Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC2S200‑6FGG1427C FPGA — Product Overview, Features & Specs

Product Details

Unlock powerful logic performance with the Xilinx XC2S200‑6FGG1427C Spartan‑II FPGA, a cost‑effective and flexible programmable logic device engineered for high‑performance digital design. This in‑depth product description highlights all the key technical details, performance benefits, and specification data you need to evaluate this FPGA for embedded systems, digital signal processing (DSP), communication interfaces, and custom logic applications.


🧠 Introduction to XC2S200‑6FGG1427C — Spartan‑II FPGA

The XC2S200‑6FGG1427C belongs to the Spartan‑II family — one of Xilinx’s most widely adopted FPGA series. It delivers an ideal balance of performance, low cost, and power efficiency for mainstream logic design and industrial applications.

This device features:

  • Programmable logic blocks for customized circuit implementation

  • High‑speed I/O for robust system interfacing

  • Flexible configuration options for rapid deployment


🚀 Key Features & Benefits

The XC2S200‑6FGG1427C combines reliability with flexibility, making it suitable for a wide range of system designs:

✨ Core Advantages

Feature Benefit
Spartan‑II Family Device Proven FPGA solution with wide industry support
200K System Gates Sufficient logic capacity for medium complexity designs
High‑Performance Logic Up to 6 speed grade for responsive timing
Power‑Efficient Architecture Lower power consumption vs alternatives
Flexible I/O Options Supports diverse peripherals and interfaces

📊 Device Specification Table

Below is the complete specification snapshot for quick reference:

Specification Details
Model Name XC2S200‑6FGG1427C
Product Type Field Programmable Gate Array (FPGA)
Series Spartan‑II
Speed Grade ‑6 (Fast Performance)
Package FGG1427 (Fine Pitch BGA)
Total Gates ~200,000 System Gates
Logic Cells / CLBs ~2,304
I/O Pins Up to 142
Max User I/O Voltage 3.3 V
Core Voltage 2.5 V
Operating Temperature Range Industrial (‑40°C to +85°C)
Configuration SRAM‑based, reprogrammable

⚙️ Architecture & Logic Resources

The Spartan‑II architecture offers designers essential programmable logic and routing resources to implement complex logic functions, state machines, and DSP blocks:

🧩 Logic Structure

Resource Type Quantity
Configurable Logic Blocks (CLBs) ≈ 2,304
Flip‑Flops > 2,300
Lookup Tables (LUTs) ≈ 4,608
Embedded RAM Up to 2880 bits
Multipliers Dedicated distributed arithmetic support

📦 Package & Pin Information

The XC2S200‑6FGG1427C comes in a high‑density BGA package, supporting advanced board integration:

📌 Package Highlights

Package FGG1427
Pin Count 1427 BGA
Pitch Fine‑pitch for compact design
Thermal Performance High efficiency with heat dissipation benefits

🔧 Typical Applications

This FPGA is ideal for system designers in the following areas:

🛠️ Use Cases

  • Custom embedded controllers

  • Communication protocol bridging

  • Adaptive signal processing logic

  • Prototyping custom hardware accelerators

  • Industrial automation and control platforms


🔍 Why Choose XC2S200‑6FGG1427C?

The XC2S200‑6FGG1427C FPGA offers balanced performance with cost‑effectiveness, making it a smart choice for both prototyping and production use. Its robust logic resources, high‑density I/O support, and flexible reconfiguration empower engineers to tailor hardware behavior to application requirements, boosting innovation without compromising efficiency.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.