Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1276C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1276C belongs to the renowned Xilinx Spartan-II family, designed to provide a cost-effective alternative to high-end FPGAs without sacrificing performance. As industries move toward more complex logic integration, this Field Programmable Gate Array (FPGA) offers a robust solution for high-volume consumer electronics, telecommunications, and industrial control systems.

By leveraging a 0.22µm/0.18µm process, the XC2S200-6FGG1276C delivers a perfect balance of low power consumption and high logic density. Below, we explore the technical specifications, key features, and application benefits of this specific component.

Key Features of the XC2S200-6FGG1276C FPGA

The Spartan-II series is engineered for efficiency. The XC2S200-6FGG1276C stands out due to its flexible architecture and versatile I/O capabilities.

  • High Logic Capacity: Features 200,000 system gates, making it suitable for complex digital signal processing and logic integration.

  • Flexible I/O Standards: Supports multiple I/O standards, including LVTTL, LVCMOS, and PCI, ensuring seamless integration with various system components.

  • Advanced Memory Architecture: Includes dedicated Block RAM and distributed RAM for efficient data buffering and storage.

  • Low Power Consumption: Optimized for 2.5V core voltage operation, reducing thermal management requirements.

Technical Specifications Table

To better understand the capabilities of the XC2S200-6FGG1276C, refer to the detailed technical parameters below:

Parameter Specification
Series Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array (Row x Col) 28 x 42
Total Block RAM 56,384 bits
Maximum User I/O Variable by Package
Core Supply Voltage 2.5V
Operating Temperature 0°C ~ 85°C (Commercial)
Speed Grade -6

Architectural Advantages of Spartan-II Technology

The XC2S200-6FGG1276C utilizes a segmented architecture that allows for high-speed routing and predictable timing. This is critical for developers working on time-sensitive applications.

Efficient Logic Block Utilization

Each Configurable Logic Block (CLB) in the XC2S200 series contains two slices, providing four 4-input look-up tables (LUTs). This structure allows for the implementation of any arbitrary logic function, providing developers with immense design flexibility.

Integrated Block RAM

Storage is a vital component of modern FPGA design. The XC2S200-6FGG1276C features 14 dedicated 4,096-bit RAM blocks. These can be configured as single-port or dual-port memory, which is ideal for FIFO buffers and circular queues in networking applications.

Packaging and Thermal Management

The FGG1276 designation refers to the Fine-Pitch Ball Grid Array (FBGA) package. This lead-free (Pb-free) packaging is designed to meet modern environmental standards while providing a high density of interconnects in a small physical footprint.

Proper PCB layout is essential for managing the thermal characteristics of the XC2S200-6FGG1276C. High-speed switching can generate localized heat, so utilizing internal ground planes for heat dissipation is highly recommended.

Applications of the XC2S200-6FGG1276C

Because of its versatility and competitive pricing, this FPGA is found in a wide variety of sectors:

  1. Industrial Automation: Used for motor control, sensor interfacing, and PLC logic.

  2. Consumer Electronics: Providing logic for display controllers and digital imaging.

  3. Communication Systems: Implementing bridge logic between different protocol standards.

  4. Legacy System Support: Replacing obsolete ASIC designs with programmable logic.

Why Choose Xilinx FPGA Solutions?

Selecting the right silicon provider is as important as the part itself. Xilinx has long been a leader in the programmable logic space, offering extensive tool support through ISE and Vivado design suites. When sourcing parts for your next project, it is vital to work with reliable distributors who understand the nuances of the Xilinx FPGA ecosystem.

Conclusion

The XC2S200-6FGG1276C remains a reliable choice for engineers who require a proven, stable, and cost-effective FPGA solution. Its combination of 200k gates, dedicated RAM, and low power requirements ensures it can handle the demands of modern digital design while maintaining a small system footprint.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.