The XC2S200-6FGG1384C is a member of the renowned Xilinx Spartan-II family, designed to provide a cost-effective, high-logic-density solution for high-volume electronic applications. This Field Programmable Gate Array (FPGA) offers a perfect balance between performance and value, leveraging a 0.22µm process technology to deliver high speed and low power consumption.
Whether you are working on telecommunications, industrial control systems, or consumer electronics, the XC2S200-6FGG1384C provides the flexibility of programmable logic with the performance levels typically associated with more expensive ASIC solutions.
Key Technical Specifications of XC2S200-6FGG1384C
The XC2S200-6FGG1384C is engineered to handle complex logic tasks while maintaining a small power footprint. Below is a detailed breakdown of its core technical parameters.
Table 1: Core Performance Metrics
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Block RAM Bits |
57,344 |
| Max User I/O |
284 |
| Speed Grade |
-6 (High Speed) |
| Operating Voltage |
2.5V (Core) |
| Package Type |
FGG1384 (Fine-pitch BGA) |
Advanced Features of the Spartan-II XC2S200 Series
1. Flexible Architecture
The XC2S200-6FGG1384C utilizes a flexible architecture consisting of Configurable Logic Blocks (CLBs). Each CLB is designed for high-efficiency logic implementation, allowing for complex state machines and arithmetic functions.
2. High-Speed Memory Resources
With over 56K bits of dedicated Block RAM, this FPGA can handle data buffering and localized storage without consuming valuable logic cells. This makes it ideal for digital signal processing (DSP) and video processing applications.
3. Versatile I/O Standards
The XC2S200-6FGG1384C supports a wide range of I/O standards, including LVTTL, LVCMOS, and PCI. This versatility ensures that the chip can interface seamlessly with various peripheral components and legacy systems.
Package and Thermal Information
The FGG1384 package is a Fine-pitch Ball Grid Array that optimizes board space while providing excellent thermal dissipation. This is critical for high-reliability industrial environments where temperature management is a priority.
Table 2: Packaging & Environmental Data
| Feature |
Details |
| Package Lead Count |
1384 |
| Pitch |
1.0mm |
| Temperature Grade |
Commercial (0°C to +85°C) |
| Lead Finish |
Pb-Free (RoHS Compliant) |
Why Choose XC2S200-6FGG1384C for Your Project?
Choosing the right FPGA involves balancing gate count, I/O flexibility, and cost. The XC2S200-6FGG1384C excels in these areas:
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Cost Efficiency: Provides a high gate count (200,000) at a fraction of the cost of high-end Virtex series chips.
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Ease of Integration: Supported by Xilinx ISE design tools, making the development and simulation process straightforward for engineers.
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Reliability: The Spartan-II series has a proven track record in the industry for stability and long-term availability.
Applications of XC2S200-6FGG1384C
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Industrial Automation: Used for motor control and sensor fusion.
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Communication Systems: Ideal for protocol conversion and interface bridging.
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Legacy System Support: Perfect for maintaining or upgrading older systems that require 5V tolerant I/O.
Finding the Best Xilinx Solutions
If you are looking for high-quality programmable logic devices, it is essential to source them from reliable distributors. For more information on the broader range of available chips and technical support, check out the Xilinx FPGA.
Conclusion
The XC2S200-6FGG1384C remains a cornerstone for developers needing 200k system gates in a robust, high-pin-count package. By combining the speed grade of -6 with the efficiency of the Spartan-II architecture, it provides an enduring solution for modern digital design challenges. Ensure your next design benefits from the versatility and performance of Xilinx silicon.
