Doosan Electronics PCB Materials: Complete Part Number Guide (2026)

If you’ve spent any serious time designing high-speed PCBs or sourcing laminate for volume production, you’ve almost certainly come across Doosan PCB materials on a spec sheet or a distributor’s quote. Doosan Corporation Electro-Materials — officially established in South Korea in 1974 — has grown from a regional copper clad laminate (CCL) maker into one of the top global suppliers that engineers working on 5G base stations, automotive radar modules, AI server backplanes, and foldable smartphones genuinely rely on. This guide is written from the engineering trenches: practical, spec-driven, and organized around how most engineers actually search for laminate materials — by application first, part number second.

Whether you’re qualifying a new material for a 77 GHz ADAS radar board or just trying to figure out which Doosan FR-4 variant fits your multilayer server design, this part number guide covers the full lineup with the technical depth you need to make a real decision.

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What Is Doosan Corporation Electro-Materials?

Doosan Corporation Electro-Materials (often abbreviated DEM or marketed under the Doosan Electro-Materials brand) is the electronics materials division of the broader Doosan Group — a conglomerate founded in 1896 that today spans clean energy, smart machines, and advanced materials. The electro-materials business unit focuses exclusively on core PCB substrate materials and related electronic packaging materials.

Their manufacturing footprint spans South Korea (primary plants in Iksan, Jeungpyeong, and Gimcheon), China, and Europe, with a combined output exceeding 15 million square meters of laminate annually. Revenue reached 950.4 billion Korean won in 2022, and the company now supplies over 137 companies across 21 countries. For engineers worried about supply chain stability — a very reasonable concern given recent industry disruptions — those are meaningful numbers.

What genuinely differentiates Doosan PCB materials from many competitors is their vertical integration model. Doosan controls the resin synthesis, glass fabric management, and laminate production in-house rather than purchasing resins from third parties. In practice, this gives engineers more consistent dielectric properties batch-to-batch, which matters enormously when you’re trying to maintain impedance tolerance across a high-volume production run. Their R&D investment runs at roughly 5% of annual revenue, which has produced real innovations in low-loss chemistry and halogen-free formulations over the last decade.

At CES 2026, the company showcased its next-generation high-speed CCL solutions specifically for AI accelerators in data centers, signaling where their development roadmap is pointed: ultra-high-speed signal integrity for the AI infrastructure buildout.

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Doosan PCB Materials Product Family Overview

Before diving into individual part numbers, it helps to understand the major product categories Doosan organizes their CCL lineup around. Each family addresses a distinct set of engineering requirements, and part numbers are structured accordingly.

CCL (Copper Clad Laminate) — Rigid Materials

This is Doosan’s core business and the category with the most part number depth. The rigid CCL lineup spans from standard FR-4 all the way to ultra-low-loss materials that compete with Panasonic Megtron6 and Isola Tachyon 100G.

FCCL (Flexible Copper Clad Laminate)

The FCCL product line is built on polyimide (PI) film substrates and targets flexible and rigid-flex PCB applications. Doosan’s FCCL has become increasingly important as foldable smartphones have driven demand for materials that survive over one million fold cycles.

IC Package Substrate Materials

Ultra-thin core materials (25–50 µm) designed for the demanding requirements of flip-chip package substrates — fine-pitch, low CTE, excellent warpage control.

Prepreg (PP)

Supplied as a companion to the rigid CCL product line and required for multilayer stack-ups. Part numbers typically mirror the corresponding core material designations.

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Complete Doosan PCB Materials Part Number Guide

Standard and Mid-Loss FR-4 Series

These materials cover the majority of general-purpose PCB applications — consumer electronics, industrial controls, standard server boards, and automotive body electronics where high-frequency performance is not the primary constraint.

Part Number	Loss Category	Tg (°C)	Df Range (at 1 GHz)	Key Application	IPC Equivalence
EM-285	Standard Loss	150	0.018–0.022	Consumer electronics, general purpose	IPC-4101 /26
EM-827	Standard Loss	150	0.015–0.020	Automotive, server, consumer	IPC-4101 /98, /99
EM-355(D)	Standard Loss	170	0.015–0.020	High-Tg general purpose	IPC-4101 /101
EM-370(5)	Standard Loss	170	0.015–0.020	High-Tg, lead-free compatible	IPC-4101 /101
EM-370(Z)	Mid Loss	170	0.010–0.015	High-layer-count boards, improved signal integrity	IPC-4101 /126
EM-370(D)	Mid Loss	170	0.010–0.015	Dense multilayer, halogen-free variant	IPC-4101 /126
EM-390	Mid Loss	170	0.010–0.014	Networking, enterprise computing	IPC-4101 /126
EM-828G	Mid Loss	170	0.010–0.013	High-speed digital, mid-range networking	IPC-4101 /126

Engineer’s Note: The EM-370 family is where a lot of engineers land when they’re moving off basic FR-4 but aren’t ready to pay the premium for ultra-low-loss laminates. The Tg of 170°C (DSC) and Td of 340°C are solid numbers for lead-free assembly without drama on the line. If you’re running 10+ layer boards with dense via fields, the EM-370(Z) variant’s better CAF resistance is worth specifying explicitly in your procurement documents.

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High-Speed Low-Loss Series (EM-888 Family)

This is arguably Doosan’s most important product family for modern designs. The EM-888 series fills the gap between commodity FR-4 and premium PTFE-based materials, offering low-loss electrical performance with standard FR-4 processing compatibility.

Part Number	Loss Category	Tg (°C)	Dk (at 10 GHz)	Df (at 10 GHz)	Primary Application
EM-526	Low Loss	170	3.7–3.9	0.006–0.008	5G sub-6 GHz, high-speed servers
EM-888	Low Loss	170	3.7–3.9	0.005–0.008	High-speed digital, networking
EM-888(S)	Low Loss	170	3.6–3.8	0.005–0.007	Server backplanes, 5G infrastructure
EM-888HF	Very Low Loss	170	3.4	0.003	77 GHz automotive radar, RF frontend
EM-888K	Very Low Loss	170	3.4–3.6	0.004–0.006	mmWave, backhaul equipment
EM-528	Very Low Loss	170	3.4–3.6	0.004–0.008	Ultra-high-speed networking

The EM-888HF deserves a specific callout. With a Dk of 3.4 and Df of 0.003 at 10 GHz, this material handles 77 GHz automotive radar designs without forcing you into PTFE territory. That means standard FR-4 lamination processes, no exotic drill programs, and significant cost savings on multilayer builds. Several Tier 1 automotive suppliers have standardized on this material for ADAS radar modules precisely for this reason.

For server infrastructure, the EM-888(S) variant has become a common specification for high-layer-count backplanes where maintaining signal integrity across long trace runs is the primary design challenge.

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Ultra-Low-Loss Series (EM-891 and EM-890 Family)

These materials sit at the performance apex of Doosan’s rigid CCL lineup, competing head-to-head with Panasonic Megtron6, Isola Tachyon 100G, and TUC TU-933. If you’re designing for 112G PAM4 SerDes channels, 400G/800G/1.6T Ethernet switches, or mmWave phased arrays, this is where you’re shopping.

Part Number	Loss Category	Tg (°C)	Dk (at 10 GHz)	Df (at 10 GHz)	Competitor Equivalent
EM-891	Ultra-Low Loss	170	3.3–3.5	0.003–0.005	Panasonic Megtron6, Isola Tachyon 100G
EM-891K	Ultra-Low Loss	170	3.3–3.5	≤0.004	Panasonic M-7N
EM-528K	Ultra-Low Loss	170	3.3–3.5	≤0.004	D(V)N series
EM-890	Ultra-Low Loss	170	3.2–3.4	≤0.004	LW-910, TU-933

The EM-891 series is what you reach for when insertion loss budget is the dominant design constraint — 112G backplane designs, high-frequency antenna feed networks, and carrier-grade router switch fabrics. At CES 2026, Doosan specifically highlighted their CCL developments for AI accelerators and data center infrastructure, and the EM-891 family is central to that pitch.

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DS-7409D High-Speed Series

The DS-7409 series uses a distinct numbering convention from the EM family and targets network communications equipment specifically. It’s a high-Tg, high-speed series with multiple loss variants that give engineers flexibility within a single proven material platform.

Part Number	Loss Profile	Tg (°C)	Td (°C)	Key Property	Target Application
DS-7409D(X)	Middle Loss	220	365	High-Tg, halogen option	Network comm equipment
DS-7409DV	Low Loss	220	365	Reduced Dk/Df vs D(X)	High-speed switches
DS-7409DV(N)	Ultra-Low Loss	220	365	N = halogen-free	Green compliance
DS-7409DJN	Ultra-Low Loss	220	365	Enhanced low-loss	Next-gen networking

DS-7409D(X) Detailed Properties:

Property	Value	Test Method
Glass Transition Temperature (Tg)	220°C	DSC
Decomposition Temperature (Td)	365°C	TGA
Thermal Conductivity	0.4 W/m·K	—
Young’s Modulus	22–24 GPa	—
Flexural Strength	420 MPa	IPC-TM-650
Peel Strength	220 MPa	IPC-TM-650
CTE (Z-axis)	≤3.5%	IPC-TM-650

The DS-7409D(X) with a Tg of 220°C is notably more thermally robust than the EM-series materials. That headroom matters when you’re building network switch boards that will sit in hot aisles of data centers running continuous thermal cycling. The halogen-free (N suffix) variants satisfy EU RoHS and REACH requirements without a meaningful performance penalty.

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RF-500 Series — mmWave and High-Frequency Applications

The RF-500 series is Doosan’s direct answer to Rogers RO4000 and Isola IS680 for RF and microwave applications. This series is targeted at the frequency range from sub-6 GHz all the way through 77 GHz automotive radar and up to mmWave 5G antenna structures.

Part Number	Dk	Df (at 10 GHz)	Frequency Range	Application
RF-500 (base)	3.5–4.0	0.002–0.004	up to 77 GHz	ADAS radar, RF front-end
RF-500 HF	~3.4	≤0.003	mmWave (up to 40 GHz)	5G beamforming, phased arrays

For applications up to approximately 40 GHz, the RF-500 and EM-888HF provide comparable electrical performance to mid-tier Rogers products, typically at a 20–30% cost reduction. The tradeoff is process sensitivity — the RF-500 series requires tighter drilling and etching controls than standard FR-4, but any shop running Rogers materials will have those controls already in place.

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FCCL (Flexible CCL) Series — DSflex Family

Doosan’s flexible CCL lineup operates under the DSflex branding and is built on polyimide substrates. These materials are the substrate of choice for flexible PCBs in smartphones, wearables, and increasingly for 5G antenna modules.

Part Number	Key Feature	Fold Endurance	Primary Application
DSflex-600	Low Dk/Df, stable impedance	Standard	5G antenna modules, RF flex
DSflex-900	High flexibility, durability	> 1,000,000 cycles	Foldable phones, wearables
DSflex (general)	Standard FCCL	Standard	Smartphones, tablet PCs

The DSflex-900’s one million fold-cycle rating is a hard specification requirement for foldable smartphone designs, where materials that can’t hit that threshold simply don’t make qualification. Doosan’s investment in a dedicated roll-to-roll FCCL manufacturing facility gives them a cost and supply security advantage in this fast-growing segment.

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IC Package Substrate Materials

Doosan has been aggressively expanding into the semiconductor packaging materials market, targeting the same substrates used in DRAM, NAND, and logic chip packages.

Material Type	Key Property	Application	Core Thickness
Package Substrate CCL	High elastic modulus, low CTE	FC-BGA, FC-CSP	25–50 µm
RCC (Resin Coated Copper)	Glass-free, ultra-low loss, low CTE	HDI any-layer	15–30 µm
ABF Alternatives	Fine-pattern support, mSAP compatible	Advanced packaging	Custom

The HDI materials and glass-free RCC unveiled at IPC APEX EXPO 2024 feature ultra-low-loss characteristics with low CTE for design freedom and stable signal transmission in advanced packaging stacks.

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Doosan PCB Materials Comparison: Loss Tier Hierarchy

Understanding where each Doosan part number sits in the loss hierarchy is critical for making the right material selection without over-specifying (and overpaying). Here’s how the complete lineup maps:

Loss Tier	Doosan Part Numbers	Df Range (10 GHz)	Frequency Ceiling	Cost Index
Standard Loss	EM-285, EM-827, EM-355(D), EM-370(5)	0.015–0.022	< 3 GHz	1.0x (baseline)
Mid Loss	EM-370(Z), EM-370(D), EM-390, EM-828G	0.010–0.015	< 6 GHz	1.2–1.5x
Low Loss	EM-526, EM-888, EM-888(S), DS-7409DV	0.005–0.010	< 15 GHz	1.8–2.5x
Very Low Loss	EM-528, EM-888K, EM-888HF	0.004–0.008	< 30 GHz	2.5–4.0x
Ultra-Low Loss	EM-891, EM-891K, EM-890, EM-528K, DS-7409DJN	≤ 0.005	< 60 GHz	4.0–6.0x
RF/mmWave	RF-500 series	0.002–0.004	> 60 GHz	5.0–8.0x

Cost Index Note: These are rough relative multipliers based on industry pricing trends, not published pricing. Actual costs vary significantly by thickness, copper weight, panel size, and volume.

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Cross-Reference: Doosan vs. Competing Laminate Suppliers

One of the most common tasks in laminate selection is finding a validated alternative when your primary material hits supply constraints. Here’s how Doosan PCB materials map against the major competitors:

Doosan Part	Panasonic Equivalent	Isola Equivalent	TUC Equivalent	Loss Tier
EM-285 / EM-827	—	R-1566	—	Standard
EM-370(Z) / EM-370(D)	Megtron2	RA-555W / IS-415	TU-862HF	Mid Loss
EM-888 / EM-888(S)	Megtron4	408HR / I-Speed	TU-872 SLK	Low Loss
EM-528 / EM-888K	M-7 / D(V)	—	—	Very Low Loss
EM-891	Megtron6 / M-7N	I-Tera / Tachyon 100G	TU-933	Ultra-Low Loss
EM-891K / EM-890	D(V)N	—	LW-910	Ultra-Low Loss

Important Qualification Note: Cross-referencing from a table is a starting point, not a qualified substitution. Dk/Df values measured by different test methods (stripline vs. cavity resonator, for example) are not directly comparable. Always run your own insertion loss and impedance test coupons when qualifying a cross-referenced material on a new design. Doosan publishes detailed characterization data using IPC-TM-650 2.5.5.5 test methods, which allows valid apples-to-apples comparison with suppliers who use the same protocol.

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Application-Based Part Number Selection Guide

After working through dozens of designs across automotive, telecommunications, and enterprise computing, here’s the decision framework I’d recommend for matching Doosan part numbers to application requirements:

Automotive Electronics

ADAS Radar (77 GHz): EM-888HF, RF-500 Powertrain ECU / Body Electronics: EM-827, EM-891 (for AEC-Q100 qualified builds) Camera and Sensor Modules: EM-370(Z), EM-828G

Doosan maintains IATF 16949 certification and has qualified multiple product lines through PPAP with major automotive OEMs and Tier 1 suppliers. The EM-827 and EM-891 series are commonly specified for automotive applications involving thermal cycling and vibration testing per AEC-Q100 protocols.

5G and Telecom Infrastructure

Sub-6 GHz Base Station Antenna: EM-888, EM-888(S), DSflex-600 (for flexible antenna) mmWave Beamforming (26/28/39 GHz): RF-500 HF, EM-888HF Backhaul / Carrier Router Switch: EM-891, EM-891K, DS-7409DJN 5G Repeater Core Board: EM-528, DS-7409DV(N)

At CES 2026 and IPC APEX EXPO 2024, Doosan highlighted their materials for 5G through Sub-THz operation, signaling continued investment in this segment. Their FCCL DSflex-600 series is specifically recommended for 5G antenna module flex sections where controlled impedance in the flexible region is non-negotiable.

Server and Data Center

AI Accelerator PCB (400G/800G/1.6T): EM-891, EM-890, DS-7409DJN Standard Server Motherboard: EM-370(Z), EM-888 High-Layer-Count Backplane: EM-891, EM-528K Memory Module (DIMM): EM-370(5), EM-827

Doosan demonstrated their 800 GbE CCL at IPC APEX EXPO 2024 and has a next-generation 1,600 GbE CCL in development — directly targeting the AI infrastructure scaling happening across major cloud providers.

Consumer Electronics and Mobile

Smartphone Mainboard: EM-285, EM-370(5) Foldable Phone Flex PCB: DSflex-900 Tablet / Laptop: EM-827, EM-370(Z) Wearables: DSflex series (custom)

The EM-888 series offers a price-to-performance balance that works for premium smartphones requiring RF front-end performance without the full cost of ultra-low-loss materials.

Industrial and Power Electronics

High-CTI Power Electronics: EM-CTI Series (CTI > 600V) Motor Drive / Inverter: EM-370(5), thermally enhanced variants LED Lighting (Metal Core): Metal-core / ceramic-filled CCL variants

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Doosan PCB Materials Technical Specifications Deep Dive

Thermal Properties — Why They Matter More Than You Think

Every experienced PCB engineer has stories about boards that assembled fine but developed intermittent failures in the field. A large percentage of those failures trace back to material thermal properties that weren’t adequately matched to the assembly process and operating environment.

Glass Transition Temperature (Tg) is the temperature at which the laminate shifts from a rigid to a rubbery state. Below Tg, Z-axis CTE is low and drill quality is consistent. Above Tg, Z-axis expansion accelerates sharply, which stresses plated through-holes during assembly and in-field thermal cycling. Lead-free assembly peaks at 260°C — which means any material with Tg below 170°C is a risk in high-density, high-layer-count boards running lead-free processes.

Decomposition Temperature (Td) is the temperature at which the resin begins to chemically break down, measured by 5% weight loss in TGA testing. The DS-7409D(X)’s Td of 365°C gives substantial margin above lead-free assembly peaks. For materials specced in high-reliability automotive or industrial applications where boards may experience multiple rework cycles, Td is often a more meaningful specification than Tg alone.

CTE (Z-axis) directly determines the stress on via barrels during thermal cycling. The EM-888 and EM-891 series both show improved Z-axis CTE compared to standard FR-4, which is part of why they show up in high-reliability applications even when the frequency performance alone wouldn’t require them.

Electrical Properties — Reading Dk and Df Numbers Correctly

Dk and Df numbers on datasheets require careful interpretation. The same material can show meaningfully different values depending on the test frequency, the test method (clamped stripline vs. cavity resonator), and moisture conditioning. Doosan publishes characterization data using IPC-TM-650 2.5.5.5, which is the stripline method — important to know when comparing against suppliers who use the cavity resonator method, which typically yields slightly lower Df values for the same physical material.

For practical design work, the Df at your operating frequency is what controls insertion loss. If you’re designing a 10 Gbps differential pair and your signal content extends to ~8 GHz (fifth harmonic), a material with Df of 0.008 at 10 GHz is a meaningful upgrade over standard FR-4 with Df of 0.020 at the same frequency — you’re looking at roughly a 2.5x reduction in dielectric loss contribution per unit length.

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Halogen-Free and Environmental Compliance

Halogen-free laminates have moved from a “nice to have” to a baseline requirement for most tier-1 OEM qualifications, particularly in European markets subject to RoHS, REACH, and WEEE directives. Doosan’s halogen-free CCL lineup covers multiple performance tiers:

Halogen-Free Part Number	Base Product	Compliance	Notes
EM-370(Z)-HF	EM-370(Z)	RoHS, REACH	Mid-loss, HF variant
EM-888(S)	EM-888	RoHS, REACH, IEC 61249-2-21	Halogen-free by default
DS-7409DV(N)	DS-7409DV	RoHS, REACH	N = halogen-free
DS-7409DJN	DS-7409DJ	RoHS, REACH	Ultra-low-loss, HF
DSflex-600/900	FCCL	RoHS	Standard for flex

Doosan provides downloadable RoHS test reports for their full product lineup through their technical support portal at doosanelectromaterials.com. MSDS (Material Safety Data Sheets) are also available per product for EH&S compliance documentation in manufacturing environments.

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Lead Times and Supply Chain Considerations

Supply chain risk management around laminate materials is something I’ve seen derail more programs than component shortages. Here’s a realistic picture of what to expect with Doosan materials in 2026:

Standard Doosan materials including EM-370 and EM-827 typically ship within 2–4 weeks from regional distributor warehouses in Asia and North America. Specialty products including the RF-500 series and IC package substrate materials may require 6–8 weeks lead time from the factory. During supply constraint periods, lead times can extend significantly.

Doosan’s multi-site manufacturing in South Korea, China, and Europe provides better supply security than single-site suppliers. Their capital expenditure for CCL equipment investment more than tripled between 2024 and 2025, reaching approximately KRW 86.4 billion (approximately USD 62 million) — a direct response to increasing competition from Taiwanese suppliers and growing demand from AI data center buildouts.

Practical recommendation: Build distributor relationships before you need them. Distributors who maintain safety stock on EM-888 and EM-891 materials are worth a small premium on standard orders when your program timeline can’t absorb a 12-week laminate shortage.

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Frequently Asked Questions About Doosan PCB Materials

FAQ 1: Are Doosan PCB Materials Automotive Qualified?

Yes. Doosan maintains IATF 16949 certification and has completed PPAP (Production Part Approval Process) qualification with major automotive OEMs and their Tier 1 supply base. The EM-827, EM-891, and RF-500 series are specifically deployed in automotive applications including ADAS radar modules, powertrain controllers, and body electronics boards. If your design requires AEC-Q100 materials documentation, request the automotive qualification package from your Doosan distributor or directly through doosanelectronics.com.

FAQ 2: Can Doosan EM-891 Replace Panasonic Megtron6 on My Design?

In many cases, yes — but “replace” requires qualification testing, not just a datasheet comparison. Both materials occupy the same ultra-low-loss performance tier, and Doosan’s EM-891 is specifically cross-referenced against Megtron6 in distributor qualification guides. The key areas to validate are: (1) Dk/Df measured using the same test method at your operating frequency, (2) Z-axis CTE behavior across your assembly temperature profile, and (3) via registration performance on your specific layer stack. Don’t skip test coupon runs when making this transition — even materials with identical datasheet numbers can behave differently with your specific stackup and fabricator process parameters.

FAQ 3: What Is the Lead Time for DS-7409D Materials?

The DS-7409D series is a specialty high-speed material primarily targeted at network communication equipment. Standard lead time from Doosan’s production facilities is typically 4–8 weeks, depending on your required thickness, copper weight, and panel format. Some distributors in Asia maintain spot stock, particularly in the DS-7409D(X) variant. For volume production, work with your distributor to establish a consignment or blanket order arrangement — this material is high-demand in the networking sector and spot availability can be tight during infrastructure buildout cycles.

FAQ 4: Does Doosan Supply Prepreg Separately From Core Laminate?

Yes. Prepreg (PP) is available for all major CCL product families and uses the same base material designations. This is important because matched-material stack-ups — using the same resin system for both core and prepreg — give you more predictable impedance performance than mixing materials from different suppliers. When you’re specifying a Doosan CCL for your core layers, specify the corresponding Doosan PP for your prepreg plies and provide this information in your fabrication notes.

FAQ 5: How Do I Access Doosan Material Datasheets and Technical Support?

Doosan maintains a technical resource portal at doosanelectromaterials.com with the following directly accessible resources: product datasheets (including full mechanical, thermal, and electrical property tables), RoHS test reports by product, MSDS sheets for manufacturing compliance, and an online product search tool that filters by application and material property. For design-level technical support, their regional application engineers can be reached through distributor channels or directly through the Doosan Electro-Materials contact form. Doosan also participates in major industry events including IPC APEX EXPO and Electronica, which are useful opportunities to meet their technical team directly.

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Useful Resources for Engineers Working With Doosan PCB Materials

The following resources are directly useful when specifying, qualifying, or processing Doosan PCB materials:

Official Doosan Resources

• Doosan Electro-Materials Product Database: doosanelectromaterials.com/en/product — searchable by application and material property
• Doosan RoHS Reports Portal: doosanelectromaterials.com/en/product/CCL_tech_support03 — downloadable RoHS test reports by product
• Doosan MSDS Downloads: doosanelectronics.com/en/product/CCL_tech_support04 — material safety data sheets

Third-Party Material Databases

• CircuitData Material DB: materials.circuitdata.org — open-source PCB material database including Doosan materials, accessible via API in CircuitData Language format (700+ materials from 90+ manufacturers)
• Z-zero PCB Materials Library: z-zero.com/pcb-materials — includes Doosan high-layer-count and low-loss laminates for stack-up planning and material selection software
• PCB Directory Laminate Database: pcbdirectory.com — laminate specifications with downloadable datasheets

Design and Simulation Tools

• Polar Instruments SI8000/Si9000: For impedance modeling with Doosan Dk values
• Ansys SIwave / HFSS: For insertion loss simulation using measured material characterization data
• Z-planner: Integrates Doosan material data directly for stackup planning

Industry Standards Referenced for Doosan Materials

• IPC-4101: Specification for Base Materials for Rigid and Multilayer PCBs
• IPC-4103: Specification for Base Materials for High-Speed/High-Frequency Applications
• IPC-TM-650 2.5.5.5: Permittivity and Loss Tangent measurement (stripline method)
• IATF 16949: Automotive quality management system standard

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Conclusion: Selecting the Right Doosan PCB Material for Your Design

After walking through the full Doosan PCB materials lineup, the pattern is clear: this is a supplier with genuine depth across the performance spectrum, from commodity FR-4 to ultra-low-loss materials for AI-era data center boards. The part number structure follows a consistent logic — EM-xxx for the standard rigid laminate family, DS-7409 for the high-speed networking series, DSflex for flexible substrates, and RF-500 for mmWave applications.

For most engineers, the practical decision tree is straightforward: start with frequency and thermal requirements, use the loss tier table to narrow down the family, then evaluate specific part numbers against your fabricator’s process capabilities and your supply chain risk tolerance.

The investment Doosan is making in next-generation materials for AI accelerators and 1.6T Ethernet infrastructure suggests their high-end product roadmap will continue to evolve aggressively. Staying current with their product releases through their technical portal and industry event presence is worth the time investment for engineers working at the edge of PCB performance requirements.