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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7A75T-L2FGG676E FPGA – Low-Power Artix-7 in 676-Pin BGA Package

Product Details

The Xilinx XC7A75T-L2FGG676E is a high-performance, low-power Xilinx FPGA from the Artix-7 family, engineered for cost-sensitive applications that still demand serious logic density and high-speed serial connectivity. With 75,520 logic cells, 8 GTP transceivers, and a compact 676-pin Fine-Pitch BGA package, it bridges the gap between entry-level and mid-range programmable logic — making it a preferred choice for communications, industrial, and embedded vision designs.

Key Features of the Xilinx XC7A75T-L2FGG676E

The XC7A75T-L2FGG676E is built on TSMC’s 28 nm HPL process and operates on a 1.0 V core voltage, delivering the lowest static power in its class without sacrificing signal integrity. The “-2L” speed grade strikes an optimal balance between performance and power efficiency, making it suitable for battery-sensitive and thermally constrained environments.

Why engineers choose this part: The combination of 8 × GTP transceivers (up to 6.6 Gbps each), a built-in PCIe® Gen2 block, and 400 user I/Os in a single 676-pin BGA delivers exceptional bandwidth at under 1 W of static power — rare at this price tier.

Full Technical Specifications

Logic & Fabric Resources

Parameter Value
Logic Cells 75,520
CLB Slices (LUTs + FFs) 11,800
Distributed RAM (Kb) 892
Block RAM (18 Kb tiles) 210 tiles → 3.8 Mb total
DSP Slices (DSP48E1) 180
Maximum Frequency Up to 450 MHz (logic-dependent)

I/O & Connectivity

Parameter Value
User I/O Pins 400
I/O Standards Supported LVCMOS, LVDS, SSTL, HSTL, HSUL
GTP Transceivers 8 (up to 6.6 Gbps each)
PCIe Hard Block 1 × PCIe Gen2 (up to x4)
CMTs (PLLs + MMCMs) 8 CMTs (4 PLLs, 4 MMCMs)

Ordering & Package Information

Attribute Detail
Full Part Number XC7A75T-L2FGG676E
FPGA Family Artix-7
Package FGG676 (676-pin Fine-Pitch BGA)
Speed Grade -2L (Low Power)
Core Voltage (VCCINT) 1.0 V
Process Node 28 nm HPL (TSMC)
Temperature Range Extended (E) – 0 °C to +100 °C
Configuration Interfaces SPI (×1/×2/×4), BPI, SelectMAP, JTAG

Typical Applications

Thanks to its transceiver density and low power profile, the XC7A75T-L2FGG676E is widely deployed across several demanding verticals:

Application Area Use Case
Industrial Automation Motor control, real-time sensor fusion
Wired Communications 10GbE switching, SFP+ line cards
Embedded Vision Image processing pipelines, camera bridging
Test & Measurement High-speed data capture, protocol analysis
Automotive ADAS data aggregation, in-vehicle networking

Why Choose the XC7A75T-L2FGG676E Over Competing FPGAs?

Compared to the standard -2 speed grade variant, the -2L option reduces static power consumption by up to 35%, without a meaningful reduction in achievable clock frequency for most commercial designs. The FGG676 footprint also offers a significant PCB routing advantage over larger BGA packages, reducing layer count requirements and overall board cost. For projects where BOM cost, power envelope, and I/O count are all critical constraints, the XC7A75T-L2FGG676E is a compelling single-chip solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.