Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1396C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1396C belongs to the renowned Xilinx Spartan-II family, a series designed to deliver high-volume, cost-effective Field Programmable Gate Array (FPGA) solutions. By leveraging a 0.18-micron process technology, this component provides a perfect balance between performance and power consumption. Whether you are working on industrial automation or telecommunications, understanding the capabilities of this Xilinx FPGA is essential for modern digital design.

Introduction to XC2S200-6FGG1396C

The XC2S200-6FGG1396C is engineered to bridge the gap between high-end FPGAs and low-cost ASICs. It offers up to 200,000 system gates and provides a flexible architecture that supports multiple I/O standards. This specific model features a -6 speed grade, ensuring reliable timing for complex logic operations in a Commercial (C) temperature range.

If you are looking for reliable sourcing and technical support for your projects, you can explore more options via this Xilinx FPGA link.

XC2S200-6FGG1396C Technical Specifications

To better understand the hardware capabilities, the following table summarizes the core technical parameters of the XC2S200-6FGG1396C.

Table 1: Core Architecture Specifications

Feature Specification
Series Spartan-II
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Block RAM Bits 57,344
Maximum User I/O 284 (Package Dependent)
Operating Supply Voltage 2.5V (Core)

Key Features of the Spartan-II XC2S200 Series

The XC2S200-6FGG1396C stands out due to its versatile architecture. Below are the primary features that make this FPGA a preferred choice for engineers:

1. High-Performance Memory Architecture

The device features dedicated Block RAM and distributed RAM. This allows for efficient data buffering and FIFO implementations. Furthermore, the 56K bits of Block RAM are organized in 4,096-bit blocks, providing high-bandwidth memory access.

2. Versatile I/O Standards

Modern systems require communication across various voltage levels. The XC2S200-6FGG1396C supports 16 high-performance I/O standards, including:

  • LVTTL and LVCMOS2

  • PCI (33MHz and 66MHz)

  • GTL and GTL+

  • HSTL and SSTL

3. Advanced Clock Management

Equipped with four dedicated Delay-Locked Loops (DLLs), the XC2S200 ensures precise clock distribution. This minimizes clock skew and allows for high-speed internal synchronization, which is critical for complex state machines.

XC2S200-6FGG1396C Package and Thermal Data

Selecting the right package is vital for PCB thermal management. The FGG1396 (Fine Pitch BGA) package is designed for high-density layouts while maintaining robust electrical connectivity.

Table 2: Environmental and Package Details

Parameter Details
Package Type FGG1396 (Fine-Pitch Ball Grid Array)
Speed Grade -6 (Standard Performance)
Temperature Grade Commercial (0°C to +85°C)
Lead-Free Yes (RoHS Compliant)
I/O Banking 8 Independent Banks

Common Applications of Xilinx FPGA XC2S200

Because of its flexibility, the XC2S200-6FGG1396C is found in a wide range of electronic sectors. Its ability to be reprogrammed makes it ideal for prototyping and evolving industry standards.

  • Industrial Control: Used in motor control and factory automation where real-time processing is required.

  • Consumer Electronics: Ideal for digital video processing and set-top boxes.

  • Telecommunications: Frequently utilized in line cards, routers, and protocol converters.

  • Legacy System Support: Often used as a drop-in replacement or bridge for older ASIC-based systems.

Why Choose XC2S200-6FGG1396C for Your Project?

Choosing the XC2S200-6FGG1396C provides several advantages. First, the Spartan-II family has a mature ecosystem of development tools, including Xilinx ISE. Second, the cost-per-gate ratio is highly competitive for 200K gate designs. Finally, the low power consumption at 2.5V makes it suitable for power-sensitive applications.

In summary, the XC2S200-6FGG1396C remains a robust and reliable choice for developers seeking a proven FPGA platform. Its combination of Block RAM, DLLs, and versatile I/O support ensures it can handle the demands of modern digital logic design effectively.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.