Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1394C: High-Efficiency Spartan-II FPGA Product Overview

Product Details

The XC2S200-6FGG1394C is a premier Field Programmable Gate Array (FPGA) within the Xilinx Spartan-II family. Engineered to provide a high-performance, cost-effective solution for logic-intensive applications, this device bridges the gap between traditional ASICs and high-end FPGAs. Built on a 0.18-micron process, the XC2S200-6FGG1394C offers 200,000 system gates, making it an ideal choice for high-volume consumer electronics, industrial control systems, and telecommunications infrastructure.

Technical Specifications of XC2S200-6FGG1394C

The Spartan-II architecture is optimized for low power consumption and high logic density. The XC2S200-6FGG1394C provides a versatile platform for designers who require flexibility without the premium price of high-end silicon.

Core Device Parameters

The following table outlines the fundamental hardware characteristics of the XC2S200-6FGG1394C:

Feature Specification
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Internal Block RAM 57,344 bits
Maximum User I/O Up to 284
Speed Grade -6
Core Voltage 2.5V
Package Type FGG1394 (Fine-pitch BGA)
Operating Temperature 0°C to 85°C (Commercial)

Advanced Architecture and Performance

The XC2S200-6FGG1394C utilizes a highly flexible architecture consisting of Configurable Logic Blocks (CLBs). These blocks are designed to handle both complex combinatorial logic and high-speed synchronous designs efficiently.

Logic Density and System Integration

With 5,292 logic cells and 1,176 CLBs, the XC2S200-6FGG1394C can manage significant system-level integration. It allows developers to replace multiple discrete logic components with a single chip, reducing PCB footprint and increasing system reliability.

Memory and Data Buffering

This FPGA features dedicated block RAM and distributed RAM capabilities. The 56K bits of internal block RAM are essential for high-speed data buffering, FIFO implementations, and digital signal processing (DSP) tasks that require local storage for intermediate values.

I/O Flexibility and Standards Support

The XC2S200-6FGG1394C supports multiple I/O standards, including LVTTL, LVCMOS, and PCI. This versatility ensures the device can interface with a wide variety of external components, from legacy 5V systems to modern low-voltage peripherals, without the need for additional level shifters.

Key Features of the Spartan-II XC2S200 Series

  • Cost-Optimized Design: Specifically targeted at high-volume applications where the bill of materials (BOM) cost is critical.

  • Low Power Consumption: The 2.5V core voltage minimizes heat dissipation and extends the lifespan of portable devices.

  • On-Chip Delay-Locked Loops (DLLs): Provides advanced clock management and skew reduction for high-speed synchronous systems.

  • Comprehensive Tool Support: Fully compatible with Xilinx ISE and modern design suites for rapid prototyping and deployment.

Typical Applications for XC2S200-6FGG1394C

The balance of logic capacity and price makes the XC2S200-6FGG1394C a versatile component across several industries:

  1. Industrial Automation: Real-time motor control, sensor interface, and PLC logic.

  2. Consumer Electronics: Video processing, set-top boxes, and high-fidelity audio equipment.

  3. Telecommunications: Networking switches, protocol converters, and data framing.

  4. Legacy Upgrades: Serving as a reliable replacement for discontinued logic components in long-lifecycle industrial hardware.

Comparison Table: Spartan-II Gate Count and Logic Resources

Device System Gates Logic Cells Block RAM (Bits)
XC2S15 15,000 432 16,384
XC2S50 50,000 1,728 32,768
XC2S100 100,000 2,700 40,960
XC2S200 200,000 5,292 57,344

Conclusion

The XC2S200-6FGG1394C remains a cornerstone for engineers who need a dependable, mid-range FPGA solution. Its robust logic density, dedicated memory blocks, and support for various I/O standards provide the flexibility required for modern digital designs. By choosing the Spartan-II family, you ensure your project benefits from a proven architecture with a strong track record of reliability and performance.

For procurement, datasheets, and technical support regarding this device, visit the Xilinx FPGA LINK.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.