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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1314C: Complete Guide to Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1314C is a field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. It combines 200,000 system gates, 5,292 logic cells, and a commercial-grade -6 speed rating — all housed in a 1314-ball Fine-Pitch BGA (FGG1314) Pb-free package. This device is a proven solution for engineers seeking a cost-effective, high-density programmable logic platform in high-volume production environments.

Whether you are designing telecommunications infrastructure, industrial automation systems, or embedded computing boards, the XC2S200-6FGG1314C delivers the flexibility and performance that modern designs demand.


What Is the XC2S200-6FGG1314C?

The XC2S200-6FGG1314C belongs to Xilinx’s Spartan-II 2.5V FPGA Family — engineered as a reprogrammable alternative to mask-programmed ASICs. Unlike fixed ASICs, the XC2S200-6FGG1314C can be reconfigured in the field without hardware replacement, shortening development cycles and reducing time-to-market.

Part Number Decoder

Code Segment Meaning
XC2S200 Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest commercial)
FGG Fine-Pitch BGA, Pb-free package
1314 1,314 ball count
C Commercial temperature (0°C to +85°C)

For the full range of Xilinx programmable logic solutions, explore the Xilinx FPGA catalog at PCBSync.


XC2S200-6FGG1314C Key Specifications

Parameter Value
Manufacturer Xilinx (now AMD)
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops 4 (one per die corner)
Speed Grade -6 (Commercial only)
Core Voltage 2.5V
Process Technology 0.18 µm
Maximum System Speed Up to 263 MHz
Package Type FGG1314 (Fine-Pitch BGA)
Ball Count 1,314
Lead-Free (Pb-Free) Yes (“G” suffix confirmed)
Temperature Range 0°C to +85°C (Commercial)

XC2S200-6FGG1314C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1314C features 1,176 CLBs in a 28×42 matrix. Each CLB contains look-up tables (LUTs), flip-flops, and fast carry logic — enabling efficient implementation of both combinatorial and sequential functions.

Input/Output Blocks (IOBs)

A perimeter of programmable IOBs supports up to 284 user I/O pins (excluding four global clock pins). Multiple I/O standards are supported, giving designers full flexibility when interfacing with external components.

On-Chip Memory Summary

Memory Type Total Capacity Notes
Distributed RAM 75,264 bits Embedded within CLBs
Block RAM 56,000 bits (56K) Two dedicated columns on die
Combined Total ~131,264 bits Total usable on-chip memory

Delay-Locked Loops (DLLs)

Four DLLs — one at each die corner — provide clock deskewing, multiplication, and phase shifting. This ensures stable, synchronized clocks even at the highest operating frequencies.


Speed Grade -6: Performance at the Limit

The -6 speed grade is the fastest Spartan-II commercial option, supporting up to 263 MHz system performance.

Speed Grade Comparison — XC2S200

Speed Grade Max Frequency Temperature Range Use Case
-5 ~250 MHz Commercial / Industrial Standard designs
-6 Up to 263 MHz Commercial only High-speed applications

FGG1314 Package: Fine-Pitch BGA Details

Feature Detail
Package Type Fine-Pitch BGA (FBGA)
Ball Count 1,314
Lead Finish Pb-Free (SnAgCu or equivalent)
Mounting Style Surface Mount Technology (SMT)
PCB Requirement Fine-pitch BGA design rules apply

The high ball count enables dense I/O routing in space-constrained PCB layouts.


Key Features of the XC2S200-6FGG1314C

  • 200,000 system gates for complex logic
  • 5,292 logic cells in a structured CLB matrix
  • -6 speed grade up to 263 MHz
  • Four DLLs for clock management and deskewing
  • 75,264 bits of distributed RAM within CLB fabric
  • 56K bits of dedicated block RAM
  • Up to 284 configurable I/O pins
  • Pb-free FGG1314 package (RoHS-friendly)
  • In-system reprogrammability via JTAG
  • 2.5V core voltage on 0.18 µm process

XC2S200-6FGG1314C vs. Spartan-II Family Members

Device Logic Cells System Gates CLB Array Max I/O Dist. RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 b 16K
XC2S30 972 30,000 12×18 92 13,824 b 24K
XC2S50 1,728 50,000 16×24 176 24,576 b 32K
XC2S100 2,700 100,000 20×30 176 38,400 b 40K
XC2S150 3,888 150,000 24×36 260 55,296 b 48K
XC2S200 5,292 200,000 28×42 284 75,264 b 56K

The XC2S200 is the largest, most capable Spartan-II device, with the highest gate count, logic cells, and I/O count in the family.


Available Packages for XC2S200

Package Code Type Pin Count Pb-Free?
PQ208 PQFP 208 PQG208
FG256 Fine-Pitch BGA 256 FGG256
FG456 Fine-Pitch BGA 456 FGG456
FGG1314 Fine-Pitch BGA 1,314 Yes (this part)

Design Tools and Software Support

Tool Use Case Availability
Xilinx ISE Design Suite Synthesis and implementation Legacy support
ModelSim / XSIM RTL and gate-level simulation Free / commercial
ChipScope Pro In-system logic analysis (JTAG) Bundled with ISE
IMPACT Device programming Included with ISE

Applications of the XC2S200-6FGG1314C

Telecommunications

Protocol processing, line cards, high-speed switching fabric control.

Industrial Automation

Motor and servo drive logic, real-time sensor processing, machine vision.

Consumer Electronics

Display controllers, set-top box logic, DSP acceleration.

Embedded Computing

Co-processor tasks, bus bridging (PCI, USB), peripheral customization.

Aerospace & Defense

Avionics signal processing, radar front-end logic, secure communications.


Frequently Asked Questions (FAQ)

What does -6 speed grade mean on the XC2S200-6FGG1314C?

The -6 grade is the fastest Spartan-II commercial rating, supporting up to 263 MHz. It is only available in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1314C RoHS compliant?

The “G” in FGG1314 confirms a Pb-free package. Verify the lot-specific marking for final compliance confirmation.

Can the XC2S200-6FGG1314C be reprogrammed in the field?

Yes. It supports JTAG-based in-system programming via Xilinx IMPACT and can be configured from external PROMs.

What core voltage does the XC2S200-6FGG1314C require?

It operates at 2.5V core voltage. I/O voltage depends on the configured I/O standard (LVCMOS, LVTTL, etc.).


Summary

The XC2S200-6FGG1314C is the highest-performance member of the Xilinx Spartan-II commercial family. Its combination of 200,000 system gates, -6 speed grade, comprehensive on-chip memory, and a Pb-free 1314-ball BGA package make it an excellent choice for demanding, high-volume embedded logic designs. In-field reprogrammability and solid ISE toolchain support make it a low-risk, well-proven platform for both new production sustaining and legacy-compatible designs.


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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.