The XC7VX1140T-G2FLG1930E is a top-bin Virtex-7 XT family FPGA from Xilinx (now AMD), built for engineers who demand the highest possible logic density, I/O count, and DSP performance in a single 28 nm device. Manufactured on TSMC’s high-performance, low-power (HPL) HKMG process, the XC7VX1140T-G2FLG1930E uses 2.5D Stacked Silicon Interconnect (SSI) technology to combine four Super Logic Regions (SLRs) into one monolithic package — delivering capacity that previously required multi-FPGA boards.
This part packs 1,139,200 logic cells, 178,000 CLB slices, 3,360 DSP48E1 slices, and 67,680 Kb (≈67 Mb) of block RAM. The “G2” prefix corresponds to Xilinx’s -2GE high-performance speed grade with expanded temperature (T<sub>J</sub> 0 °C–100 °C), running at the nominal 1.0 V V<sub>CCINT</sub> for maximum F<sub>MAX</sub>. As a result, the XC7VX1140T-G2FLG1930E hits up to 741 MHz in the fabric and 4.7 TMAC/s of DSP throughput, making it one of the fastest 7-series devices available.
The FLG1930 package is the key differentiator: a 1930-ball flip-chip BGA giving designers up to 1,100 user I/Os for wide parallel buses, DDR3 memory at 1,866 Mb/s, and complex high-pin-count backplane interfaces. Combined with up to 96 GTH transceivers (capable of 13.1 Gb/s line rates), four PCIe Gen3 ×8 hard blocks, and dual 12-bit XADC ADCs, the XC7VX1140T-G2FLG1930E is purpose-built for 400G/100G networking line cards, ASIC emulation and prototyping, software-defined radio (SDR), wireless test equipment, broadcast video infrastructure, and high-end medical/scientific imaging.
Designers can target this device with the full Vivado Design Suite flow, including hardware-accelerated synthesis, IP integrator, and the Xilinx Power Estimator (XPE). Whether you are spinning up a single ASIC-prototyping board or scaling into volume manufacturing, our team helps you secure original, traceable Xilinx FPGA parts with full lot-code transparency, MSL-compliant packaging, and X-ray verification on request.
XC7VX1140T-G2FLG1930E Technical Specifications
Core Architecture & Logic Resources
| Parameter |
Value |
| Manufacturer |
Xilinx / AMD |
| Family |
Virtex-7 XT |
| Process Technology |
28 nm HPL HKMG (TSMC) |
| Architecture |
SSI (4 SLRs) |
| Logic Cells |
1,139,200 |
| CLB Slices |
178,000 |
| Max Distributed RAM |
17,700 Kb |
| DSP48E1 Slices |
3,360 |
Memory, Clocking & Performance
| Parameter |
Value |
| Total Block RAM |
67,680 Kb (≈67 Mb) |
| Block RAM Blocks |
1,880 × 36 Kb |
| CMTs (MMCM + PLL) |
24 |
| Speed Grade |
-2GE (G2, high-performance) |
| Fabric F<sub>MAX</sub> |
up to 741 MHz |
| DSP Performance |
up to 4.7 TMAC/s |
I/O, Transceivers & Package
| Parameter |
Value |
| Max User I/Os |
1,100 |
| GTH Transceivers |
up to 96 @ 13.1 Gb/s |
| PCIe Hard Blocks |
4 × Gen3 ×8 |
| Supply Voltage (V<sub>CCINT</sub>) |
0.97 V – 1.03 V (1.0 V nom.) |
| Operating Temp (T<sub>J</sub>) |
0 °C to 100 °C (Expanded) |
| Package |
1930-ball FCBGA |
| Mounting Type |
Surface Mount (SMD) |
| Packaging |
Tray |
| RoHS |
Compliant |
XC7VX1140T-G2FLG1930E vs Other Variants
| Variant |
Speed/Voltage Bin |
Use Case |
| G2FLG1930E |
-2GE, 1.0 V, 0–100 °C T<sub>J</sub> |
Highest performance, full I/O count |
| L2FLG1930E |
-2LE, 0.9 V, 0–100 °C T<sub>J</sub> |
Low-power, same I/O count |
| 2FLG1930C |
-2C, 1.0 V, 0–85 °C T<sub>J</sub> |
Commercial temp, standard speed |
| 1FLG1930I |
-1I, 1.0 V, –40 to 100 °C |
Industrial temp, slower bin |
Why Buy the XC7VX1140T-G2FLG1930E from Us?
We supply genuine, factory-sealed XC7VX1140T-G2FLG1930E units with verified date codes and full traceability. Our quality control includes visual inspection, X-ray, and electrical testing on request — giving you peace of mind for both ASIC-prototyping and production line-card builds. Lead times are short, pricing is competitive, and every order ships with a Certificate of Conformance.
