Meta Description: Buy XC2S200-6FGG1302C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, 1302-ball FGG BGA package, 2.5V, speed grade -6. Full specs, pinout, and datasheet guide.

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The XC2S200-6FGG1302C is a high-performance Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD), belonging to the industry-proven Spartan-II family. It delivers 200,000 system gates, 5,292 logic cells, and a maximum system performance of up to 200 MHz, all housed in a robust 1302-ball Fine-Pitch Ball Grid Array (FGG BGA) package. Designed for commercial-temperature applications, the XC2S200-6FGG1302C is a go-to solution for engineers who need powerful programmable logic at a cost-effective price point. Whether you are working on telecommunications, industrial automation, or embedded control systems, this device offers the flexibility and reliability that modern designs demand.

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What Is the XC2S200-6FGG1302C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1302C is part of Xilinx’s Spartan-II FPGA family, a series specifically engineered to deliver the performance of high-end FPGAs at a significantly lower cost. The Spartan-II family targets volume-sensitive applications where budget and board space are critical constraints, while still providing abundant logic resources and a rich feature set.

The part number decodes as follows:

For engineers sourcing programmable logic components, understanding these details is essential for correct footprint matching, timing analysis, and procurement. Explore a broad range of Xilinx FPGA options to find the right device for your project.

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XC2S200-6FGG1302C Key Specifications at a Glance

The table below summarizes the most critical electrical and physical specifications for the XC2S200-6FGG1302C.

General Electrical Specifications

Package Specifications

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XC2S200-6FGG1302C Logic Architecture – How It Works

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1302C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains four slices, and each slice includes two function generators (look-up tables), two storage elements (flip-flops), and carry logic. This architecture allows the device to implement a wide variety of digital functions efficiently, from simple combinational logic to complex sequential state machines.

The CLB structure also supports the implementation of distributed RAM, providing 75,264 bits of on-chip memory that is tightly integrated with the logic fabric for low-latency data access.

Block RAM Resources

In addition to distributed RAM, the XC2S200-6FGG1302C includes 56K bits of dedicated Block RAM. These dual-port block RAMs can be independently read and written, making them ideal for FIFOs, look-up tables, and embedded data storage. They operate synchronously and support various width/depth configurations.

Delay-Locked Loops (DLLs)

The device integrates four on-chip Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide:

• Zero-delay clock buffering
• Frequency synthesis (multiply or divide)
• Phase shifting
• Duty-cycle correction

DLLs are critical for high-speed designs where precise clock management is needed to eliminate clock skew across the device.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1302C provides up to 284 user-configurable I/O pins, each implemented through programmable Input/Output Blocks (IOBs). The IOBs support multiple I/O standards, including:

This wide range of supported standards makes the XC2S200-6FGG1302C highly versatile for interfacing with processors, memories, and other digital components.

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Configuration Modes for XC2S200-6FGG1302C

The XC2S200-6FGG1302C supports multiple configuration modes, allowing flexible integration into various system architectures.

Configuration data is stored in external non-volatile memory (such as Xilinx PROMs or standard SPI/parallel flash) and loaded into the device at power-up. The device retains its configuration as long as power is applied, and it can be reconfigured in-system via the JTAG port.

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XC2S200-6FGG1302C Performance – Speed Grade -6 Explained

The -6 speed grade is the fastest available in the Spartan-II commercial product line. It is exclusively available in the Commercial temperature range (0°C to +85°C). Higher speed grades indicate faster propagation delays and higher clock frequency ceilings, which directly translates to better system throughput.

Speed Grade Comparison within XC2S200 Family

Choosing speed grade -6 is recommended when the design requires maximum timing margin or when operating at high clock frequencies that approach the device’s performance ceiling.

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Why Choose the XC2S200-6FGG1302C Over a Standard ASIC?

The XC2S200-6FGG1302C offers several compelling advantages over traditional mask-programmed ASICs, particularly for low-to-medium volume production and prototyping environments.

Key Advantages

• No NRE Costs: There are no Non-Recurring Engineering costs associated with mask sets, which can run into hundreds of thousands of dollars for ASICs.
• Faster Time to Market: FPGA-based designs can go from concept to working silicon in days, rather than the months-long ASIC tape-out cycle.
• In-Field Reprogrammability: The XC2S200-6FGG1302C can be reconfigured via JTAG after deployment. This makes firmware updates, bug fixes, and feature additions possible without replacing hardware.
• Risk Reduction: Unlike ASICs, there is no financial risk if a design revision is required. Simply reload a new bitstream.
• Design Reuse: The same physical board can serve multiple product variants by loading different FPGA configurations.

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XC2S200-6FGG1302C Typical Applications

The XC2S200-6FGG1302C is suitable for a broad range of applications across multiple industries.

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Development Tools for XC2S200-6FGG1302C

Xilinx ISE Design Suite

The XC2S200-6FGG1302C is supported by the Xilinx ISE Design Suite, which provides a complete RTL-to-bitstream design flow. ISE includes synthesis, place and route, static timing analysis, and bitstream generation tools. Because the Spartan-II family predates Vivado, ISE 14.7 is the recommended toolchain for this device.

Simulation and Verification

Designers typically use industry-standard simulation tools such as:

• ModelSim / QuestaSim – For functional and timing simulation
• Synopsys VCS – For large-scale verification environments
• ISIM (Xilinx integrated simulator) – Bundled with ISE for quick verification

Hardware Description Languages Supported

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XC2S200-6FGG1302C vs. Similar Spartan-II Variants

Engineers often need to compare the XC2S200-6FGG1302C against other members of the Spartan-II family to determine the best fit.

Note: The FGG1302 package offers the highest ball count in the XC2S200 lineup, providing the greatest PCB routing flexibility and potentially more power/ground planes for improved signal integrity.

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Power Supply Requirements for XC2S200-6FGG1302C

Proper power supply design is essential for reliable FPGA operation.

The internal logic of the XC2S200-6FGG1302C operates at 2.5V, while the I/O banks (VCCO) can be set independently per bank to support 2.5V or 3.3V I/O standards. Designers should ensure proper decoupling capacitors are placed close to every VCC and VCCO pin on the PCB for stable operation.

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PCB Design Considerations for the 1302-Ball BGA Package

Working with a 1302-ball BGA package requires careful PCB design attention. Below are best practices for successful board-level integration.

Via Strategy

• Use via-in-pad or dog-bone fanout patterns to route inner ball rows
• Micro-vias or stacked vias may be required for dense signal routing

Layer Stack-Up

• A minimum 8-layer PCB is recommended for the FGG1302 package
• Dedicate at least two internal layers to power and ground planes

Signal Integrity

• Keep high-speed differential pairs routed with matched-length traces
• Use series termination resistors on high-frequency outputs
• Follow Xilinx’s PCB design guidelines (XAPP157) for FPGA layout best practices

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Frequently Asked Questions About XC2S200-6FGG1302C

What does the “FGG” in XC2S200-6FGG1302C mean?

The “FGG” designates a Fine-Pitch Ball Grid Array package that is Pb-free (lead-free) and therefore RoHS compliant. The double “G” specifically indicates Pb-free packaging in Xilinx’s naming convention.

Is the XC2S200-6FGG1302C still in production?

The Spartan-II family has reached end-of-life status with Xilinx/AMD. However, it remains widely available through authorized distributors and the secondary market due to legacy design support requirements.

Can I use Vivado with the XC2S200-6FGG1302C?

No. Vivado does not support the Spartan-II family. You must use Xilinx ISE Design Suite 14.7 for design, synthesis, and bitstream generation.

What is the difference between XC2S200-6FGG1302C and XC2S200-6FGG456C?

Both devices share the same silicon die and logic specifications. The primary difference is the package ball count: the FGG1302 has 1,302 balls while the FGG456 has 456 balls. The FGG1302 provides significantly more PCB routing room and is preferred in designs with high I/O density requirements.

What configuration memory is compatible with the XC2S200-6FGG1302C?

Xilinx XC17V Series PROMs (such as XC17V16 and XC17V32) are commonly used. Standard SPI flash or parallel flash with appropriate configuration circuitry is also supported in Slave Serial or Slave Parallel modes.

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Summary – Is the XC2S200-6FGG1302C Right for Your Design?

The XC2S200-6FGG1302C is an excellent choice for engineers who need:

• A mature, well-documented FPGA platform with extensive legacy support
• 200K system gates and 5,292 logic cells for medium-complexity designs
• The fastest -6 speed grade in the Spartan-II commercial lineup
• A 1302-ball Pb-free BGA package for high I/O count or high-density PCB designs
• Proven reliability in telecommunications, industrial, and embedded applications

While newer Xilinx families offer more resources and lower power, the XC2S200-6FGG1302C remains a trusted component for legacy system maintenance, long-lifecycle industrial products, and educational FPGA platforms. Its combination of adequate logic capacity, flexible I/O support, and the highest-speed commercial grade makes it a strong candidate for projects where design maturity and proven supply chains matter most.