Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1322C Xilinx Spartan-II FPGA: Technical Overview and Specifications

Product Details

The XC2S200-6FGG1322C is a prominent member of the Xilinx Spartan-II family, designed to provide a high-performance, cost-effective solution for high-volume consumer electronics and industrial applications. Built on a 0.22-micron CMOS process, this Field Programmable Gate Array (FPGA) offers a perfect balance between density and speed, making it a go-to choice for legacy system maintenance and cost-sensitive digital designs.

In this guide, we will dive into the technical specifications, key features, and application areas of the XC2S200-6FGG1322C to help you understand why this Xilinx FPGA remains a reliable component in the semiconductor market.


Key Features of the XC2S200-6FGG1322C FPGA

The Spartan-II series was engineered to bridge the gap between expensive high-end FPGAs and low-capability CPLDs. The XC2S200-6FGG1322C specifically provides a robust architecture that supports complex logic functions and high-speed I/O operations.

1. High Logic Density and Memory

With 200,000 system gates, the XC2S200 provides ample space for complex state machines, digital signal processing (DSP), and custom peripheral controllers. It features dedicated block RAM to handle data buffering without consuming logic cells.

2. Flexible I/O Standards

The device supports multiple I/O standards, including LVTTL, LVCMOS2, PCI, and more. This versatility allows it to interface seamlessly with various external components and legacy hardware.

3. Optimized Speed Grade

The “-6” in the part number indicates the speed grade. This ensures the device can handle demanding timing requirements for mid-range frequency applications, providing a reliable clocking infrastructure through its four dedicated Delay-Locked Loops (DLLs).


Technical Specifications Table

To better understand the capabilities of the XC2S200-6FGG1322C, refer to the detailed technical parameters below:

Feature Specification
Part Number XC2S200-6FGG1322C
Logic Cells 5,292
System Gates 200,000
Block RAM Bits 57,344
Maximum User I/O Up to 284 (Package Dependent)
Core Voltage 2.5V
Speed Grade -6
Operating Temperature 0°C ~ 85°C (Commercial)

Detailed Architecture Analysis

Spartan-II Logic Cell Structure

Each logic cell in the XC2S200-6FGG1322C consists of a 4-input Look-Up Table (LUT), carry logic, and a storage element. These cells are organized into Configurable Logic Blocks (CLBs), which are the building blocks of the FPGA’s functional logic.

Power Management and Efficiency

While modern FPGAs operate at lower voltages, the 2.5V core of the Spartan-II series was a revolutionary step in reducing power consumption compared to the 5V and 3.3V standards of its era. This makes the XC2S200-6FGG1322C highly efficient for older systems that require stable thermal performance.

Package and Thermal Characteristics

The “FGG1322C” suffix denotes the Fine-pitch Ball Grid Array (FBGA) packaging. This packaging style is designed to maximize pin density while maintaining a small physical footprint, which is critical for compact PCB layouts.

Package Attribute Value
Package Type FBGA (Fine-pitch BGA)
Pin Count High-density configuration
Material Lead-Free (RoHS Compliant)
Mounting Type Surface Mount (SMD/SMT)

Common Applications for XC2S200-6FGG1322C

Due to its reliability and specific gate count, the XC2S200-6FGG1322C is frequently utilized in the following sectors:

  • Industrial Automation: Used in programmable logic controllers (PLCs) and motor control systems.

  • Legacy System Support: Ideal for replacing discontinued components in long-lifecycle aerospace or telecommunications hardware.

  • Consumer Electronics: Employed in digital set-top boxes and home networking equipment.

  • Data Communications: Acts as a bridge between different communication protocols or as an interface for PCI-based systems.


Why Choose Xilinx Spartan-II Technology?

Choosing the XC2S200-6FGG1322C means investing in a proven architecture. Xilinx’s robust development environment (such as the ISE Design Suite) provides comprehensive tools for synthesis, placement, and routing, ensuring that your design hits the market with minimal errors.

Benefits of Using XC2S200-6FGG1322C:

  1. Cost-Effective: Lower price point per gate compared to newer high-end Virtex families.

  2. Proven Reliability: Millions of units are currently in operation worldwide across various industries.

  3. Ease of Integration: Simplified power requirements and standard I/O pins make PCB design straightforward.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.