The XC2S200-6FGG1309C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, designed for cost-sensitive, high-volume applications that demand both flexibility and reliability. With 200,000 system gates, 5,292 logic cells, and a robust 1309-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is a powerful solution for digital design engineers across telecommunications, industrial automation, embedded systems, and more.

Whether you are sourcing this component for a new design, looking for its datasheet, or comparing it against alternative Spartan-II parts, this comprehensive guide covers everything you need to know about the XC2S200-6FGG1309C.

What Is the XC2S200-6FGG1309C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1309C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm process technology. The part number breaks down as follows:

The “-6” speed grade is exclusively available in the Commercial temperature range, making this part ideal for consumer electronics and commercial-grade industrial applications where operating conditions are controlled.

For engineers seeking a versatile, reconfigurable logic platform, explore our full range of Xilinx FPGA solutions.

XC2S200-6FGG1309C Key Specifications at a Glance

Core Logic Resources

Electrical & Physical Specifications

XC2S200-6FGG1309C Architecture – How the Spartan-II FPGA Works

Configurable Logic Blocks (CLBs)

The Spartan-II XC2S200 features a regular, flexible architecture centered around Configurable Logic Blocks (CLBs). Each CLB contains look-up tables (LUTs), flip-flops, and carry-chain logic, enabling the implementation of complex combinational and sequential circuits. The 28×42 CLB array of the XC2S200 offers 1,176 total CLBs, supporting sophisticated digital designs.

Input/Output Blocks (IOBs)

Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). With up to 284 user I/O pins, the XC2S200-6FGG1309C provides ample connectivity for high pin-count designs such as bus interfaces, multi-channel data acquisition, and peripheral control systems.

Block RAM and Distributed RAM

Embedded Memory Resources

The two dedicated block RAM columns located on opposite sides of the die support dual-port operation, making them ideal for FIFO buffers, look-up tables, and on-chip data storage without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs), positioned at each corner of the die, enable precise clock management. The DLLs eliminate clock skew, multiply or divide clock frequencies, and shift clock phase — critical capabilities for high-speed synchronous designs.

Routing Architecture

The CLBs, IOBs, and block RAM are interconnected by a hierarchical routing network consisting of local, long, and global routing resources. This versatile interconnect ensures efficient signal distribution with minimal propagation delay across the device.

XC2S200 Spartan-II Family Comparison

The XC2S200 sits at the top of the original Spartan-II family. Here’s how it compares to other members:

The XC2S200-6FGG1309C is the largest and most capable device in the original Spartan-II family, delivering maximum logic density and I/O count within this series.

XC2S200-6FGG1309C vs. Alternative Packages

The XC2S200 die is available in multiple package options. Here’s how the FGG1309 compares:

Note: The FGG1309 package offers the highest pin count option for the XC2S200, maximizing I/O accessibility and providing additional board-level routing flexibility for high-density PCB designs.

Top Applications for the XC2S200-6FGG1309C FPGA

Telecommunications & Networking

The XC2S200-6FGG1309C’s high gate count and 284 user I/Os make it well-suited for protocol bridging, framing logic, and packet processing in network equipment. Its DLLs support tight clock synchronization required in telecom line cards.

Industrial Automation & Control

With 200,000 system gates and robust I/O, this FPGA excels as an industrial controller core, managing sensor interfaces, motor control PWM outputs, and real-time data processing in factory automation environments.

High-Speed Data Acquisition Systems

The large distributed RAM (75,264 bits) and block RAM (56K bits) enable efficient buffering and on-chip storage in data acquisition systems, radar, and test & measurement instruments where real-time data capture is critical.

Embedded Vision & Image Processing

The 5,292 logic cells and combined 131,264 bits of on-chip memory support image processing pipelines for machine vision, robotics, and medical imaging. Custom convolution filters and pixel processing engines can be implemented directly in logic.

Wireless Communication Baseband

The XC2S200-6FGG1309C’s high logic density and DLL-based clock management support baseband signal processing in wireless communication systems including legacy 4G infrastructure and proprietary RF designs.

ASIC Prototyping & Design Validation

As Xilinx designed the Spartan-II family to be a cost-effective alternative to mask-programmed ASICs, the XC2S200-6FGG1309C is an excellent platform for ASIC prototyping, algorithm validation, and hardware emulation before tape-out.

Key Features and Benefits of the XC2S200-6FGG1309C

✅ Reprogrammable Architecture – No NRE Costs

Unlike ASICs, the XC2S200-6FGG1309C can be reconfigured in the field without hardware replacement. Design changes, bug fixes, and feature additions are deployed via configuration bitstream updates, eliminating non-recurring engineering (NRE) costs.

✅ Speed Grade -6 – Fastest Commercial Performance

The -6 speed grade delivers the highest performance within the commercial temperature range of the Spartan-II family, supporting system clock speeds up to 200 MHz for demanding real-time applications.

✅ Pb-Free / RoHS-Compliant Package

The “G” suffix in “FGG” designates a Pb-free (lead-free) packaging, ensuring compliance with RoHS directives for export to the EU and other markets with strict environmental regulations.

✅ Four Integrated DLLs for Clock Management

On-chip DLLs eliminate clock distribution skew and enable frequency synthesis and phase shifting without external PLL chips, reducing BOM cost and PCB complexity.

✅ Boundary Scan (JTAG) Support

The XC2S200-6FGG1309C supports IEEE 1149.1 Boundary Scan (JTAG) for in-circuit testing, simplifying production test and debug workflows on assembled boards.

✅ Versatile I/O Standards

Spartan-II IOBs support multiple I/O voltage standards including LVCMOS, LVTTL, PCI, GTL, HSTL, and SSTL, providing broad compatibility with existing system interfaces.

XC2S200-6FGG1309C Configuration and Programming Guide

Configuration Modes

The XC2S200 supports multiple configuration modes for system integration flexibility:

Recommended Design Tools

• Xilinx ISE Design Suite – The primary legacy tool for Spartan-II synthesis, implementation, and bitstream generation
• ModelSim / ISim – RTL and gate-level simulation
• iMPACT – Bitstream download and JTAG programming tool
• Chipscope Pro – On-chip logic analysis and debug

Ordering Information and Part Number Decoder

Understanding the XC2S200-6FGG1309C part number ensures you source the correct variant:

XC  2S  200  -6  FGG  1309  C
│   │    │    │   │     │    └─ Temperature: C = Commercial (0°C to +85°C)
│   │    │    │   │     └───── Pin Count: 1309
│   │    │    │   └─────────── Package: FGG = Fine-Pitch BGA, Pb-Free
│   │    │    └─────────────── Speed Grade: -6 (fastest commercial)
│   │    └──────────────────── Gate Count: 200K system gates
│   └───────────────────────── Family: 2S = Spartan-II
└───────────────────────────── Manufacturer: XC = Xilinx (now AMD)

Frequently Asked Questions (FAQ) – XC2S200-6FGG1309C

What is the XC2S200-6FGG1309C used for?

The XC2S200-6FGG1309C is used in applications requiring high logic density, reprogrammable hardware, and multiple I/O interfaces, including telecom equipment, industrial controllers, data acquisition systems, embedded vision, and ASIC prototyping.

What is the difference between XC2S200-6FGG1309C and XC2S200-6FG456C?

The primary difference is the package and pin count. The FGG1309C uses a 1309-pin Pb-free Fine-Pitch BGA, while the FG456C uses a standard (non-Pb-free) 456-pin FBGA. Both share the same XC2S200 die with identical logic resources.

Is the XC2S200-6FGG1309C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-free (lead-free), RoHS-compliant package, suitable for export to the EU and other regions with environmental restrictions on hazardous substances.

What speed is the XC2S200-6FGG1309C?

The “-6” speed grade is the fastest available for commercial-range Spartan-II devices, supporting system performance up to 200 MHz.

What software do I need to program the XC2S200-6FGG1309C?

The recommended tool is Xilinx ISE Design Suite (now legacy, maintained by AMD). Use iMPACT for bitstream downloading via JTAG. RTL design can be written in VHDL or Verilog.

Can the XC2S200-6FGG1309C be used in industrial temperature applications?

No. The “C” suffix designates the Commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), use parts with the “I” suffix (e.g., XC2S200-5FG456I). Note that speed grade -6 is not available in the industrial range.

What is the supply voltage for the XC2S200-6FGG1309C?

The XC2S200-6FGG1309C operates at a core supply voltage of 2.5V.

Why Choose the XC2S200-6FGG1309C for Your Design?

The XC2S200-6FGG1309C occupies a unique position as the top-tier device in the Spartan-II family, combining:

• The highest gate count (200K) and logic cells (5,292) in its family
• The fastest speed grade (-6) for commercial applications
• A high pin-count 1309-ball Pb-free BGA for maximum I/O access
• Proven 0.18µm silicon reliability with extensive deployment history
• Field reprogrammability that eliminates ASIC NRE costs

For engineers maintaining legacy systems, building industrial equipment, or prototyping new designs on a budget, the XC2S200-6FGG1309C remains a robust and accessible FPGA solution.

Summary Specifications Table