Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1387C: Comprehensive Guide to the Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1387C is a cornerstone of the Xilinx Spartan-II family, designed to provide a cost-effective yet high-performance solution for logic integration. As a Field Programmable Gate Array (FPGA), this device bridges the gap between high-density requirements and budget-conscious engineering.

The Spartan-II series, particularly the XC2S200-6FGG1387C, is renowned for its flexible architecture, offering up to 200,000 system gates. This makes it an ideal choice for high-volume consumer electronics, industrial control systems, and telecommunications infrastructure. In this guide, we will delve into the technical specifications, key features, and application scenarios for this versatile Xilinx FPGA.

Key Features of the XC2S200-6FGG1387C

The XC2S200-6FGG1387C is built on a 0.22µm process, optimized for low power consumption and high logic density. Below are the primary features that define this component:

  • High Logic Capacity: With 5,292 logic cells and 200,000 system gates, it handles complex digital logic with ease.

  • Flexible I/O Standards: Supports multiple I/O signaling standards, including LVTTL, LVCMOS, and PCI.

  • Abundant On-Chip RAM: Features dedicated block RAM for efficient data buffering and storage.

  • Low Power Operation: Optimized for 2.5V core voltage, reducing thermal management requirements.

  • Predictable Timing: The “-6” speed grade ensures reliable performance for synchronized high-speed operations.

Detailed Technical Specifications

Understanding the hardware limits of the XC2S200-6FGG1387C is crucial for effective PCB design and logic synthesis. The following tables outline the core parameters of this device.

Table 1: Core Device Parameters

Parameter Specification
Series Spartan-II
Part Number XC2S200-6FGG1387C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Maximum User I/O Dependent on package layout
Core Voltage 2.5V

Table 2: Memory and Performance

Resource Type Capacity/Value
Total Block RAM Bits 57,344 Bits
Distributed RAM Bits 75,264 Bits
Speed Grade -6
Temperature Grade Commercial (0°C to 85°C)
Package Type FGG1387 (Fine-pitch Ball Grid Array)

Advanced Architecture and Efficiency

The architecture of the XC2S200-6FGG1387C is designed to maximize throughput while minimizing the footprint on your printed circuit board.

Logic Cell Structure

Each logic cell in the Spartan-II series consists of a 4-input Look-Up Table (LUT), carry logic, and a storage element. This modularity allows for efficient implementation of arithmetic functions and complex state machines.

Clock Management

The device features four dedicated Delay-Locked Loops (DLLs). These are essential for managing clock skew and providing high-precision clock multiplication and division, which is vital for high-speed data processing.

Applications of the XC2S200-6FGG1387C

Due to its balance of cost and performance, the XC2S200-6FGG1387C is utilized across various industries:

  1. Industrial Automation: Used in programmable logic controllers (PLCs) and motor control systems where timing precision is non-negotiable.

  2. Consumer Electronics: Ideal for set-top boxes and digital displays that require fast interface logic.

  3. Communication Systems: Functions as a bridge between different communication protocols or as a data pre-processor.

  4. Prototyping: Serves as a reliable platform for ASIC emulation and academic research.

Why Choose the XC2S200-6FGG1387C?

When comparing this model to other logic solutions, the XC2S200-6FGG1387C stands out because of its “Gate-per-Dollar” value. It offers a mature, stable ecosystem supported by Xilinx ISE design tools, ensuring that developers have access to robust synthesis and simulation environments.

Furthermore, the FGG1387 package provides a high density of interconnects in a compact form factor. This allows designers to route a large number of signals without significantly increasing the PCB size, which is a critical factor in modern miniaturized electronics.

Environmental and Thermal Considerations

Operating within the commercial temperature range (0°C to 85°C), the XC2S200-6FGG1387C is built for standard indoor and protected outdoor environments. Designers should ensure adequate decoupling capacitors near the 2.5V VCCINT pins to maintain signal integrity during high-speed switching.

Conclusion

The XC2S200-6FGG1387C remains a highly relevant choice for engineers looking for a dependable Spartan-II FPGA. Its combination of 200k system gates, sophisticated clock management, and versatile I/O support makes it a powerhouse for legacy support and new cost-sensitive designs alike. Whether you are upgrading an existing system or launching a new project, this Xilinx FPGA provides the reliability your hardware demands.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.