Meta Description: The XC2S200-6FGG1305C is a Xilinx Spartan-II FPGA with 200,000 system gates, 5,292 logic cells, and 1,305 pins in an FGG package. Discover full specs, key features, and applications.

The XC2S200-6FGG1305C is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s industry-proven Spartan-II family. Engineered for high-volume commercial applications that demand reliable programmable logic, this device combines 200,000 system gates, 5,292 logic cells, and a robust 1,305-pin Fine-Pitch Ball Grid Array (FGG) package — making it one of the most capable devices in the Spartan-II lineup. Whether you’re designing embedded systems, telecommunications hardware, or industrial controllers, the XC2S200-6FGG1305C delivers the performance, I/O density, and design flexibility needed to meet demanding project requirements.

For engineers sourcing Xilinx programmable logic devices, explore our full range of Xilinx FPGA solutions for pricing, availability, and expert support.

What Is the XC2S200-6FGG1305C? – Product Overview

The XC2S200-6FGG1305C is a member of Xilinx’s Spartan-II 2.5V FPGA family, a series designed as a cost-effective, high-performance alternative to mask-programmed ASICs. Unlike fixed-function ASICs, this FPGA allows engineers to reprogram logic in the field — eliminating hardware replacement costs when designs evolve.

The part number breaks down as follows:

This device is manufactured on a 0.18-micron, six-layer metal CMOS process and operates at a core voltage of 2.5V, offering an excellent balance of power efficiency and logic performance.

XC2S200-6FGG1305C Key Specifications at a Glance

The table below summarizes the most critical electrical and logic specifications for the XC2S200-6FGG1305C:

XC2S200-6FGG1305C Package Information

The FGG1305 package is a Fine-Pitch Ball Grid Array with 1,305 solder balls. The “G” in FGG indicates the Pb-free (lead-free) variant, making this device fully RoHS compliant for use in modern, environmentally regulated product designs.

Note: The -6 speed grade is exclusively available in the Commercial temperature range. Engineers requiring Industrial temperature range (-40°C to +85°C) should select devices with the I suffix.

Architecture & Internal Logic Features

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1305C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains multiple Look-Up Tables (LUTs), flip-flops, and carry logic, enabling efficient implementation of arithmetic, control, and data-path functions.

Block RAM and Distributed RAM

Memory is a critical resource in FPGA design, and the XC2S200 provides two types:

• Distributed RAM: 75,264 bits implemented within the CLB fabric, ideal for small, fast lookup tables and shift registers.
• Block RAM: 56 Kbits of dedicated synchronous dual-port RAM organized in two columns flanking the CLB array — ideal for FIFOs, frame buffers, and larger data storage.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide precision clock management. DLLs enable:

• Zero propagation-delay clock buffering
• Clock frequency synthesis (multiply and divide)
• Phase shifting for multi-domain designs
• Duty-cycle correction

Input/Output Blocks (IOBs)

The perimeter of the die is surrounded by programmable Input/Output Blocks. With up to 284 user I/O pins, the XC2S200-6FGG1305C supports multiple I/O standards, including LVTTL, LVCMOS, GTL, GTL+, SSTL, CTT, and AGP, enabling seamless interfacing with diverse peripheral devices and buses.

Performance Characteristics

Speed Grade -6: Fastest Commercial Grade

The -6 speed grade is the highest-performance speed grade available in the Spartan-II commercial family. It delivers:

• Maximum system performance up to 200 MHz
• Faster internal propagation delays across CLBs, routing, and IOBs compared to -5 and -4 speed grades
• Optimized timing for high-frequency data processing applications

Speed Grade Comparison — XC2S200 Family

XC2S200 Spartan-II Family Comparison

To understand where the XC2S200-6FGG1305C sits within the broader Spartan-II product family, refer to the table below:

The XC2S200 is the largest and highest-density member of the Spartan-II family, providing the most logic resources, RAM, and I/O pins for demanding designs.

Key Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG1305C was designed as a superior alternative to mask-programmed ASICs, offering significant engineering and business advantages:

• No NRE (Non-Recurring Engineering) costs — eliminates multi-million-dollar ASIC mask charges
• Fast time-to-market — begin prototyping immediately without tape-out lead times
• In-field reprogrammability — update or fix designs post-deployment without hardware replacement
• Reduced risk — design iterations cost only engineering time, not hardware respins
• High-volume cost efficiency — competitive pricing for production volumes

Supported I/O Standards

The XC2S200-6FGG1305C IOBs support a wide range of single-ended and differential I/O standards:

Typical Applications for the XC2S200-6FGG1305C

The high gate count, large I/O capacity, and -6 speed grade make this device well-suited for a wide range of commercial applications:

Telecommunications & Networking

High-speed packet processing, protocol bridging, line-card control, and backplane interface management all benefit from the XC2S200’s 200,000 gates and 284 I/O pins.

 Industrial Automation & Control

With fast clock performance and robust I/O standards, the XC2S200-6FGG1305C is ideal for real-time PLC functions, motor drive controllers, sensor fusion engines, and machine vision preprocessing.

Embedded Systems & SoC Prototyping

The device’s large CLB array and dual-port block RAM support embedded processor peripherals, custom IP cores, and hardware accelerators for embedded SoC prototyping.

 Signal Processing

DSP pipelines, FIR/IIR filter banks, FFT engines, and radar/sonar processing front-ends can leverage the distributed RAM and high-speed CLBs for efficient real-time signal processing.

 Consumer Electronics & Display Systems

Video scalers, timing controllers, and display interface bridges for consumer electronics and digital signage systems benefit from the device’s broad I/O standard support and compact BGA packaging.

 Data Acquisition Systems

High-throughput ADC/DAC interfaces, FIFO buffering, and real-time data formatting for test & measurement equipment are well-supported by the XC2S200’s memory and I/O resources.

Design Tools & Programming Support

The XC2S200-6FGG1305C is supported by Xilinx’s ISE Design Suite, the established toolchain for legacy Spartan-II devices. Key design tools include:

Design entry is supported in VHDL, Verilog, and schematic capture. JTAG boundary scan (IEEE 1149.1) is natively supported for board-level testing and in-system programming.

Ordering Information & Part Number Decoder

Understanding the full Xilinx part number convention for the XC2S200-6FGG1305C:

XC  2S  200  -6  FGG  1305  C
|   |   |    |   |    |     |
|   |   |    |   |    |     └─ Temperature: C = Commercial (0°C to +85°C)
|   |   |    |   |    └─────── Pin Count: 1305
|   |   |    |   └──────────── Package: FGG = Fine-Pitch BGA, Pb-Free
|   |   |    └──────────────── Speed Grade: -6 (fastest commercial)
|   |   └───────────────────── Gates: 200,000 system gates
|   └───────────────────────── Family: Spartan-II (2S)
└───────────────────────────── Xilinx FPGA prefix

Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1305C and XC2S200-5FG456C?

The XC2S200-6FGG1305C features the faster -6 speed grade and a larger 1,305-pin FGG package with more I/O breakout, while the XC2S200-5FG456C uses the slower -5 grade and a 456-pin FG package with fewer accessible I/O pins. Choose the FGG1305 when your design requires maximum I/O density.

Is the XC2S200-6FGG1305C RoHS compliant?

Yes. The “G” in the FGG package designator confirms this is the Pb-free (lead-free), RoHS-compliant variant of the device.

 What temperature range does this device support?

The -6 speed grade is available exclusively in the Commercial temperature range: 0°C to +85°C. For Industrial range (-40°C to +85°C), select a -5 or -4 speed grade device with the “I” suffix.

Can this FPGA be used in new designs today?

The Spartan-II family is classified as mature/legacy technology by AMD (Xilinx). It is not recommended for brand-new designs. However, it remains widely used in legacy system maintenance, prototyping, and low-volume production. For new designs, AMD’s Spartan-7 or Artix-7 families are the recommended modern alternatives.

 What programming interface does the XC2S200-6FGG1305C use?

The device supports JTAG (IEEE 1149.1) boundary scan for in-circuit programming and testing, as well as Slave SelectMAP and Slave Serial configuration modes for production programming workflows.

Summary

The XC2S200-6FGG1305C remains a powerful choice for engineers maintaining legacy Xilinx Spartan-II-based systems or developing new prototypes that require maximum I/O density within the Spartan-II gate ceiling. With 200,000 system gates, 5,292 logic cells, four DLLs, 284 user I/O pins, and 56K bits of block RAM in a Pb-free 1,305-pin BGA package running at the fastest commercial -6 speed grade, this device continues to deliver reliable, high-performance programmable logic for commercial applications.

For the complete selection of Xilinx programmable logic devices — from legacy Spartan-II parts to the latest AMD Artix and Versal families — visit our Xilinx FPGA product catalog.