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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX485T-2FF1761I: Xilinx Virtex-7 XT FPGA for High-Performance Designs

Product Details

The XC7VX485T-2FF1761I is a high-performance Field Programmable Gate Array from the AMD Virtex-7 XT family, engineered for bandwidth-intensive and compute-heavy applications. Built on state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology FPGAkey, this industrial-grade device delivers exceptional logic density, DSP throughput, and serial I/O bandwidth in a rugged 1761-ball flip-chip BGA package. Engineers choose this Xilinx FPGA for 10G–100G networking, radar signal processing, ASIC prototyping, and PCIe-based data-center accelerators.

Key Features and Benefits

The XC7VX485T-2FF1761I offers an unmatched balance of performance-per-watt and system integration. With 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP FPGAkey at the family level, it provides a fully programmable alternative to ASSPs and ASICs. Its advanced 6-input LUT fabric, hardened PCIe block, and GTX/GTH transceivers make it ideal for designs requiring deterministic latency and massive parallelism.

Core Highlights

  • 485,760 logic cells for complex control and data-path logic
  • 700 user I/Os supporting HP and HR standards
  • 37,080 Kbit of 36KB dual-port Block RAM with built-in FIFO logic
  • 2,800 DSP48E1 slices with 25×18 multiplier and 48-bit accumulator
  • GTX transceivers up to 12.5 Gb/s for high-speed serial links
  • Integrated PCIe block (x8 Gen2 on this device)
  • 256-bit AES encryption with HMAC/SHA-256 authentication and SEU correction

XC7VX485T-2FF1761I Technical Specifications

General Electrical & Logic Parameters

Parameter Value
Manufacturer AMD (Xilinx)
Device Family Virtex-7 XT
Process Technology 28 nm HKMG
Logic Cells 485,760
CLBs (Slices) 75,900
Block RAM 37,080 Kbit (1,030 × 36Kb)
DSP48E1 Slices 2,800
Max Operating Frequency 710 MHz
Core Voltage (VCCINT) 0.97 V – 1.03 V
I/O Voltage (VCCO) Up to 3.3 V

Package, I/O & Environmental Data

Parameter Value
Package FCBGA (Flip-Chip BGA)
Pin Count 1761 balls
Package Size 42.5 × 42.5 mm
User I/Os 700
I/O Banks HP + HR
Speed Grade –2
Temperature Grade Industrial (–40 °C to +100 °C TJ)
PCIe Support x8 Gen2 (hardened block)
Transceivers GTX up to 12.5 Gb/s
RoHS Compliant

Typical Applications

The XC7VX485T-2FF1761I is deployed in wired and wireless communications infrastructure, software-defined radio, medical imaging, aerospace and defense systems, high-frequency trading cards, and FPGA-based accelerator boards. Its industrial temperature rating and hardened security features also make it well-suited for deployed edge systems where reliability is critical.

Design Tools and Support

This device is fully supported by AMD’s Vivado Design Suite, which provides synthesis, implementation, timing closure, and debug flows optimized for the 7 Series architecture. Legacy ISE flows are also supported, but Vivado is recommended for new designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.