Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1340C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1340C is a cornerstone of the Xilinx Spartan-II family, designed to provide a high-performance, cost-effective solution for programmable logic needs. As digital systems demand more flexibility and higher speeds, this Field Programmable Gate Array (FPGA) offers a perfect balance of system gates, on-chip RAM, and versatile I/O options.

By leveraging the Xilinx FPGA architecture, developers can achieve high-volume production efficiency without sacrificing the technical capabilities required for modern telecommunications, industrial control, and consumer electronics.

Key Features of the XC2S200-6FGG1340C

The XC2S200-6FGG1340C is engineered to deliver 200,000 system gates, making it suitable for complex logic integration. Below are the primary features that set this component apart:

  • Advanced Architecture: Built on a 0.22-micron 6-layer metal process.

  • Low Power Consumption: Operates at a core voltage of 2.5V, reducing thermal overhead.

  • Flexible I/O Standards: Supports multiple signaling standards including LVTTL, LVCMOS2, PCI, and GTL.

  • Abundant Memory Resources: Features dedicated block RAM and distributed RAM for efficient data buffering.

  • Reliable Speed Grade: The “-6” designation ensures optimal timing for high-speed synchronous designs.


Technical Specifications Table

To better understand the capabilities of the XC2S200-6FGG1340C, the following table outlines its core technical parameters:

Parameter Specification Details
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Total CLBs 1,176
Block RAM Bits 56,320
Distributed RAM Bits 75,264
Max User I/O Up to 284 (Package Dependent)
Operating Voltage 2.5V (Internal), 3.3V (I/O)

Understanding the Spartan-II Architecture

The architecture of the XC2S200-6FGG1340C consists of a flexible Configurable Logic Block (CLB) array surrounded by programmable Input/Output Blocks (IOBs). This structure allows for seamless routing and high logic density.

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG1340C contains four cells, known as slices. These slices are the fundamental building blocks for creating logic functions, including look-up tables (LUTs) and flip-flops. Because the slices are highly interconnected, designers can implement complex arithmetic and logic operations with minimal latency.

Power Management and Efficiency

One of the standout benefits of the XC2S200 series is its low power consumption. By utilizing a 2.5V core voltage, the XC2S200-6FGG1340C minimizes power dissipation. This makes it an ideal choice for compact enclosures where heat management is a critical design constraint.


Typical Applications for XC2S200-6FGG1340C

Due to its versatility and cost-efficiency, this FPGA is utilized across various industries. Common applications include:

  1. Industrial Automation: Used for motor control, sensor interfacing, and PLC communication.

  2. Communication Systems: Ideal for bridge logic, protocol conversion, and data encryption.

  3. Consumer Electronics: High-speed data processing for digital displays and imaging devices.

  4. Legacy System Support: Serving as a reliable replacement or upgrade for older PLD systems.

Package and Thermal Information

Feature Details
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 456 (Standard for this series)
Temperature Range 0°C to +85°C (Commercial)
Lead-Free Status RoHS Compliant (FGG Designation)

Why Choose the XC2S200-6FGG1340C for Your Project?

Choosing the right FPGA involves balancing performance, cost, and ease of integration. The XC2S200-6FGG1340C excels because it provides a mature, stable platform supported by extensive Xilinx design tools.

Whether you are prototyping a new digital signal processing (DSP) algorithm or looking for a cost-effective logic solution for mass production, this Spartan-II device offers the reliability your engineering team requires. Its compatibility with various I/O standards ensures that it can interface with almost any modern peripheral, from high-speed memory to legacy PCI buses.

Summary of Benefits

  • High Gate Count: 200k gates allow for significant logic consolidation.

  • Cost-Effectiveness: One of the best price-to-performance ratios in the industry.

  • Scalability: Part of a broad family that allows for easy migration if design requirements change.

For engineers seeking a dependable and high-performing programmable logic device, the XC2S200-6FGG1340C remains a top-tier choice in the Spartan-II lineup.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.