Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1399C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1399C is a prominent member of the Xilinx Spartan-II Field Programmable Gate Array (FPGA) family. Designed to bridge the gap between high-performance system requirements and cost-sensitive production, this device offers a robust 200,000 system gates. As a versatile programmable logic solution, the XC2S200-6FGG1399C is ideal for volume-driven applications in telecommunications, industrial control, and embedded systems.

Key Features of the XC2S200-6FGG1399C FPGA

The Spartan-II architecture is built on a proven 0.18-micron process technology, ensuring a perfect balance of logic density and thermal efficiency. Below are the primary features that make the XC2S200-6FGG1399C a preferred choice for digital design engineers:

 

  • High Logic Capacity: Features 5,292 logic cells and approximately 200,000 system gates for complex designs.

     

  • Flexible I/O Standards: Supports up to 16 high-performance interface standards, including LVTTL, LVCMOS, and PCI.

  • Advanced Clock Management: Equipped with four dedicated Delay-Locked Loops (DLLs) to eliminate clock skew and manage clock distribution.

     

  • On-Chip Memory Resources: Provides 56,320 bits of Block RAM and 75,264 bits of Distributed RAM for efficient data buffering.

  • Low Power Consumption: Operates on a 2.5V core voltage, significantly reducing heat dissipation in dense PCB layouts.

     

High-Speed Timing with -6 Speed Grade

The “-6” designation in the XC2S200-6FGG1399C part number signifies its highest performance speed grade. This allows the FPGA to handle high-frequency signals and complex arithmetic operations with the timing precision required for modern synchronous digital systems.

XC2S200-6FGG1399C Technical Specifications

Understanding the core technical parameters is essential for hardware engineers during the component selection and integration phase. The following table provides a detailed breakdown of the XC2S200-6FGG1399C hardware capabilities.

Table 1: Core Technical Specifications

Feature Specification
Product Series Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows x Cols) 28 x 42
Block RAM Bits 56,320
Distributed RAM Bits 75,264
Speed Grade -6
Core Operating Voltage 2.5V
Operating Temperature 0°C to +85°C (Commercial)

Versatile Applications of the Spartan-II XC2S200

The XC2S200-6FGG1399C is highly adaptable across various industries. Furthermore, its reprogrammable nature allows for field upgrades without the need for hardware replacement, offering a significant advantage over fixed ASICs.

 

Industrial Automation

In industrial environments, this FPGA excels at managing multi-channel sensor data and motor control PWM outputs. Its robust logic capacity supports the implementation of custom state machines for complex factory automation systems.

 

Telecommunications and Networking

The XC2S200-6FGG1399C is widely utilized for protocol conversion, data switching, and signal processing. Its high I/O count and support for various signaling standards make it an ideal bridge between different networking hardware.

Consumer Electronics and Prototyping

Due to its cost-effective architecture, the Spartan-II series is often used in high-definition video processing and digital imaging. Additionally, it serves as an excellent platform for prototyping larger system designs before moving to full-scale production.

 

Package and Thermal Management

The “FGG1399” suffix indicates the Fine-pitch Ball Grid Array (FBGA) package. This lead-free (RoHS compliant) variant is specifically designed for high-density PCB layouts, providing superior electrical signal integrity and thermal conductivity.

Table 2: Package and Physical Characteristics

Parameter Details
Package Type FBGA (Fine-pitch Ball Grid Array)
Lead Finish Lead-Free (RoHS Compliant)
Mounting Style Surface Mount (SMD/SMT)
Temperature Grade C (Commercial)
I/O Pins Up to 284 User I/Os

Conclusion: Why Choose the XC2S200-6FGG1399C?

The XC2S200-6FGG1399C remains a stable and well-documented solution for engineers who require reliable logic density at a fraction of the cost of newer FPGA generations. Whether you are maintaining a legacy system or developing a new cost-optimized design, this Spartan-II device provides the necessary flexibility and performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.