Focus Keyword: XC2S200-6FGG1301C Meta Description: Buy the XC2S200-6FGG1301C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade & 1301-ball Pb-free FGG BGA. Full specs & datasheet guide.
The XC2S200-6FGG1301C is a high-density, commercial-grade Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II product family. Engineered on advanced 0.18-micron process technology and operating on a 2.5V core supply, this device delivers 200,000 system gates, 5,292 configurable logic cells, and 284 user I/O pins — all housed inside a 1301-ball Fine-Pitch Ball Grid Array (FGG) lead-free (Pb-free) package. As the highest-density member of the Spartan-II lineup at the fastest commercial speed grade, the XC2S200-6FGG1301C is the proven choice for engineers who need cost-effective programmable logic performance without the schedule risk and cost of custom ASICs.
What Is the XC2S200-6FGG1301C? Understanding the Part Number
The XC2S200-6FGG1301C part number encodes key device attributes in a structured naming convention used across the entire Xilinx Spartan-II family. Each segment carries precise technical meaning:
| Part Number Segment |
Decoded Meaning |
| XC2S200 |
Xilinx Spartan-II family; 200,000 system gate density |
| -6 |
Speed grade -6 — fastest available in the commercial temperature range |
| FGG |
Fine-Pitch Ball Grid Array (BGA), Pb-free / RoHS-compliant (“G” = lead-free suffix) |
| 1301 |
1,301 total solder ball count on the BGA package |
| C |
Commercial operating temperature range: 0°C to +85°C |
Important: The -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1301C the peak-performance commercial variant in the entire Spartan-II lineup.
XC2S200-6FGG1301C Full Technical Specifications
Core Logic Resources
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM Bits |
75,264 bits |
| Block RAM Bits |
56K (56,000 bits) |
| Delay-Locked Loops (DLL) |
4 (one per die corner) |
Electrical & Performance Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V / 3.3V (per bank) |
| Process Node |
0.18 µm CMOS |
| Maximum System Performance |
Up to 200 MHz |
| Speed Grade |
-6 (Commercial maximum) |
| Configuration Bitstream Size |
1,335,840 bits |
Package & Compliance Details
| Parameter |
Value |
| Package Type |
FGG — Fine-Pitch Ball Grid Array |
| Total Ball Count |
1,301 |
| Package Lead Finish |
Lead-Free (Pb-free), RoHS Compliant |
| Temperature Grade |
Commercial — 0°C to +85°C |
XC2S200-6FGG1301C Architecture Deep Dive
Configurable Logic Blocks (CLBs) — The Core Fabric
The XC2S200-6FGG1301C contains 1,176 Configurable Logic Blocks arranged in a dense 28-column by 42-row matrix. Each CLB comprises multiple Look-Up Tables (LUTs), dedicated flip-flops, fast carry logic, and wide-function multiplexers. This rich CLB architecture enables efficient implementation of combinational logic, sequential circuits, arithmetic units, shift registers, and small on-fabric memory structures. The CLB interconnect hierarchy provides both local fast connections and global long-line routing, giving designers full control over timing across the entire device.
Block RAM — Dedicated High-Speed Dual-Port Memory
The XC2S200-6FGG1301C features 56K bits of synchronous Block RAM organized in two columns along opposite sides of the die. Each Block RAM block is a true dual-port memory, supporting simultaneous read and write operations from two independent clock domains — ideal for dual-port FIFOs, DSP coefficient storage, protocol decoder lookup tables, and on-chip frame buffers.
Distributed RAM — Ultra-Low-Latency Fabric Memory
Beyond Block RAM, 75,264 bits of Distributed RAM are embedded directly within the CLB LUT fabric, delivering ultra-low access latency for small register files, delay lines, and real-time data queues — all without any dedicated memory interface overhead.
Delay-Locked Loops (DLLs) — Precision Clock Management
Four on-chip DLLs — one positioned at each corner of the die — provide:
- Clock deskewing — eliminates PCB-level clock distribution skew
- Frequency synthesis — multiply or divide incoming clock frequencies
- Phase shifting — shift clocks by programmable fractions of a period
- Duty-cycle correction — restores 50% duty cycle to degraded clock signals
Flexible I/O Blocks — Multi-Standard Signaling Support
With 284 user I/O pins organized across independently powered I/O banks, the XC2S200-6FGG1301C supports a broad range of signaling standards:
| Supported I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS 3.3 / 2.5 |
Low-Voltage CMOS |
| PCI 3.3V |
Peripheral Component Interconnect |
| GTL / GTL+ |
Gunning Transceiver Logic |
| HSTL Class I / II / III / IV |
High-Speed Transceiver Logic |
| SSTL2 / SSTL3 |
Stub Series Terminated Logic |
| AGP |
Accelerated Graphics Port |
Configuration Modes
The XC2S200-6FGG1301C supports Master Serial, Slave Parallel, Boundary-Scan, and Slave Serial configuration modes. Its 1,335,840-bit bitstream can be loaded via JTAG or an external configuration PROM at every power-up cycle.
XC2S200-6FGG1301C vs. Full Spartan-II Family Comparison
Understanding where the XC2S200 sits relative to its siblings helps engineers select the right density level for their design.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 (this device) |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200 delivers the largest logic fabric, highest I/O count, and maximum Block RAM capacity of any device in the Spartan-II family — making the XC2S200-6FGG1301C the definitive choice when full-density Spartan-II capability is required.
Key Applications of the XC2S200-6FGG1301C
Telecommunications & Network Infrastructure
The high I/O density and deterministic DLL-managed timing make the XC2S200-6FGG1301C well suited for protocol bridging, line-card controllers, packet classification engines, and serial-to-parallel converters in both wireline and wireless network systems.
Industrial Automation & Motion Control
In factory automation environments, this FPGA handles multi-axis servo control, encoder feedback processing, PWM generation, and real-time sensor aggregation with cycle-accurate timing and high I/O fan-out simultaneously.
Digital Signal Processing (DSP) Applications
The combination of Block RAM and distributed memory supports high-throughput FIR/IIR filter pipelines, FFT engines, digital down-converters (DDCs), and adaptive signal processing architectures, all executing at the device’s maximum clock rate.
Embedded Hardware Acceleration
Deployed alongside a microprocessor or DSP, the XC2S200-6FGG1301C acts as a dedicated co-processor, offloading encryption, data formatting, real-time bus arbitration, and DMA management from the host CPU fabric.
Medical Imaging & Diagnostic Equipment
Multi-standard I/O and reliable performance make this FPGA a strong fit for ultrasound front-end controllers, CT/MRI signal processing boards, and precision diagnostic instruments where signal integrity and timing determinism are non-negotiable.
Automated Test & Measurement Systems
ATE platforms leverage the XC2S200-6FGG1301C for pattern generation, timing analysis, bus capture, and stimulus-response sequencing across high-speed test channels.
XC2S200-6FGG1301C vs. Mask-Programmed ASICs
The Spartan-II family is designed as a superior alternative to mask-programmed ASICs. The advantages of the XC2S200-6FGG1301C over custom silicon are compelling:
| Criteria |
XC2S200-6FGG1301C (FPGA) |
Mask-Programmed ASIC |
| NRE Cost |
None |
$500K–$5M+ per design |
| Time-to-First-Silicon |
Days (reprogramming) |
12–24+ weeks |
| Design Iteration |
Unlimited, free |
Costly mask re-spins |
| Field Reconfigurability |
Yes — update in-system |
No — hardware replacement required |
| Risk Profile |
Low — debug and revise freely |
High — errors require full re-tape |
| Volume Break-Even |
Ideal for low-to-mid volumes |
Only justified at very high volumes |
For teams working on Xilinx FPGA designs at commercial scale, the XC2S200-6FGG1301C eliminates the financial risk and schedule pressure of ASIC development while delivering comparable, deterministic logic performance.
Development Tools & Software Support
| Tool / Software |
Purpose |
| Xilinx ISE Design Suite 14.7 |
Synthesis, place-and-route, bitstream generation |
| XST (Xilinx Synthesis Technology) |
HDL synthesis integrated into ISE |
| ISIM / ModelSim |
RTL and gate-level simulation |
| ChipScope Pro |
In-system logic capture and debug |
| iMPACT / JTAG Programmer |
Device configuration and bitstream download |
| Platform Flash PROMs (XCF-series) |
Non-volatile autonomous configuration |
Supported HDL Languages: VHDL, Verilog, ABEL, and schematic-based entry are fully supported within the ISE design flow. The XC2S200-6FGG1301C is not supported in Xilinx Vivado — ISE 14.7 is the required environment for all Spartan-II designs.
Compatible Configuration PROMs for the XC2S200-6FGG1301C
| PROM Part Number |
Capacity |
Recommended Use |
| XCF01S |
1 Mbit |
Insufficient for XC2S200 full bitstream |
| XCF02S |
2 Mbit |
Minimum viable — fits XC2S200 bitstream |
| XCF04S |
4 Mbit |
Preferred — stores full bitstream with margin |
Complete Ordering Information
| Field |
Details |
| Full Part Number |
XC2S200-6FGG1301C |
| Manufacturer |
Xilinx, Inc. (now AMD) |
| Product Family |
Spartan-II |
| Device |
XC2S200 |
| Speed Grade |
-6 (fastest commercial) |
| Package |
FGG — Fine-Pitch BGA, Pb-Free |
| Ball Count |
1,301 |
| Temperature Range |
Commercial: 0°C to +85°C |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V / 3.3V |
| RoHS Compliance |
Yes — Pb-Free |
| Product Status |
End-of-Life (legacy inventory available) |
Frequently Asked Questions About the XC2S200-6FGG1301C
What does “FGG” mean in XC2S200-6FGG1301C?
FGG designates a Fine-Pitch Ball Grid Array in its Pb-free (lead-free) variant. The standard leaded BGA carries a single “FG” suffix; the second “G” specifically identifies the RoHS-compliant, lead-free solder ball composition. Both versions are electrically and footprint-compatible — the suffix change reflects solder composition only.
How does the XC2S200-6FGG1301C differ from the XC2S200-6FGG1297C?
Both devices use the identical XC2S200 die — same logic cell count, RAM capacity, I/O count, and electrical characteristics. The sole difference lies in the total ball count (1,301 vs. 1,297), which corresponds to a different revision or variant of the physical BGA package footprint. Always verify your PCB land pattern against the exact package variant before finalizing board layout.
Is the XC2S200-6FGG1301C still in production?
The Spartan-II family has reached End-of-Life (EOL) status with Xilinx/AMD. New production is discontinued; however, authorized distributors and specialty component brokers continue to maintain inventory for legacy system maintenance and long-lifecycle industrial programs.
What is the maximum clock speed of the XC2S200-6FGG1301C?
The XC2S200 family supports system performance up to 200 MHz, with the -6 speed grade delivering the lowest propagation delays and highest achievable clock frequencies within the Spartan-II commercial lineup.
Can the XC2S200-6FGG1301C operate in industrial temperature conditions?
No — the “C” suffix designates the Commercial temperature range (0°C to +85°C). Engineers requiring industrial temperature operation (-40°C to +85°C) should source the “I” suffix variant. Note that the -6 speed grade is exclusively available in the Commercial range and has no industrial-temperature equivalent.
What configuration PROM should I use with the XC2S200-6FGG1301C?
The XCF04S Platform Flash PROM is the preferred choice, providing 4 Mbit of storage that comfortably holds the XC2S200’s 1,335,840-bit bitstream with capacity to spare. The XCF02S is the minimum viable option.
Summary: Why the XC2S200-6FGG1301C Remains a Relevant Engineering Choice
The XC2S200-6FGG1301C represents the pinnacle of the Xilinx Spartan-II FPGA family — combining 200,000 system gates, 5,292 logic cells, 75,264 bits of distributed RAM, 56K bits of Block RAM, four precision on-chip DLLs, and 284 flexible user I/O pins inside a compact, RoHS-compliant 1301-ball Fine-Pitch BGA package. Rated at the fastest commercial speed grade (-6) and operating across the standard commercial temperature range of 0°C to +85°C, this device continues to serve engineers across telecommunications, industrial automation, digital signal processing, and embedded systems who require a battle-tested, well-documented, and fully field-reconfigurable programmable logic solution.
Whether you are sourcing replacement components for legacy hardware maintenance or evaluating the XC2S200-6FGG1301C for a new design requiring Spartan-II compatibility, this device delivers the logic density, speed performance, and I/O versatility that demanding commercial applications require.
