DuPont Pyralux AP8535R: Engineer’s Complete Guide to 0.5 oz RA Copper / 3 mil PI Ultra-Low Profile Flex Circuits

There is a category of flex circuit design where every micron of thickness counts: medical wearables that sit against skin, NFC-enabled biosensors embedded in bandages, laser-patterned fPCBs for implant-adjacent diagnostics, and antenna flex circuits where total laminate mass is a hard constraint. DuPont Pyralux AP8535R — a double-sided, adhesiveless all-polyimide laminate with 0.5 oz (18 µm) rolled-annealed copper on both sides of a 3 mil (75 µm) polyimide core — is one of the thinnest double-sided flex constructions in the Pyralux AP family that still offers practical 3 mil dielectric isolation, controlled impedance capability, and the reliability credentials that demanding applications require.

Confirmed real-world use of AP8535R includes UV laser-patterned fPCBs for NFC biosensors, wireless body temperature monitors, and VA sensing devices — all applications where the laminate’s 18 µm/75 µm/18 µm copper/PI/copper stack is deliberately selected over thicker constructions because the total thickness directly affects wearability, conformability, and flex endurance. This guide breaks down exactly why that construction exists, what its full specification picture looks like, and how to design with it successfully.

Decoding the DuPont Pyralux AP8535R Part Number

DuPont’s Pyralux AP naming convention consistently encodes the laminate construction once you understand the segment logic. For AP8535R:

Code Segment	What It Encodes	AP8535R Value
AP	All-Polyimide, adhesiveless dielectric	Direct Cu-to-PI bond, no adhesive intermediate
8	Copper weight designator	0.5 oz/ft² (18 µm) copper
5	Product series designator	AP 0.5 oz family
3	Dielectric thickness designator	3 mil (75 µm) polyimide
5	Layer structure designator	Double-sided clad
R	Copper foil type	Rolled-Annealed (RA) copper

The “R” suffix is critical and non-negotiable for this construction’s primary application domains. AP8535E (electro-deposited copper) exists in the AP family but the RA variant’s laminar grain structure delivers the flex fatigue resistance that wearable, dynamic flex, and high-flex-cycle applications demand — the ED variant is not a substitute in designs where the circuit will be bent repeatedly or where fine-grain copper surface roughness matters for signal integrity.

DuPont Pyralux AP8535R Full Technical Specifications

The all-polyimide dielectric system is consistent across the full AP product family. All electrical property data applies to the AP8535R construction. The 0.5 oz (18 µm) copper weight defines the mechanical behaviour of the conductor layer, while the 3 mil core defines isolation performance and impedance design headroom.

Confirmed Construction Dimensions

Parameter	AP8535R Value
Top Copper Thickness	18 µm (0.5 oz/ft²), Rolled-Annealed
Polyimide Dielectric Thickness	75 µm (3.0 mil)
Bottom Copper Thickness	18 µm (0.5 oz/ft²), Rolled-Annealed
Total Laminate Core Thickness	~111 µm (before coverlay)
Construction Type	Double-sided, adhesiveless

Electrical Properties

Property	Value	Frequency	Test Method
Dielectric Constant (Dk)	3.4	1 MHz	IPC-TM-650 2.5.5.3
Dielectric Constant (Dk)	3.2	10 GHz	ASTM D2520
Loss Tangent (Df)	0.002	1 MHz	IPC-TM-650 2.5.5.3
Loss Tangent (Df)	0.003	10 GHz	ASTM D2520
Dielectric Strength	200 V/µm	—	ASTM D149
Theoretical Isolation Voltage (3 mil core)	~15,000 V	—	Calculated
Volume Resistivity	>10¹⁷ Ω·cm	—	IPC-TM-650 2.5.17
Surface Resistance	>10¹⁶ Ω	—	IPC-TM-650 2.5.17
Moisture & Insulation Resistance	>10¹¹ Ω	—	IPC-TM-650 2.6.3.2

Mechanical and Thermal Properties

Property	Value	Test Method
Peel Strength (as received)	>1.8 N/mm (10 lb/in)	IPC-TM-650 2.4.9
Peel Strength (after solder)	>1.8 N/mm (10 lb/in)	IPC-TM-650 2.4.9
Tensile Modulus	4.8 GPa	IPC-TM-650 2.4.19
Tensile Strength	345 MPa	IPC-TM-650 2.4.19
Elongation	50%	IPC-TM-650 2.4.19
Flexural Endurance	6,000 cycles (datasheet baseline)	IPC-TM-650 2.4.3
Glass Transition Temperature (Tg)	220°C	DuPont Method, TMA
CTE (XY, below Tg)	25 ppm/°C	IPC-TM-650 2.4.41
CTE (XY, above Tg)	30 ppm/°C	IPC-TM-650 2.4.41
Solder Float (288°C, 10 s)	Pass	IPC-TM-650 2.4.13
Moisture Absorption	0.8%	IPC-TM-650 2.6.2
Dimensional Stability (after etch)	±0.04 to ±0.08%	IPC-TM-650 2.2.4

Compliance and Certifications

Standard	Status
IPC-4204/11	Certified
UL 94	V-0 Flame Rating
UL File	E124294
RoHS	Compliant
ISO 9001:2015	Manufactured under certified QMS

Why 0.5 oz Copper and 3 mil Polyimide Is a Deliberate Engineering Choice

Pairing the thinnest practical double-sided copper weight in the AP family with the 3 mil core is not a cost-reduction move — it is a performance specification that solves a specific design problem. Here is the engineering rationale for each element of the AP8535R construction.

Ultra-Low Copper Mass for Maximum Flex Endurance

Thin copper (≤0.5 oz) reduces stress in flex areas, and this principle is central to why AP8535R exists. At 18 µm, the copper layer is exactly half the thickness of 1 oz (35 µm) constructions. In a flex circuit under bending, the strain on the copper conductor scales with copper thickness and distance from the neutral bending axis. Halving copper thickness reduces conductor strain significantly — which translates directly to longer flex fatigue life before copper cracking initiates. A flex PCB with reinforced copper traces using rolled-annealed copper can endure up to 200,000 bend cycles before failure, compared to 50,000 for standard electrodeposited copper. The AP8535R combines both advantages: 0.5 oz copper for reduced bending strain, and RA grain structure for maximum fatigue resistance at that thickness.

The 3 mil Core: The Practical Middle Ground for Double-Sided Thin Flex

The 3 mil (75 µm) polyimide core sits between the ultra-thin 1 mil core (used in chip-on-flex and single-signal-layer constructions like AP8515R) and the more mechanically robust 4–6 mil cores. For double-sided designs where both faces carry active circuit layers — traces, pads, via connections — the 3 mil core provides three things the 1 mil core cannot: enough dielectric thickness to image and etch fine signal traces on both sides without risk of dielectric perforation from through-holes, adequate isolation for the voltage levels in low-power signal circuits (theoretical ~15,000 V breakdown), and a practical layer of mechanical stiffness that makes the bare laminate handleable during fabrication without puckering or tearing during etching and coverlay application.

Total Stack Thickness: The Number That Matters for Wearables

Wearables typically use ultra-thin constructions of 0.05–0.15 mm to maximize comfort and bendability. The AP8535R core alone is approximately 111 µm (~0.11 mm) before coverlay, landing precisely in this range. With a standard 25 µm film polyimide coverlay on both sides, the finished two-layer flex circuit reaches approximately 161 µm (~0.16 mm) — thin enough for direct skin-contact wearable applications, NFC antenna substrate use, and the type of laser-patterned fPCB designs that appear in published biosensor research using this exact material.

Adhesiveless Construction: Why It Matters for Ultra-Thin Flex

In a 3-layer adhesive-based flex laminate, acrylic adhesive adds typically 10–20 µm per bondline. More importantly, the adhesive’s low Tg (80–120°C for most acrylic adhesives) becomes the weakest element in a stack that otherwise tolerates lead-free reflow profiles (peak ~260°C) reliably. The AP8535R’s adhesiveless all-polyimide construction eliminates this failure mode entirely — the copper-to-polyimide bond is direct, thermally stable to 220°C Tg, and maintains its peel strength of >1.8 N/mm even after solder float at 288°C. At 0.5 oz copper weight, the adhesive layers in a 3-layer equivalent construction would represent a proportionally larger fraction of total stack thickness than they would at 1 oz or 2 oz — another reason the adhesiveless AP8535R construction is preferable for ultra-thin work.

DuPont Pyralux AP8535R in the Full AP Family Context

Understanding where AP8535R fits in the AP product lineup helps designers confirm whether this construction is the right call or whether an adjacent construction better serves the design requirements.

AP Double-Sided Clad Family Comparison

Product Code	Cu (oz / µm)	Dielectric (mil / µm)	Total Core (approx.)	Best Fit
AP8515R	0.5 oz / 18 µm	1 mil / 25 µm	~61 µm	Ultra-thin CoF, single-signal-layer
AP8535R	0.5 oz / 18 µm	3 mil / 75 µm	~111 µm	Wearables, NFC flex, biosensors
AP9111R	1 oz / 35 µm	1 mil / 25 µm	~95 µm	High-density fine-pitch signal flex
AP9121R	1 oz / 35 µm	2 mil / 50 µm	~120 µm	Standard signal flex
AP9131R	1 oz / 35 µm	3 mil / 75 µm	~145 µm	Balanced signal/rigidity
AP9151R	1 oz / 35 µm	5 mil / 125 µm	~195 µm	High-frequency controlled impedance
AP9222R	2 oz / 70 µm	2 mil / 50 µm	~190 µm	Heavy current power flex

The AP8535R occupies the unique position of being the only standard double-sided AP construction that combines 0.5 oz copper with a 3 mil core. The AP8515R (0.5 oz / 1 mil) is thinner still but the 1 mil dielectric makes reliable double-sided fabrication — drilling, plated-through-hole, fine-line imaging on both sides — significantly more challenging and yield-sensitive. For most practical ultra-thin double-sided flex designs, the AP8535R’s 3 mil core is the right starting point.

Real-World Applications for DuPont Pyralux AP8535R

The documented use of AP8535R in published research and commercial products reveals a coherent cluster of applications united by a common requirement: maximum conformability and minimal thickness in a double-sided, electrically reliable flex circuit.

NFC and Wireless Biosensors

A LPKF U4 UV laser patterned a commercial substrate (DuPont Pyralux AP8535R) to form a flexible printed circuit board for wireless, battery-free electronics. This is the application domain where AP8535R has accumulated the most published documentation: NFC-enabled biosensors where the fPCB substrate must be thin enough to embed in a bandage, patch, or skin-contact housing while carrying both the NFC antenna traces and the low-power signal processing circuitry on a double-sided construction. The combination of 0.5 oz copper (good enough for NFC antenna Q-factor without the skin-effect losses of ultra-thin electroplated coils) and 3 mil polyimide (robust enough for reliable through-hole connections between antenna and component layers) is well matched to this application.

Medical Wearable Patches and Body Temperature Sensors

Initial prototypes and proof-of-concept devices involved use of a laser cutter to pattern a double-sided copper-clad laminate (Pyralux AP8535R, DuPont) and standard microsoldering techniques. Electronic components included an NFC SoC, an instrumentation amplifier, resistors, and capacitors, each placed using reflow soldering with low-temperature solder paste. For skin-worn medical patches — continuous glucose monitors, wound healing sensors, cardiac rhythm patches — the AP8535R’s thin, conformable construction directly influences patient comfort and device wearability. Using thinner copper layers (e.g., 0.5 oz instead of 1 oz) when high current isn’t required can lower material costs and environmental impact. In these low-power signal applications, the 0.5 oz copper carries all the signal current needed without excess conductor mass.

VA (Vibro-Acoustic) Sensing Devices

A laminate composite film of copper/polyimide/copper (18 µm/75 µm/18 µm, Pyralux AP8535R, DuPont Inc.) served as the substrate for the VA sensing device. An ultraviolet laser processed the film by ablating the copper layers, which patterned the traces, bond pads, and unplated vias. A structural copper divider was integrated within the centre of the actuator to account for overlapping scan fields. This application demonstrates AP8535R’s compatibility with UV laser direct ablation processing — a key manufacturing pathway for research prototyping and small-volume production of novel flex sensor devices where traditional photolithography infrastructure isn’t practical.

Foldable Consumer Electronics Flex Interconnects

Careful mechanical FEA modelling is essential — too-tight bend radii can fracture copper traces; repeated flex cycles demand rolled-annealed copper instead of electrodeposited. For foldable device interconnects — the flex cables that bridge folding phone halves, the antenna flex circuits in wireless earbuds, and the sensor ribbon cables in compact IoT devices — the AP8535R offers more flex endurance at tighter bend radii than 1 oz constructions, with the double-sided capability that single-sided constructions cannot provide.

Aerospace and Lightweight UAV Antenna Flex

The all-polyimide construction’s low outgassing, wide temperature range (−200°C to 260°C operating), and UV resistance make AP8535R a viable substrate for antenna flex circuits in lightweight UAV and small satellite payloads where gram-level weight savings and conformability to curved aerodynamic surfaces are design requirements. The 0.5 oz copper supports microstrip antenna traces at appropriate widths for UHF and low-GHz frequencies on the 3 mil Dk 3.4 dielectric.

Design Rules and Fabrication Considerations for AP8535R

Ultra-thin, light-copper flex has distinct fabrication requirements compared to heavier constructions. Engineers who have worked primarily with 1 oz flex will encounter some differences that are worth understanding before releasing artwork.

Trace Width and Current Capacity at 0.5 oz

A 0.5 oz copper layer on a thin flex PCB might handle only 1–2 amperes before overheating. This is the most important practical constraint of the AP8535R’s copper weight. For low-power sensor circuits, NFC antenna loops, and signal interconnects at µA to low-mA levels, 18 µm copper is more than adequate. For any trace expected to carry continuous current above 1.5–2 A, switch to 1 oz or 2 oz copper — AP8535R is a signal and low-power flex material, not a power flex material.

As a practical trace width guide at 0.5 oz (18 µm) copper for a 20°C temperature rise at 25°C ambient:

Trace Width	Max Continuous Current (External Layer, 0.5 oz)
0.5 mm (20 mil)	~0.8 A
1.0 mm (39 mil)	~1.3 A
2.0 mm (79 mil)	~2.0 A
3.0 mm (118 mil)	~2.7 A
5.0 mm (197 mil)	~3.8 A

Minimum Trace and Space at 0.5 oz

The thinner copper weight of AP8535R is actually a fabrication advantage for fine-pitch signal routing. At 18 µm copper, undercut during etching is proportionally much less than at 35 µm or 70 µm. Most qualified flex fabricators can reliably achieve 3 mil (75 µm) trace/space at 0.5 oz — and some advanced fine-pitch shops working with UV laser direct ablation (as documented in the biosensor literature) can pattern down to 50 µm line/space on AP8535R without wet etching at all. This makes AP8535R a natural choice for high-density signal routing in compact wearable designs where trace density matters more than current capacity.

Bend Radius: The Advantage of Thin Copper

The AP8535R’s 18 µm copper contributes substantially less to bending stiffness than 35 µm or 70 µm copper. Total laminate core thickness before coverlay is approximately 111 µm. With a 25 µm coverlay on both sides, total finished thickness is approximately 161 µm. Applying IPC-2223 dynamic flex guidelines:

Bend Type	IPC-2223 Multiplier	AP8535R Min. Bend Radius
Static (bend-to-install)	6× total thickness	~1.0 mm
Dynamic (repeated flex)	10× total thickness	~1.6 mm
High-cycle dynamic (>10k cycles)	15× total thickness	~2.4 mm

These are among the tightest achievable bend radii in the double-sided AP product family — a direct consequence of the 0.5 oz copper weight and thin total stack profile.

UV Laser Direct Ablation: The Preferred Processing Route for Research and Prototyping

Traditional photolithography, wet etching, and drill-and-plate processing work perfectly well with AP8535R in production environments. But the confirmed use of UV laser direct ablation (LPKF ProtoLaser U4 and similar systems) in academic and R&D contexts is significant. UV laser ablation at 355 nm selectively removes copper from the laminate surface by thermal and photochemical mechanisms, leaving the polyimide dielectric intact. On 18 µm copper, the laser processes significantly faster and with more precise edge definition than on 35 µm copper, making AP8535R specifically well-suited to laser-direct prototyping workflows. Via formation via laser ablation (rather than mechanical drilling and plating) is also documented in the biosensor literature for connecting the two copper layers.

Pre-Assembly Moisture Bake-Out

As polyimide is hygroscopic, baking before soldering is essential. A minimum 4-hour bake at 120°C followed by assembly within 8 hours prevents moisture-induced delamination during reflow. For AP8535R with its 0.5 oz thin copper, this bake-out is particularly important — thin copper is less mechanically resistant to the gas pressure from any entrapped moisture during solder reflow, and blistering on a thin laminate is harder to rework than on thicker constructions.

Stiffener Use in Component Zones

At 161 µm total finished thickness, AP8535R assemblies require stiffeners under connector housings, component pads on BGA or QFN footprints, and any location where a component body creates a peel or shear load on the flex surface. Polyimide film stiffeners (0.05–0.125 mm, bonded with pressure-sensitive adhesive or acrylic bondply) are standard practice. Add stiffeners in high-stress areas to prevent cracking without increasing overall thickness.

AP8535R vs. Competing Ultra-Thin Flex Laminates

Parameter	AP8535R (DuPont)	Shengyi SHE-FLEX 0.5 oz	3-Layer Adhesive Flex (0.5 oz)	Polyester (PET) Flex
Cu Weight	0.5 oz / 18 µm	0.5 oz / 18 µm	0.5 oz / 18 µm	0.5 oz / 18 µm
Dielectric Core	3 mil / 75 µm PI	1–4 mil PI	1–2 mil PI + adhesive	1–2 mil PET
Adhesiveless	Yes	Yes	No	No
Dk @ 1 MHz	3.4	~3.4–3.5	~3.5–4.2	~3.2–3.5
Tg	220°C	~220°C	80–120°C (adhesive)	~80°C
Lead-Free Reflow	Yes (passes 288°C float)	Yes	Marginal	No
IPC-4204/11	Certified	Varies	N/A	N/A
UV Laser Ablation Compatibility	Confirmed (published)	Unknown	Limited	Limited
ISO 9001:2015 QMS	Yes (full lot traceability)	Factory-dependent	Factory-dependent	N/A

The polyester (PET) comparison is worth calling out explicitly: PET flex is cheap and widely used in low-cost consumer products, but its 80°C Tg rules it out for any application involving lead-free reflow soldering, and its moisture resistance is lower than polyimide. For any application where components will be soldered, AP8535R or an equivalent PI-based laminate is the correct choice — PET simply cannot withstand the thermal process.

Sourcing DuPont Pyralux AP8535R

AP8535R is available through DuPont’s authorized laminate distribution network and through qualified flex PCB fabricators who stock the material. DuPont supplies Pyralux AP Double-side Clad in standard sheet formats of 24×36 in (610×914 mm), 24×18 in (610×457 mm), and 12×18 in (305×457 mm). Custom sizes are available on special order. For UV laser prototyping workflows, some academic and R&D institutions purchase sheet stock directly through DuPont or distribution, cutting panels to size for the laser ablation system.

DuPont PCB  is a substrate supplier worth evaluating alongside DuPont’s Pyralux AP offerings for polyimide-based ultra-thin flex and rigid-flex combinations, particularly for production programs requiring supply chain diversification.

Useful Resources for Ultra-Thin Flex Circuit Designers

Resource	Description	URL
DuPont Pyralux AP Official Product Page	Datasheets, construction options, sample requests	https://www.dupont.com/electronics-industrial/pyralux-ap.html
DuPont Pyralux Laminate Product Selector	Find product codes for custom AP constructions	https://pyralux.dupont.com
DuPont Pyralux AP Current Datasheet (PDF)	Full TDS with all standard construction options	https://insulectro.com/wp-content/uploads/2021/09/EI-10124-Pyralux-AP-Data-Sheet.pdf
DuPont Pyralux AP-AC Single-Sided Clad Datasheet	Reference for single-sided 0.5 oz constructions	https://cdn-shop.adafruit.com/datasheets/P1894_datasheet.pdf
IPC-2223 Flexible PCB Design Standard	Bend radius, design rules, and DFM guidelines	https://www.ipc.org
IPC-4204/11 Adhesiveless Laminate Specification	Qualification standard for Pyralux AP materials	https://www.ipc.org
IPC-6013 Flex PCB Performance Standard	Qualification and acceptance for flex and rigid-flex	https://www.ipc.org
IPC-TM-650 Test Method Database	All test methods cited in AP8535R datasheets	https://www.ipc.org/TM
LPKF ProtoLaser U4 Product Page	UV laser patterning system documented for AP8535R use	https://www.lpkf.com/en/industries/printed-circuit-board-technology/products/protolaser-u4
Pubcompare AP8535R Research Listing	Published academic use cases for AP8535R substrate	https://www.pubcompare.ai/product/JyPhCZIBPBHhf-iFqz2b/

Frequently Asked Questions About DuPont Pyralux AP8535R

1. What is the confirmed construction of DuPont Pyralux AP8535R?

AP8535R is a double-sided, adhesiveless all-polyimide copper-clad laminate confirmed at 18 µm (0.5 oz/ft²) rolled-annealed copper / 75 µm (3 mil) polyimide dielectric / 18 µm (0.5 oz/ft²) rolled-annealed copper. This construction has been independently confirmed in published biosensor and wearable device research where the laminate dimensions 18 µm/75 µm/18 µm are explicitly documented. Total core thickness before coverlay addition is approximately 111 µm.

2. Is AP8535R suitable for UV laser direct ablation processing?

Yes, and this is one of its most documented manufacturing pathways in academic and R&D contexts. At 18 µm copper, UV laser systems (355 nm pulsed, such as the LPKF ProtoLaser U4) can ablate the copper layer efficiently while leaving the 75 µm polyimide dielectric intact, creating clean trace edges, bond pads, and via openings without wet etching. Published research specifically using AP8535R includes UV laser patterning for NFC biosensors, wireless temperature monitors, and VA sensing devices. For production volumes, conventional photolithography and chemical etching are equally compatible with the material.

3. What are the limitations of 0.5 oz copper in AP8535R for signal design?

The primary limitation is current-carrying capacity: 0.5 oz (18 µm) copper can handle approximately 0.8–2 A on external traces depending on trace width and allowable temperature rise. For low-power signal circuits, NFC antennas, sensor interfaces, and low-current logic interconnects, this is entirely adequate. The second consideration is that 0.5 oz copper has higher sheet resistance than 1 oz copper (approximately 0.96 mΩ/square vs. 0.49 mΩ/square), which can affect DC resistance budgets on long thin traces. For short signal traces and antenna structures in wearable designs, neither limitation is typically the binding constraint.

4. How does AP8535R compare to AP9121R (1 oz / 2 mil) for wearable applications?

The comparison is instructive. AP9121R (1 oz / 2 mil) has a total core thickness of approximately 120 µm — actually slightly thicker than AP8535R’s 111 µm core — but with 35 µm copper instead of 18 µm. The AP8535R’s thinner copper results in significantly better flex fatigue performance and less bending stiffness, at the cost of lower current capacity and higher conductor resistance. For wearable designs where dynamic flex cycles are a primary constraint and current is below 1–2 A, AP8535R is the better choice. For designs that prioritize current-carrying capacity, or where trace resistance budgets are tighter, AP9121R is more appropriate. In both cases, the adhesiveless all-polyimide construction delivers the same thermal robustness.

5. What surface finishes are compatible with AP8535R for medical wearable applications?

ENIG (electroless nickel immersion gold) and ENEPIG (electroless nickel electroless palladium immersion gold) are the preferred surface finishes for AP8535R-based wearable and medical designs. Both provide flat, oxidation-resistant surfaces compatible with 0201 passive components and fine-pitch IC packages, and neither introduces nickel directly at the surface in ENEPIG — an advantage for skin-contact applications where nickel allergenicity is a design concern. Immersion silver (ImAg) is an acceptable lower-cost alternative for assemblies not in direct skin contact. OSP (organic solderability preservative) is compatible with the material but has a shorter shelf life and is less suitable for multi-reflow assemblies or high-reliability applications.

Summary

DuPont Pyralux AP8535R sits at a specific and well-defined point in the flex materials landscape: a double-sided, adhesiveless all-polyimide laminate with 18 µm RA copper on both faces of a 75 µm polyimide core, yielding a total laminate core thickness of approximately 111 µm that falls squarely in the ultra-thin double-sided flex category. Its documented use in UV laser-patterned biosensors, NFC wearable devices, and VA sensing applications reflects a design community that has found the 0.5 oz / 3 mil combination to be the reliable, thermally robust, fine-pitch-capable substrate for the wearable medical and advanced sensor domains. Its adhesiveless construction, full IPC-4204/11 certification, 220°C Tg, and ISO 9001:2015 manufacturing pedigree mean it delivers that ultra-thin profile without compromising on the material quality that serious applications require.

For samples and engineering support, contact DuPont Electronics at pyralux.dupont.com or engage a qualified flex fabricator with experience in 0.5 oz fine-pitch construction and UV laser patterning capability.