Bergquist PCB vs Laird vs AI Technology IMS: Competitive Comparison

Choosing the right IMS PCB substrate is not primarily a brand decision — it is an engineering decision that happens to be constrained by which brand’s products your fabricator stocks, whether UL recognition is required, and whether the dielectric’s verified electrical properties match your working voltage and operating temperature. That said, understanding what differentiates Bergquist Thermal Clad, Laird Tlam, and AI Technology Cool-Clad at the material level is necessary before any of those downstream decisions can be made intelligently.

This article compares all three brands across the parameters that PCB engineers actually use to select IMS substrate: dielectric thermal conductivity and resistance, breakdown voltage, glass transition temperature, multi-layer capability, assembly compatibility, fabricator availability, and certifications. The goal is a fact-based, side-by-side comparison that helps you pick the right material for the application — not the most-marketed one.

For background on the Bergquist Thermal Clad product line, grade designations, and current TCLAD Inc. sourcing, the Bergquist PCB reference page covers that in detail.

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Brand Background: Who Makes What in 2026

Bergquist Thermal Clad (now TCLAD Inc.)

Bergquist is the original IMS PCB substrate technology, developed in the late 1980s and one of the first materials to achieve UL recognition for metal core PCB construction. After Bergquist was acquired by Henkel in 2014, the Thermal Clad product line was sold to Polytronics Technology Corporation in 2021 and is now manufactured by TCLAD Inc. in Prescott, Wisconsin. The grade designations remain unchanged: HPL-03015, HT-04503, HT-07006, HT-09009, CML-11006, and MP-06503. TCLAD distributes through Digikey, Mouser, Arrow, and direct to fabricators. The product remains the most widely specified branded IMS laminate in North American and European power electronics and automotive applications.

Laird Tlam

Laird Performance Materials developed the Tlam (Thermally conductive laminate) system as a modular IMS substrate architecture. Unlike Bergquist’s finished laminate product, Laird’s approach centres on the Tlam PP (prepreg) — a B-stage ceramically filled dielectric film that fabricators can laminate with their own copper foils and aluminium or copper base plates. This gives fabricators more configuration flexibility than a finished laminate: copper weights from 0.5 oz to 4 oz, base plate thicknesses from 2.5 mm to 6 mm, and multi-layer constructions using the same prepreg. The flagship products are Tlam PP 1KA (3 W/m·K) and Tlam PP HTD (High Temperature Dielectric, targeting higher Tg applications). Laird is part of DuPont (acquisition completed 2019) and is primarily distributed through speciality IMS fabricators rather than standard electronics distributors.

AI Technology (AIT) Cool-Clad

AI Technology, Inc. (Princeton, New Jersey) is a materials company focused on thermal interface materials, conductive adhesives, and IMS substrates. Their IMS product line, Cool-Clad, is differentiated by its use of a flexible polymer dielectric without fiberglass reinforcement — in contrast to the fiberglass-filled epoxy used in Bergquist and Laird dielectrics. AIT claims this structure eliminates internal stress between the copper foil and metal base, reducing delamination risk under thermal cycling. Cool-Clad is available in two primary series: CXP Series (single-sided, high-performance MCPCB) and ESP Series (flexible circuit MCPCB). Base metals include aluminium and copper from 35 mil to 350 mil thickness; copper foil options are 1, 2, and 4 oz; the standard dielectric layer is 75 µm. AIT distributes primarily direct and through speciality US electronics materials distributors.

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Head-to-Head: Thermal Performance

Thermal conductivity values between brands are often quoted and compared directly, but this comparison is only meaningful when referenced to the same test method. Bergquist/TCLAD uses ASTM D5470 (steady-state method) as its reference standard for published conductivity and resistance values. Laird references the same ASTM D5470 for Tlam PP 1KA. AIT’s Cool-Clad specifications reference ASTM E1461 (laser flash method) for some configurations, which can produce different values than steady-state measurement for the same material. Engineers comparing datasheets should confirm which test method underlies the stated value before treating numbers as directly comparable.

Table 1: Thermal Performance Comparison — Bergquist vs Laird vs AI Technology

Product / Grade	Thermal Conductivity	Specific Thermal Resistance	Dielectric Thickness	Test Method
Bergquist HPL-03015	3.0 W/m·K	0.02 °C·in²/W	38 µm (1.5 mil)	ASTM D5470
Bergquist HT-04503	2.2 W/m·K	0.05 °C·in²/W	114 µm (4.5 mil)	ASTM D5470
Bergquist HT-07006	2.2 W/m·K	0.11 °C·in²/W	152 µm (6 mil)	ASTM D5470
Bergquist MP-06503	1.0 W/m·K	0.22 °C·in²/W	165 µm (6.5 mil)	ASTM D5470
Laird Tlam PP 1KA	3.0 W/m·K	~0.04 °C·in²/W (est.)	~100–150 µm (configurable)	ASTM D5470
Laird Tlam PP HTD	1.0–2.0 W/m·K	configurable	configurable	ASTM D5470
AIT Cool-Clad CXP	2.0–3.0 W/m·K	~0.08 °C·in²/W (est.)	75 µm standard	ASTM E1461
AIT Cool-Clad ESP	~1.5 W/m·K	configurable	flexible / thin	ASTM E1461
Generic IMS (reference)	0.8–1.5 W/m·K	0.15–0.50 °C·in²/W	80–150 µm	varies
FR-4 (reference)	0.25–0.35 W/m·K	~65 °C·in²/W at 1.6 mm	1,600 µm	—

For LED applications where the junction temperature budget is the most binding design constraint and operating voltage is below 48 V, Bergquist HPL-03015 and Laird Tlam PP 1KA both achieve 3.0 W/m·K at similar dielectric thicknesses and are the two strongest candidates. AIT Cool-Clad CXP at 75 µm is competitive but its test method difference makes direct comparison less certain without independent verification.

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Head-to-Head: Electrical Isolation

Breakdown voltage is the electrical property that most differentiates the three brands’ product ranges for power electronics applications. Bergquist’s HT series and CML series have the widest range of verified breakdown voltages of the three brands, which is why Bergquist is the preferred specification for high-voltage automotive, motor drive, and EV applications. Laird’s Tlam system offers high breakdown capability through configurable prepreg stacking, but the isolation is determined partly by the fabricator’s lamination process rather than a single factory-tested laminate configuration. AIT Cool-Clad’s breakdown voltage at 75 µm is adequate for low-to-moderate voltage applications but does not match Bergquist HT-09009’s 20 kVAC specification.

Table 2: Electrical Isolation Comparison — Bergquist vs Laird vs AI Technology

Product / Grade	Breakdown Voltage	Operating Voltage (typical guidance)	Tg	UL Recognised
Bergquist HPL-03015	2.5 kVAC	Up to ~12–48 V DC	185 °C	Yes
Bergquist HT-04503	11.0 kVAC	Up to 480 VAC / 400 VDC	>170 °C	Yes
Bergquist HT-07006	11.0 kVAC	Up to 480 VAC / 400 VDC	>150 °C	Yes
Bergquist HT-09009	20.0 kVAC	Up to 800 VDC EV	150 °C	Yes
Bergquist MP-06503	~3.0 kVAC	Up to 120 VAC / 170 VDC	~130 °C	Yes
Laird Tlam PP 1KA	High (configurable by thickness)	Depends on build configuration	High Tg (HTD version)	Varies by fabricator
Laird Tlam PP HTD	Higher (configurable)	Depends on build	Higher than 1KA	Varies by fabricator
AIT Cool-Clad CXP	Adequate at 75 µm	~12–48 V / 120 VAC class	N/A (flexible polymer)	Not standard

The critical distinction here is that Bergquist/TCLAD provides breakdown voltage as a specified, tested, lot-verified property of the finished laminate, with a TCLAD Certificate of Conformance. Laird’s breakdown voltage depends on the specific construction built by the fabricator — the prepreg provides the insulating material, but the final isolation performance is a function of the fabrication process and configuration, not a single laminate specification. This matters significantly for UL mark, automotive qualification, and medical device submissions where the dielectric breakdown specification must be traceable to a tested material lot.

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Head-to-Head: Multi-Layer and Construction Flexibility

This is where Laird Tlam has a structural competitive advantage over standard Bergquist Thermal Clad grades. Because the Tlam system is built around a B-stage prepreg film, fabricators can use it exactly as they use standard FR-4 prepreg — laminating multiple layers, building double-sided copper constructions, and integrating Tlam PP with standard FR-4 layers in the same stack. The Tlam DS double-sided core configuration provides a true two-signal-layer metal-core board without the special via isolation processes required by a standard MCPCB.

Table 3: Construction Flexibility Comparison

Feature	Bergquist Thermal Clad	Laird Tlam	AIT Cool-Clad
Single-sided MCPCB	Yes (primary use case)	Yes (Tlam SS)	Yes (CXP primary use)
Double-sided core	HT-09009, CML-11006 options	Yes (Tlam DS)	Yes (ESP double-sided)
Multi-layer with FR-4	Possible (complex process)	Native capability of system	Possible
Prepreg form available	No (finished laminate only)	Yes (Tlam PP, core product)	Yes (pre-preg sheet/roll)
Copper weight range	0.5 oz – 4 oz	0.5 oz – 4 oz	1 oz – 4 oz
Base plate thickness range	1.0 – 3.0 mm Al/Cu standard	2.5 – 6.0 mm Al/Cu	35 – 350 mil Al/Cu
Flexible circuit option	No	No (rigid only)	Yes (ESP Series)
Maximum base plate thickness	~3 mm standard	6 mm	350 mil (~9 mm)

For designs that require both signal routing density and thermal management — multi-layer boards where inner layers carry signal traces and the metal base handles heat from power devices — the Laird Tlam system’s prepreg architecture fits naturally into standard multi-layer PCB fabrication workflows. Bergquist’s CML-11006 and HT-09009 address multi-layer MCPCB from the laminate side, but the construction is more constrained and fabricator familiarity is lower. AIT Cool-Clad’s flexible ESP series serves a niche that neither Bergquist nor Laird addresses well: formed or curved LED strip applications where the IMS must follow a mechanical contour.

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Head-to-Head: Assembly Compatibility

All three brands are designed for SMT reflow assembly using standard convection ovens. The key differences emerge in temperature rating, AuSn compatibility, and reflow profile adjustment requirements.

Table 4: Assembly Compatibility Comparison

Property	Bergquist HT Series	Bergquist MP-06503	Laird Tlam PP 1KA	AIT Cool-Clad CXP
Lead-free SAC305	Yes	Yes	Yes	Yes
SnPb eutectic	Yes	Yes	Yes	Yes
AuSn eutectic (325 °C)	Yes	No (288 °C max)	Yes (High Tg version)	Yes (300 °C rated)
Max solder temperature	325 °C / 60 s	288 °C	325 °C (HTD version)	300 °C
Reflow oven profile adjustment	Yes (higher thermal mass)	Yes	Yes	Yes
HASL recommendation	Not preferred	Not preferred	Not preferred	Not preferred
ENIG compatibility	Yes	Yes	Yes	Yes
Rework limit (pad cycles)	~2 cycles	~2 cycles	~2 cycles	~2 cycles

AIT Cool-Clad’s 300 °C rating and flexible dielectric structure mean it is compatible with AuSn die-attach processes at moderate peak temperatures, though not quite at the 325 °C/60 s specification of Bergquist HT grades. For wire bonding applications — chip-on-board LED assembly where the LED die is directly bonded to the IMS substrate — AIT claims advantages from the flexible dielectric’s lower modulus and zero internal stress, which reduces die stress during curing and thermal cycling. This is a technically relevant claim for direct die attach, though it is less relevant for standard packaged-component SMT assembly.

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Fabricator Availability and Sourcing

This is the most practical differentiator for most engineering teams, and it is the one that brand specification datasheets naturally do not cover.

Table 5: Fabricator Availability and Supply Chain Comparison

Criterion	Bergquist / TCLAD	Laird Tlam	AIT Cool-Clad
Distributor availability	Digikey, Mouser, Arrow	Specialty distributors only	Direct and US specialty distributors
Number of qualified fabricators (est.)	High (widely stocked globally)	Moderate (prepreg system, fewer adopters)	Lower (specialty US market primarily)
Datasheet / CoC traceability	Full TCLAD lot CoC standard	Prepreg CoC from Laird; final board CoC varies	Direct CoC from AIT
Quick-turn prototype availability	Yes (common grades at US/Asia fabricators)	Limited quick-turn	Limited quick-turn
RoHS compliance	Yes, all grades	Yes	Yes
UL material recognition	Yes, all grades (TCLAD listing)	Varies by fabricator build	Not standard
Automotive IATF 16949 supply chain	Multiple fabricators qualified	Fewer qualified fabricators	Limited

The fabricator availability gap is the most significant practical constraint distinguishing Bergquist/TCLAD from the other two brands for most engineering projects. Because TCLAD distributes finished laminate through major electronics distributors, any qualified MCPCB fabricator can purchase the laminate and build to specification. For Laird Tlam, the fabricator must have the prepreg lamination process qualified — not all MCPCB fabricators do. For AIT Cool-Clad, the supply chain is primarily US-centric, and fabricators outside the US market are less likely to stock or be qualified on Cool-Clad material.

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Application Decision Matrix

The three brands serve different primary use cases with enough overlap in the middle that a direct comparison for any given application is worth doing. The table below summarises the most common application scenarios and which brand is the strongest fit.

Table 6: Application Fit by Brand

Application	Bergquist / TCLAD	Laird Tlam	AIT Cool-Clad
High-power LED (12–48 V)	HPL-03015 — first choice	Tlam PP 1KA — competitive	CXP — competitive
High-bay / street lighting	HT-04503 — preferred	Tlam PP 1KA — competitive	CXP — adequate
Automotive LED headlamp (AEC-Q200)	HT-04503 / HT-07006 — first choice	Possible, fewer qualified fabricators	Not standard automotive
EV traction (400–800 VDC)	HT-07006 / HT-09009 — first choice	Tlam PP HTD stacked — possible	Not preferred
Motor drives (240–480 VAC)	HT-04503 / HT-07006 — first choice	Tlam PP 1KA / HTD — competitive	CXP — limited isolation
Multi-layer power + signal routing	CML-11006 / HT-09009 — adequate	Tlam DS — first choice	ESP DS — competitive
Curved LED / flexible form factor	Not available	Not available	ESP Series — first choice
Direct die attach / wire bond	HT series — adequate	Tlam 1KA — adequate	CXP — claimed advantage
UL-certified end product	TCLAD material listing — direct path	Fabricator-dependent	Not standard
Medical device (ISO 13485)	Multiple qualified fabricators	Fewer options	Limited

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Which IMS Brand Should You Specify?

The answer depends on what your design actually requires from the dielectric. Here is a practical framework for the three most common decision contexts.

If your design is a single-layer LED or low-voltage power electronics board below 48 V, all three brands are technically capable. The decision comes down to fabricator availability and prototype lead time. Bergquist HT-04503 or MP-06503 wins on fabricator availability. Laird Tlam PP 1KA wins on thermal performance for high-power LED if your fabricator already works with the Tlam system. AIT Cool-Clad CXP is a strong choice if you are working with an AIT-qualified US fabricator and want stress-minimised flexible dielectric for direct die assembly.

If your design is automotive, high-voltage (>100 V), or requires UL recognition, Bergquist Thermal Clad is the strongest specification with the clearest supply chain path. The HT series breakdown voltages are specified as lot-tested laminate properties, UL recognition flows directly from TCLAD material listings, and the number of IATF 16949-certified fabricators stocking TCLAD material is larger than for the other two brands. Laird Tlam can meet the technical requirements if you have a fabricator qualified on the HTD system, but the procurement and qualification path is longer.

If your design requires multi-layer construction with both signal routing density and thermal management, Laird Tlam’s prepreg architecture is the most natural fit because it integrates into standard multi-layer PCB fabrication rather than requiring special processes. AIT Cool-Clad ESP is relevant for flexible or curved multi-layer constructions. Bergquist CML-11006 or HT-09009 addresses multi-layer MCPCB but with a more constrained fabrication process.

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Useful Resources for IMS PCB Brand Comparison

Resource	Description	Link
TCLAD Inc.	Official Bergquist Thermal Clad manufacturer; product range, distributors, technical support	tclad.com
Bergquist Thermal Clad Selection Guide	Grade specifications, thermal performance charts, application guidance	Digikey PDF
Laird Tlam Product Page	Tlam PP 1KA, Tlam PP HTD, Tlam SS/DS system overview	laird.com/products/thermal-interface-materials/tlam-thermally-conductive-pcb-system
AI Technology Cool-Clad Page	CXP and ESP series product details, thermal specs, lamination guidelines	aitechnology.com
ASTM D5470 Thermal Resistance Test	Test method used for Bergquist and Laird thermal conductivity values	ASTM.org
IPC-6012 Rigid PCB Qualification	MCPCB acceptance criteria and hipot test requirements	IPC.org
Bergquist HT-04503 Datasheet	Full specification for the most widely used HT-series grade	MCLPCB PDF
Bergquist HPL-03015 Datasheet	Full specification for the highest-k LED grade	MCLPCB PDF

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5 FAQs: Bergquist vs Laird vs AI Technology IMS PCB

Q1: Is Laird Tlam technically better than Bergquist Thermal Clad?

Neither brand is universally “better” — they have different architectural philosophies. Bergquist/TCLAD provides a finished laminate with lot-tested properties, a defined UL material recognition path, and the largest fabricator distribution network. Laird Tlam provides a flexible prepreg system that gives fabricators more construction freedom, particularly for multi-layer and heavy-base applications. At peak thermal conductivity (3 W/m·K for Tlam PP 1KA and Bergquist HPL-03015), both brands deliver comparable dielectric thermal performance. The practical advantage of Bergquist is supply chain simplicity and qualification path for regulated markets. The practical advantage of Laird Tlam is construction flexibility for complex multi-layer or heavy-base configurations.

Q2: Can I switch from Bergquist Thermal Clad to AIT Cool-Clad on an existing design without re-qualification?

Not without some level of re-qualification. The differences in dielectric formulation (fiberglass-filled epoxy vs. flexible polymer), test methods (ASTM D5470 vs. E1461), and breakdown voltage specifications mean that a substitution changes the material’s qualified properties, not just the brand name. For a consumer LED product without a formal regulatory submission, the practical risk is manageable and thermal performance can be bench-verified. For any automotive, medical, or UL-certified product, the substitution requires re-testing against the applicable standard’s material requirements, and the qualification work is essentially a new material qualification — not a minor change.

Q3: Which brand is preferred for EV power electronics at 800 VDC bus voltage?

Bergquist HT-09009, with its 20 kVAC tested breakdown voltage, is the clearest specification for 800 VDC bus applications with adequate isolation safety factor. Laird Tlam PP HTD in a stacked configuration can potentially meet the isolation requirement, but the breakdown voltage specification depends on the fabricator’s confirmed construction — it is not a single laminate datasheet value. AIT Cool-Clad does not have a grade currently positioned for 800 VDC bus isolation requirements.

Q4: Is AI Technology Cool-Clad available for prototype orders from standard PCB fabricators?

AIT Cool-Clad is primarily distributed in the US market through AIT directly and through a smaller network of speciality MCPCB fabricators compared to Bergquist/TCLAD. For standard quick-turn prototype services from online PCB services (JLCPCB, PCBWay, etc.), AIT Cool-Clad is not typically a listed material option. If you need a Cool-Clad prototype, the most reliable path is to contact AIT directly for fabricator referrals. For Bergquist HT-04503 or HT-07006 prototypes, US fabricators like ASC International and multiple offshore MCPCB houses stock the material and can run quick-turn prototypes.

Q5: Does Laird Tlam PP 1KA have the same UL material recognition as Bergquist Thermal Clad?

Laird Tlam PP 1KA does not carry the same standalone UL material recognition structure as Bergquist Thermal Clad. Because Tlam is a prepreg system that fabricators use to build finished laminates (rather than a pre-manufactured finished laminate), UL recognition depends on the specific fabricator’s construction and their individual recognition application. This contrasts with Bergquist/TCLAD’s model, where the finished laminate carries UL recognition and the fabricated PCB inherits it when authentic TCLAD laminate is used. For products where UL material recognition is a regulatory requirement — rather than just a preference — this difference has real procurement implications.

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For Bergquist Thermal Clad grade specifications, application selection guidance, and sourcing information, the Bergquist PCB reference page is the most useful starting point.