Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX1140T-1FLG1930C — Xilinx Virtex-7 XT FPGA, 1930-Pin FCBGA

Product Details

The XC7VX1140T-1FLG1930C is the flagship device of the Xilinx Virtex-7 XT family, delivering the highest logic density, signal-processing throughput, and serial-bandwidth per watt available on the 28 nm 7-Series platform. Built on TSMC’s 28 nm HKMG HPL process and assembled with Stacked Silicon Interconnect (SSI) technology across four Super Logic Regions (SLRs), the XC7VX1140T-1FLG1930C packs 1,139,200 logic cells into a single 1930-ball FCBGA package — making it the go-to choice for ASIC prototyping, wireless test equipment, defense radar, high-frequency trading, broadcast video, and 100G/400G line-card designs.

Why Designers Choose the XC7VX1140T-1FLG1930C

This commercial-grade (0 °C to 85 °C), -1 speed-grade device combines 67,680 Kb of block RAM, 3,360 DSP48E1 slices (4.7 TMAC/s peak), and 96 GTH transceivers running up to 13.1 Gb/s — enough aggregate bandwidth to drive multiple 100GbE ports, CPRI fronthaul, or JESD204B converter farms from a single chip. Four integrated PCIe Gen3 x8 hard blocks, 24 clock management tiles, and 1,100 SelectIO pins (DDR3 up to 1,866 Mb/s) round out a feature set that fully programmable alternatives to ASSPs and ASICs rarely match. Compared to the previous Virtex-6 generation, the XC7VX1140T-1FLG1930C cuts static power roughly in half while doubling system performance.

Key Applications

  • 100G/400G Ethernet bridging, OTN switching, and packet processing
  • 4G/5G wireless baseband and Massive-MIMO remote radio heads
  • High-end test & measurement (oscilloscopes, logic analyzers, BERTs)
  • Software-defined radio (SDR) and electronic warfare platforms
  • Medical imaging back-ends and ASIC emulation systems

For broader family information and additional package/speed-grade options, see our complete Xilinx FPGA inventory.

XC7VX1140T-1FLG1930C Technical Specifications

Logic & Memory Resources

Parameter Value
Manufacturer Xilinx (AMD)
Family / Series Virtex-7 XT
Process Technology 28 nm HKMG HPL
Logic Cells 1,139,200
CLB Slices 178,000
CLB Flip-Flops 1,424,000
Max Distributed RAM 17,700 Kb
Block RAM Blocks (36 Kb) 1,880
Total Block RAM 67,680 Kb (67.68 Mb)
DSP48E1 Slices 3,360

I/O, Transceivers & Clocking

Parameter Value
GTH Transceivers (max 13.1 Gb/s) 96
PCIe Hard Blocks (Gen3 x8) 4
Clock Management Tiles (CMTs) 24
User I/O Pins 1,100
I/O Banks 22
XADC (12-bit, 1 MSPS, dual ADC) 1

Package & Ordering Information

Parameter Value
Package 1930-ball FCBGA (FLG1930)
Body Size 45 mm × 45 mm
Ball Pitch 1.0 mm
Speed Grade -1
Temperature Grade C (Commercial, 0 °C to +85 °C)
RoHS / Lead-Free Yes (Pb-free, exemption 15)
Configuration JTAG, SPI, BPI, SelectMAP, Serial
Security 256-bit AES + HMAC/SHA-256, SEU detection

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.