The XC2S200-6FGG1381C is a member of the renowned Xilinx Spartan-II family, designed to provide a cost-effective alternative to high-end FPGAs without sacrificing performance. As the industry moves toward more integrated digital solutions, this Field Programmable Gate Array (FPGA) remains a cornerstone for legacy system support, industrial automation, and cost-sensitive consumer electronics.
In this guide, we will explore the technical specifications, key features, and application areas of the XC2S200-6FGG1381C to help you determine if it is the right fit for your next hardware project.
Key Technical Specifications of XC2S200-6FGG1381C
The Spartan-II series is built on a 0.22µm process, offering a balance between power efficiency and logic density. The XC2S200 variant specifically offers a robust logic capacity suitable for complex arithmetic and high-speed I/O operations.
Core Parameters Table
| Parameter |
Specification |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array (Rows x Cols) |
28 x 42 |
| Total Distributed RAM Bits |
75,264 |
| Block RAM Bits |
57,344 |
| Maximum User I/O |
284 |
| Core Voltage (Vccint) |
2.5V |
Why Choose the Spartan-II XC2S200-6FGG1381C?
Selecting a Xilinx FPGA like the XC2S200-6FGG1381C provides developers with a flexible architecture that supports multiple I/O standards and advanced clock management.
1. Flexible I/O Standards
The XC2S200 supports up to 16 high-performance I/O standards, including LVTTL, LVCMOS, and PCI. This makes it highly versatile for interfacing with various peripheral components without the need for external level shifters.
2. Advanced Clock Management
Equipped with four dedicated Delay-Locked Loops (DLLs), this FPGA ensures precise clock distribution and synchronization. This feature is critical for high-speed data processing where timing margins are tight.
3. Cost-Effective Logic Density
With 200,000 system gates, the XC2S200-6FGG1381C provides enough “real estate” to implement complex microcontrollers, DSP algorithms, and custom logic gates while maintaining a low price point per unit.
Detailed Pinout and Packaging Information
The “FGG1381” designation refers to the Fine-pitch Ball Grid Array (FBGA) packaging. This lead-free (RoHS compliant) package is designed for high-density PCB layouts where space is at a premium but high I/O counts are required.
Package Specifications
| Feature |
Details |
| Package Type |
Fine-pitch BGA (FGG) |
| Pin Count |
456 (Standard) / 1381 (Specific Variant) |
| Speed Grade |
-6 (High Performance) |
| Temperature Range |
0°C to 85°C (Commercial) |
Common Applications for the XC2S200 Series
The versatility of the XC2S200-6FGG1381C allows it to be utilized across various sectors:
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Industrial Control Systems: Used in PLC modules and motor control logic where real-time processing is essential.
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Telecommunications: Ideal for bridge logic between different data protocols and high-speed switching.
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Consumer Electronics: Employed in digital video processing and legacy gaming hardware.
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Prototyping: Often used as a learning platform or for proof-of-concept designs due to its extensive documentation and stable toolchain support.
Final Thoughts on the XC2S200-6FGG1381C
The Xilinx XC2S200-6FGG1381C continues to be a reliable choice for engineers looking for a stable, well-supported FPGA. Whether you are maintaining a legacy system or designing a cost-sensitive new product, the Spartan-II architecture delivers the reliability and performance Xilinx is known for.
By utilizing this FPGA, you gain access to a mature ecosystem of development tools and IP cores, ensuring that your time-to-market is minimized while your design flexibility is maximized.
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Discover the technical specs and features of the Xilinx XC2S200-6FGG1381C Spartan-II FPGA. Learn about its 200k system gates, I/O flexibility, and industrial applications.
