The XC2S200-6FGG1382C is a premier Field Programmable Gate Array (FPGA) within the Xilinx Spartan-II family. Engineered for high-volume, cost-sensitive applications, this device provides a robust alternative to mask-programmed ASICs. By utilizing a 0.18-micron process, the XC2S200-6FGG1382C delivers exceptional performance with system clock rates reaching up to 200 MHz, making it an ideal choice for modern digital logic designs.
Introduction to the XC2S200-6FGG1382C FPGA
The Xilinx FPGA series has long been recognized for its flexibility and reliability. Specifically, the XC2S200-6FGG1382C offers 200,000 system gates and a rich set of features, including block RAM and distributed RAM. This component is designed to bridge the gap between high-performance computing and cost-effective hardware production. Consequently, it allows developers to implement complex logic without the high NRE costs associated with custom silicon.
Key Technical Specifications and Parameters
Understanding the technical boundaries of the XC2S200-6FGG1382C is crucial for successful system integration. Below is a detailed breakdown of the core parameters that define this high-performance FPGA.
Technical Data Table
| Attribute |
Specification |
| Manufacturer |
AMD / Xilinx |
| Series |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Number of CLBs |
1,176 |
| Total RAM Bits |
57,344 Bits |
| Maximum Frequency |
200 MHz |
| Supply Voltage (Core) |
2.5V |
| I/O Standards |
16 Selectable Standards |
Operating Conditions
To ensure long-term reliability, the XC2S200-6FGG1382C must be operated within its specified thermal and electrical limits.
| Parameter |
Recommended Range |
| Operating Temperature (Commercial) |
0°C to +85°C |
| Storage Temperature |
-65°C to +150°C |
| Core Supply Voltage (Vccint) |
2.375V to 2.625V |
| I/O Supply Voltage (Vcco) |
1.4V to 3.6V |
Core Features of the Xilinx Spartan-II Series
The XC2S200-6FGG1382C is not just about raw gate counts; it is about the sophisticated logic resources available to the designer.
Superior Clock Management with DLLs
One of the standout features of this device is the inclusion of four dedicated Delay-Locked Loops (DLLs). These components provide advanced clock control, including clock de-skew, frequency multiplication, and phase shifting. As a result, designers can manage high-speed internal timing with precision, reducing jitter and improving overall system stability.
Flexible I/O Standards and Performance
The XC2S200-6FGG1382C supports up to 16 high-performance interface standards. Whether your project requires LVTTL, LVCMOS, or PCI compliance, this FPGA can adapt. Furthermore, it is “Hot Swap” friendly, making it suitable for CompactPCI applications where modules must be inserted or removed without powering down the entire system.
Typical Applications of XC2S200-6FGG1382C
Because of its balanced architecture, the XC2S200-6FGG1382C is frequently found in a variety of sectors. Its versatility allows it to serve as a bridge between different protocols or as a primary controller in embedded systems.
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Industrial Automation: Used for motor control and sensor data processing.
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Telecommunications: Ideal for protocol conversion and networking line cards.
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Consumer Electronics: High-speed data handling in digital displays and media players.
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Prototyping: A cost-effective platform for verifying ASIC designs before final production.
Why Choose the XC2S200-6FGG1382C?
Choosing the XC2S200-6FGG1382C ensures that you are using a field-proven architecture supported by the powerful Xilinx ISE development system. In addition to its technical prowess, its unlimited reprogrammability means that hardware updates can be performed in the field, extending the lifecycle of your end-product significantly.
