The XC2S200-6FGG1332C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-grade applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1332-ball Fine-Pitch BGA package — making it an ideal choice for engineers seeking a powerful and flexible programmable logic solution. Whether you are designing embedded systems, communications hardware, or industrial control equipment, the XC2S200-6FGG1332C offers the performance, density, and I/O flexibility your project demands.

What Is the XC2S200-6FGG1332C?

The XC2S200-6FGG1332C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm CMOS process technology. The part number breaks down as follows:

This device is a superior, field-upgradeable alternative to mask-programmed ASICs, eliminating high NRE costs and long development cycles while offering in-field design updates that traditional ASICs cannot match.

XC2S200-6FGG1332C Key Features

• 200,000 System Gates (logic and RAM combined)
• 5,292 Configurable Logic Cells in a 28 × 42 CLB array
• 1,176 total Configurable Logic Blocks (CLBs)
• 284 Maximum User I/O pins
• 75,264 bits of Distributed RAM
• 56K bits of Block RAM (seven 8K-bit modules)
• Four Delay-Locked Loops (DLLs) for precision clock management
• 2.5V core voltage with 3.3V I/O compatibility
• 0.18µm process technology
• -6 speed grade — fastest available for commercial temperature range
• FGG1332 Pb-free package — Fine-Pitch Ball Grid Array, 1332 balls
• Commercial temperature range: 0°C to +85°C
• JTAG Boundary Scan (IEEE 1149.1 compliant)
• Multiple configuration modes: Master Serial, Slave Serial, Slave Parallel, Boundary-Scan

XC2S200-6FGG1332C Detailed Technical Specifications

Logic Resources

Electrical & Performance Characteristics

Package & Environmental Specifications

XC2S200-6FGG1332C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1332C features 1,176 CLBs in a 28×42 array. Each CLB contains four logic cells — each with two 4-input Look-Up Tables (LUTs), carry logic, and flip-flops — supporting both combinational and sequential logic for complex digital designs.

Block RAM

Seven independent 8K-bit Block RAM modules provide 56K bits of on-chip synchronous dual-port memory, ideal for FIFOs, lookup tables, and data buffers in embedded applications.

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — enable zero-delay clock buffering, clock multiplication, clock division, and phase shifting. They are critical in high-speed communications designs for aligning internal clocks with external signals.

Supported I/O Standards

Configuration Modes

XC2S200-6FGG1332C vs. Other Spartan-II Family Devices

The XC2S200 is the largest device in the Spartan-II family, offering the highest gate count, logic cells, I/O capacity, and memory resources.

Applications of the XC2S200-6FGG1332C

Embedded Systems & SoC Designs

With 200K gates and abundant block RAM, the XC2S200-6FGG1332C supports soft-core processors such as PicoBlaze, enabling full SoC solutions that reduce BOM cost and time-to-market.

Communications & Networking

Multiple DLLs and high-speed I/O standards make this Xilinx FPGA well-suited for serial communications, protocol bridging, and network interface cards.

Industrial Automation & Control

Motor control, PLC interfaces, and safety-critical logic all benefit from the device’s deterministic behavior and JTAG in-system testability.

Test & Measurement Equipment

With 284 user I/Os and flexible configuration, the XC2S200-6FGG1332C is a popular choice for data acquisition systems and automated test equipment (ATE).

Consumer Electronics

Cost-optimized and power-efficient, it is used in set-top boxes, digital cameras, and printers — high-volume applications where programmable ASIC-replacement cuts time-to-market.

Development Tools for XC2S200-6FGG1332C

Ordering Information: Part Number Decoder

XC2S200 - 6 - FGG - 1332 - C
   |       |    |      |    |
   |       |    |      |    └── Temperature: C = Commercial (0°C to +85°C)
   |       |    |      └─────── Pin Count: 1332 balls
   |       |    └────────────── Package: FGG = Fine-Pitch BGA, Pb-free
   |       └─────────────────── Speed Grade: -6 (fastest, Commercial only)
   └─────────────────────────── Device: Spartan-II, 200K gates

For a complete range of Xilinx programmable logic devices, explore our dedicated Xilinx FPGA product catalog.

XC2S200-6FGG1332C Frequently Asked Questions

Q: What is the maximum operating frequency of the XC2S200-6FGG1332C? A: Up to 263 MHz. The -6 speed grade is the fastest commercially available speed grade for this device family.

Q: Is the XC2S200-6FGG1332C RoHS compliant? A: Yes. The “G” in the FGG package designator confirms a Pb-free, RoHS-compliant package.

Q: What temperature range does the XC2S200-6FGG1332C support? A: Commercial range: 0°C to +85°C. The -6 speed grade is exclusively available in Commercial range and is not offered for Industrial temperature operation.

Q: Does the XC2S200-6FGG1332C retain its configuration after power-off? A: No. It uses volatile SRAM-based configuration memory. An external PROM (e.g., Xilinx XCF series) is required to reload the bitstream at power-up.

Q: What HDL languages are supported? A: Both VHDL and Verilog are fully supported through the Xilinx ISE Design Suite. Schematic-based entry is also available.

Summary

The XC2S200-6FGG1332C is a proven, high-density Xilinx Spartan-II FPGA delivering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and 56K bits of block RAM in a Pb-free 1332-ball Fine-Pitch BGA package. Its -6 speed grade ensures maximum performance within the Commercial temperature range, making it an excellent choice for communications, embedded processing, industrial automation, and test equipment. As a fully reprogrammable, cost-effective ASIC-replacement solution, the XC2S200-6FGG1332C remains a trusted platform for engineers worldwide.

Specifications sourced from the Xilinx Spartan-II FPGA Family Data Sheet (DS001). Always refer to official AMD/Xilinx documentation for the most current information.

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