Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX485T-2FFG1157C: Xilinx Virtex-7 XT FPGA Specs, Features & Datasheet

Product Details

Introduction to the XC7VX485T-2FFG1157C FPGA

The XC7VX485T-2FFG1157C is a high-performance field-programmable gate array (FPGA) from the AMD Virtex-7 XT family, originally branded by Xilinx. Built on advanced 28nm high-k metal gate (HKMG) process technology, this device packs 485,760 logic cells, high-speed GTH transceivers, and a rich DSP array into a compact 1157-ball flip-chip BGA package. Engineers choose it for wired communications, ASIC prototyping, radar, and high-throughput DSP applications where board real estate is tight but performance demands remain high.

What Sets the XC7VX485T-2FFG1157C Apart?

Among the XC7VX485T variants, the FFG1157 package is the smallest option, making it the preferred choice for compact line cards and embedded systems. It retains the same silicon die as its larger FCBGA-1761 and FCBGA-1930 siblings, but with fewer exposed I/Os and transceivers. The “-2” speed grade provides mid-tier performance, and the “C” suffix indicates a commercial temperature range of 0°C to 85°C (junction).

Key Features at a Glance

  • 28nm HKMG HPL process delivering up to 50% lower power than prior generations
  • DSP48E1 slices with 25×18 multiplier, 48-bit accumulator, and pre-adder
  • GTH transceivers running up to 13.1 Gb/s for SerDes-heavy protocols
  • Integrated PCIe hard IP (x8 Gen 2 support)
  • 256-bit AES bitstream encryption with HMAC/SHA-256 authentication
  • Built-in SEU detection and correction for mission-critical designs

XC7VX485T-2FFG1157C Technical Specifications

Logic, Memory, and DSP Resources

Parameter Specification
Logic Cells 485,760
CLB Flip-Flops 607,200
Block RAM (BRAM) 37,080 Kb (1,030 × 36 Kb)
Distributed RAM 8,175 Kb
DSP48E1 Slices 2,800
Clock Management Tiles 14 (MMCM + PLL)
Maximum Fabric Clock 710 MHz

I/O, Transceivers, and Interfaces

Parameter Specification
Maximum User I/O 600
GTH Transceivers 20 (up to 13.1 Gb/s)
PCIe Hard IP 4 × Gen 2 x8
Memory Interface DDR3-1866
I/O Standards LVCMOS, LVDS, HSTL, SSTL

Package and Environmental Data

Parameter Specification
Package FCBGA-1157 (Flip-Chip, Pb-free)
Ball Count 1,156
Ball Pitch 1.0 mm
Body Size 35 × 35 mm
Core Voltage (VCCINT) 0.97 V – 1.03 V
Operating Temperature 0°C to 85°C (Commercial)
Speed Grade -2

Typical Applications of the XC7VX485T-2FFG1157C

The device serves a wide range of high-bandwidth, logic-heavy designs:

  • Wired communications — 10G/40G Ethernet switching and OTN equipment
  • Aerospace and defense — portable radar, electronic warfare, secure comms
  • Test and measurement — oscilloscopes, logic analyzers, ASIC emulators
  • Broadcast and video — 4K/8K image processing and professional cameras
  • Medical imaging — MRI, CT, and ultrasound signal front-ends

Design Tools and Development Support

The XC7VX485T-2FFG1157C is fully supported by the AMD Vivado Design Suite, which manages synthesis, implementation, timing closure, and secure bitstream generation for all 7 Series devices. Engineers also benefit from a mature ecosystem of free AXI IP cores, reference designs, and board-level constraint files. Typical companion components include DDR3 memory, QSPI configuration flash, and GTH-capable connectors for PCIe or backplane interconnects.

Sourcing the XC7VX485T-2FFG1157C

Because Virtex-7 devices support long-lifecycle programs, counterfeit risk is a genuine concern for procurement teams. Always buy from authorized distributors or established stocking partners offering full traceability, X-ray inspection, and verified date codes. For bulk orders, engineering samples, or obsolete date-code matching, you can check live inventory from a trusted Xilinx FPGA supplier that specializes in AMD programmable logic devices.


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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.