Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7VX330T-2FF1157I: High-Performance Virtex-7 FPGA for Advanced Applications

Product Details

Overview

The Xilinx XC7VX330T-2FF1157I represents a pinnacle in FPGA technology, delivering exceptional processing power for demanding applications in telecommunications, aerospace, defense, and high-performance computing. This industrial-grade Virtex-7 family member combines massive logic capacity with advanced connectivity features, making it ideal for complex signal processing, data center acceleration, and mission-critical systems requiring reliable operation in harsh environments.

Built on 28nm technology, this FPGA offers an optimal balance between performance and power efficiency. The industrial temperature range (-40°C to +100°C) ensures dependable operation in extreme conditions, while the speed grade -2 provides robust timing margins for high-speed designs.

Key Features and Benefits

This powerhouse FPGA delivers 326,080 logic cells and 46,200 slices, providing ample resources for implementing sophisticated algorithms and parallel processing architectures. The integrated block RAM of 28,620 Kb enables efficient data buffering and storage, while 1,120 DSP slices accelerate mathematical operations essential for digital signal processing applications.

Advanced I/O capabilities include 600 user I/O pins in the FF1157 package, supporting multiple high-speed serial protocols. The device features 56 GTX transceivers capable of 12.5 Gb/s line rates, enabling seamless integration with modern communication standards and protocols.

Technical Specifications

Parameter Specification
Logic Cells 326,080
Slices 46,200
Block RAM 28,620 Kb
DSP Slices 1,120
User I/O 600
GTX Transceivers 56 (12.5 Gb/s)
Package Type FF1157 (Flip Chip)
Speed Grade -2
Temperature Range Industrial (-40°C to +100°C)

Memory and Processing Resources

Resource Type Quantity
CLB Flip-Flops 408,960
Maximum Distributed RAM 7,088 Kb
CMTs (Clock Management) 14
PCIe Gen2 x8 Blocks 3

Applications and Use Cases

The XC7VX330T-2FF1157I excels in applications requiring high computational throughput and reliable performance. Common deployments include 5G wireless infrastructure, radar and sonar processing, medical imaging systems, video processing pipelines, and machine learning inference acceleration.

For engineers seeking comprehensive Xilinx FPGA solutions, this device offers the scalability and flexibility needed for next-generation designs. Its industrial temperature rating makes it particularly suitable for automotive, industrial automation, and outdoor telecommunications equipment.

Design Considerations

When implementing designs with this FPGA, consider leveraging Vivado Design Suite for optimal resource utilization. The abundant DSP resources enable efficient implementation of FIR filters, FFTs, and matrix operations. The high-speed transceivers support protocols including 10G Ethernet, PCIe Gen2, and Serial RapidIO, providing versatile connectivity options.

Power management features include intelligent clock gating and dynamic voltage scaling, helping reduce overall system power consumption while maintaining peak performance when needed.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.