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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1518C FPGA | High-Performance Xilinx Spartan-II FPGA for Embedded Systems

Product Details

The XC2S200-6FGG1518C is a high-density FPGA from the proven Xilinx Spartan-II family, designed for cost-sensitive yet performance-driven digital systems. It delivers a strong balance of logic capacity, flexibility, and reliability, making it ideal for embedded control, industrial automation, telecommunications, and legacy system maintenance.

This FPGA is widely used in custom hardware design, ASIC replacement, and real-time digital signal processing (DSP) applications where reconfigurability and rapid prototyping are critical.


What is XC2S200-6FGG1518C FPGA?

The XC2S200 series is a 200K-gate programmable logic device built on a 0.18µm CMOS process. It allows engineers to implement complex digital circuits without fabricating a custom ASIC.

Key advantage:

  • Fully reprogrammable logic structure
  • Field-upgradable hardware design
  • Reduced time-to-market for embedded systems

XC2S200-6FGG1518C Key Technical Specifications

Parameter Value
Family Spartan-II FPGA
System Gates 200,000
Logic Cells 5,292
CLB Blocks 1,176
User I/O Pins Up to 284
On-chip RAM ~56 Kbits Block RAM
Supply Voltage 2.5V
Speed Grade -6 (high performance)
Process Technology 0.18µm CMOS

Architecture Overview of XC2S200 FPGA

The FPGA architecture is built around configurable logic and interconnect resources:

Core Components

  • Configurable Logic Blocks (CLBs)
  • Input/Output Blocks (IOBs)
  • Block RAM (dual-port memory)
  • Delay-Locked Loops (DLLs)
  • Programmable routing matrix

System Benefits

  • High-speed internal routing
  • Deterministic timing control
  • Flexible hardware design mapping

Performance Advantages

The XC2S200-6FGG1518C FPGA is optimized for:

  • System clock speeds up to ~200 MHz
  • Low-latency digital processing
  • Stable operation in industrial environments
  • Efficient hardware reuse across multiple product cycles

Package and Design Features

Feature Description
Package Type Fine-Pitch BGA (FBGA)
Pin Density High I/O availability for complex systems
Thermal Design Efficient heat dissipation
PCB Compatibility Standard SMT assembly

Applications of XC2S200-6FGG1518C FPGA

This FPGA is commonly used in:

  • Industrial control systems
  • Automotive electronics
  • Communication hardware
  • Embedded system prototypes
  • Legacy FPGA system replacement
  • Custom digital signal processing (DSP)

Why Choose XC2S200 FPGA?

  • Proven Xilinx Spartan-II architecture
  • Flexible hardware reconfiguration
  • Lower cost compared to ASIC development
  • Long lifecycle in embedded applications
  • Strong support for custom logic design

XC2S200-6FGG1518C vs ASIC Advantage

Feature FPGA (XC2S200) ASIC
Development Time Fast Slow
Flexibility High None
Cost (low volume) Low Very High
Upgradability Yes No

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.