive for compact, 24/7 mission-critical systems where thermal headroom and long-term availability matter.
Why Source the XC7A75T-2CSG324I from Us
We supply genuine, traceable XC7A75T-2CSG324I devices in original AMD Xilinx packaging, with full date-code transparency and worldwide express shipping. From single-unit prototyping orders to reel-quantity production runs, our inventory is ready to ship today.
