Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1361C: High-Performance Spartan-II FPGA from Xilinx

Product Details

The XC2S200-6FGG1361C is a powerful FPGA (Field Programmable Gate Array) from Xilinx’s Spartan™-II family, designed to offer a balance of performance, low power consumption, and cost-effectiveness for a wide range of digital logic applications.

Built with advanced silicon technology, this chip enables flexible hardware designs and rapid prototyping, making it ideal for embedded systems, custom computing, and signal processing tasks that require reconfigurable logic.


Key Features of XC2S200-6FGG1361C FPGA

Feature Description
FPGA Family Spartan™-II
Logic Cells 200,000 usable system gates
Speed Grade -6 (fast operation speed)
Package Type FGG136 (Fine-pitch Ball Grid Array)
Package Size 136 pins
Operating Voltage Core: 1.8V; I/O: 3.3V
Configurable Logic Blocks 256 CLBs with Look-Up Tables (LUTs)
Block RAM 128 Kbits (distributed RAM blocks)
DSP Slices None (primarily logic and routing resources)
I/O Pins 104 I/O pins
Power Consumption Low power design for embedded applications
Development Support Supported by Xilinx ISE Design Suite

Why Choose the XC2S200-6FGG1361C for Your FPGA Project?

Versatile and Cost-Effective

  • Optimized for cost-sensitive designs: Spartan-II family targets applications needing reliable FPGA resources without premium pricing.

  • Suitable for various applications: Embedded control, digital signal processing, communications, and prototyping.

High-Speed Performance

  • The -6 speed grade ensures the device meets performance requirements for timing-critical circuits.

  • Efficient clock management and routing to enable reliable synchronous designs.

Robust I/O Capabilities

  • Comprehensive I/O set including 3.3V compatible pins.

  • Configurable I/O standards to interface with a wide range of peripherals and external components.


XC2S200-6FGG1361C Technical Specifications Table

Specification Details
Technology Node 0.15 μm CMOS
Number of Logic Cells Approximately 200,000 system gates
Configurable Logic Blocks 256
RAM 8 blocks totaling 128 Kbits
Package Fine-pitch BGA, 136 balls
Operating Temperature 0°C to 85°C (commercial grade)
Speed Grade -6
Configuration Method SRAM-based, JTAG, Byte-wide Configuration

Compatible Development Tools and Resources

  • Fully supported by Xilinx ISE Design Suite, facilitating HDL design (VHDL/Verilog), simulation, synthesis, and device programming.

  • Extensive reference designs and IP cores exist for Spartan-II devices.

  • Integrated with common FPGA toolchains for seamless workflows.


Applications of XC2S200-6FGG1361C FPGA

  • Industrial control systems

  • Consumer electronics prototyping

  • Digital signal processing (low to medium complexity)

  • Communication interfaces and protocols

  • Custom embedded logic acceleration

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.