Meta Description: Buy XC2S200-6FGG1270C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, -6 speed grade, 1270-pin FBGA package, and 2.5V operation. Full specs, datasheet, and applications guide.
What Is the XC2S200-6FGG1270C?
The XC2S200-6FGG1270C is a commercial-grade Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan®-II family. It combines 200,000 system gates, 5,292 configurable logic cells, and a high-density 1270-pin Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most I/O-rich variants in the XC2S200 series. The “-6” speed grade represents the fastest commercially available grade for the Spartan-II family, and the “C” suffix confirms a commercial temperature range (0°C to +85°C) operation.
Designed by Xilinx (now AMD), the Spartan-II series was engineered to deliver ASIC-level performance without the high NRE costs, long development cycles, or inflexibility of mask-programmed chips. The XC2S200-6FGG1270C is an ideal solution for engineers who need maximum pin count in legacy or sustaining designs across telecommunications, industrial automation, and embedded processing applications.
For a broader overview of the Spartan-II product line, visit our Xilinx FPGA resource page.
XC2S200-6FGG1270C Key Specifications at a Glance
| Parameter |
Value |
| Part Number |
XC2S200-6FGG1270C |
| Manufacturer |
Xilinx (AMD) |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 total CLBs) |
| Speed Grade |
-6 (Fastest Commercial) |
| Max Operating Frequency |
263 MHz |
| Core Voltage (VCCINT) |
2.5V |
| Package Type |
FBGA (Fine-Pitch BGA) |
| Pin Count |
1,270 |
| Temperature Range |
0°C to +85°C (Commercial) |
| Process Technology |
0.18 µm |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
| RoHS Compliance |
Pb-Free (“G” in part number) |
XC2S200-6FGG1270C Part Number Decoder
Understanding the part number helps buyers confirm they are ordering the correct variant. Below is a breakdown of each field in XC2S200-6FGG1270C:
| Field |
Characters |
Meaning |
| Device Family |
XC2S |
Xilinx Spartan-II |
| Gate Count |
200 |
200,000 system gates |
| Speed Grade |
-6 |
Fastest commercial grade |
| Package Code |
FGG |
Fine-Pitch Ball Grid Array, Pb-Free |
| Pin Count |
1270 |
1,270 ball pins |
| Temperature |
C |
Commercial (0°C to +85°C) |
Note: The double “G” in FGG (vs. FG) confirms Pb-free (lead-free) packaging, in line with RoHS requirements. The -6 speed grade is exclusively available in the commercial temperature range for Spartan-II devices.
Spartan-II XC2S200 Family Comparison Table
The XC2S200 is the largest and most capable device in the Spartan-II lineup. The table below compares all six members of the family:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 tops the family with the largest CLB array (28×42), the most logic cells (5,292), and the highest distributed and block RAM capacity — making it the right choice for dense, high-throughput designs.
XC2S200-6FGG1270C Package Options: FGG1270 vs. Other XC2S200 Packages
The XC2S200 die is available in multiple packages. The FGG1270 (1270-pin FBGA) stands out as the highest pin-count option, offering the most I/O flexibility for complex multi-bus or high-channel-count designs.
| Package Code |
Package Type |
Pin Count |
Typical Use Case |
| PQ208 / PQG208 |
PQFP |
208 |
Lower I/O, through-hole friendly |
| FG256 / FGG256 |
FBGA |
256 |
Compact BGA, moderate I/O |
| FG456 / FGG456 |
FBGA |
456 |
Mid-range BGA designs |
| FGG1270 |
FBGA |
1,270 |
Maximum I/O, high-density PCB |
Core Architecture: What Powers the XC2S200-6FGG1270C
Configurable Logic Blocks (CLBs)
The XC2S200 contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture supports both combinational logic and synchronous sequential design, forming the backbone of any FPGA implementation.
Block RAM
With 56K bits of dedicated block RAM, the XC2S200-6FGG1270C supports on-chip storage for FIFOs, lookup tables, and data buffers — eliminating the latency penalties of external memory access for small datasets.
Distributed RAM
The device provides 75,264 bits of distributed RAM embedded within the CLB fabric. Distributed RAM enables fast, single-cycle read access that is critical in data path designs and high-speed pipelines.
Delay-Locked Loops (DLLs)
Four on-chip DLLs — one at each corner of the die — provide precise clock management. DLLs allow clock deskew, phase shifting, frequency division, and duty-cycle correction, which are essential features for synchronous high-speed designs.
Input/Output Blocks (IOBs)
The IOBs support multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL, offering broad compatibility with external peripherals, buses, and interfaces. Each IOB features programmable slew rate control, drive strength, and optional pull-up or pull-down resistors.
XC2S200-6FGG1270C Electrical Characteristics
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply Voltage (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Supply Voltage (VCCO) |
— |
2.5 / 3.3 |
— |
V |
| Input High Voltage (VIH) |
2.0 |
— |
VCCO+0.5 |
V |
| Input Low Voltage (VIL) |
−0.5 |
— |
0.8 |
V |
| Operating Temperature |
0 |
— |
+85 |
°C |
| Maximum System Frequency |
— |
— |
263 |
MHz |
Supported I/O Standards
The XC2S200-6FGG1270C supports a wide range of I/O signaling standards, making it highly interoperable with both legacy and modern logic families:
| I/O Standard |
Voltage |
Application |
| LVTTL |
3.3V |
General-purpose logic |
| LVCMOS |
2.5V / 3.3V |
Low-power logic interfaces |
| PCI |
3.3V |
PCI bus interfacing |
| GTL / GTL+ |
1.2V / 1.5V |
High-speed bus |
| HSTL Class I/II |
1.5V |
Memory interfaces |
| SSTL2 / SSTL3 |
2.5V / 3.3V |
SDRAM/QDRAM interfaces |
Ordering Information: XC2S200-6FGG1270C vs. Related Parts
| Part Number |
Speed Grade |
Package |
Pins |
Temp Range |
Pb-Free |
| XC2S200-5FGG1270C |
-5 |
FBGA |
1270 |
Commercial |
Yes |
| XC2S200-6FGG1270C |
-6 |
FBGA |
1270 |
Commercial |
Yes |
| XC2S200-6FG456C |
-6 |
FBGA |
456 |
Commercial |
No |
| XC2S200-6FGG456C |
-6 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-6PQ208C |
-6 |
PQFP |
208 |
Commercial |
No |
| XC2S200-5FG456I |
-5 |
FBGA |
456 |
Industrial |
No |
When sourcing the XC2S200-6FGG1270C, confirm the double-G “FGG” designation for Pb-free compliance and verify the 1270 pin count, as several similar part numbers exist with different packages.
Top Applications for the XC2S200-6FGG1270C
#### 1. Telecommunications & Baseband Processing
The XC2S200-6FGG1270C’s 263 MHz maximum operating frequency and large CLB array make it well-suited for baseband signal processing, FEC encoding/decoding, and protocol bridging in telecom line cards and SONET/SDH equipment.
#### 2. Industrial Automation & Motor Control
With 284 available user I/Os (even more accessible in the 1270-pin package), engineers can directly interface with a large number of encoders, DACs, ADCs, and sensor outputs without external I/O expanders. The programmable nature of the device also allows in-field logic updates without hardware swap-out.
#### 3. High-Speed Data Acquisition
The combination of on-chip DLLs, high-frequency operation, and distributed RAM makes the XC2S200-6FGG1270C ideal for multi-channel ADC front-ends, logic analyzers, and oscilloscope front-end designs requiring real-time data capture and buffering.
#### 4. Embedded Vision & Image Processing
With 75,264 bits of distributed RAM and 56K bits of block RAM, image processing pipelines — including pixel buffering, filter kernels, and histogram engines — can be implemented efficiently on-chip with minimal external SRAM.
#### 5. Legacy System Sustaining / Board Repair
Because the XC2S200-6FGG1270C is programmable, it serves as a drop-in programmable replacement for multiple discrete logic chips or glue logic in legacy board repair and sustaining engineering programs.
Design Tools & Programming Support
#### Supported Design Software
The XC2S200-6FGG1270C is supported by Xilinx ISE Design Suite (the primary toolchain for Spartan-II devices). Key tools include:
- Xilinx ISE – Synthesis, place & route, and bitstream generation
- XST (Xilinx Synthesis Technology) – RTL synthesis engine within ISE
- ModelSim / ISIM – Behavioral and post-route simulation
- iMPACT – JTAG-based programming and configuration
Note: Vivado Design Suite does not support Spartan-II devices. ISE 14.7 (the final ISE release) remains the recommended tool for this device.
#### Configuration Interfaces
| Interface |
Description |
| JTAG (IEEE 1149.1) |
Boundary scan and in-circuit programming |
| Master Serial |
SPI-compatible serial configuration from PROM |
| Slave Serial |
Serial bitstream from external controller |
| SelectMAP |
8-bit parallel configuration mode |
Advantages Over Mask-Programmed ASICs
The XC2S200-6FGG1270C offers several practical advantages over conventional ASICs for low-to-mid volume designs:
| Factor |
ASIC |
XC2S200-6FGG1270C (FPGA) |
| NRE Cost |
$500K–$5M+ |
$0 |
| Design Cycle |
6–18 months |
Weeks |
| Field Updatable |
No |
Yes (via JTAG/PROM) |
| Minimum Order |
10,000+ units |
1 unit |
| Risk of Respins |
High |
None |
This programmability advantage is particularly significant in prototyping, low-volume production, and applications requiring periodic logic updates.
Frequently Asked Questions (FAQ)
#### Q: What is the difference between XC2S200-6FGG1270C and XC2S200-5FGG1270C?
The only difference is the speed grade. The -6 variant is the faster of the two, supporting up to 263 MHz system operation. The -5 variant operates at a slightly lower maximum frequency. Both parts share the same 1270-pin FBGA package and commercial temperature range.
#### Q: Is XC2S200-6FGG1270C RoHS compliant?
Yes. The double-G “FGG” in the part number specifically denotes Pb-free (lead-free) packaging, confirming RoHS compliance.
#### Q: What is the difference between XC2S200-6FGG1270C and XC2S200E devices?
The XC2S200E belongs to the Spartan-IIE family, an enhanced version with improved speed and additional I/O standards. The XC2S200-6FGG1270C is a Spartan-II device. The two families are not pin-compatible and use different software configurations.
#### Q: Can the XC2S200-6FGG1270C be reconfigured in the field?
Yes. The device supports full in-system reconfiguration via JTAG or through an external configuration PROM, enabling logic updates without physical hardware replacement.
#### Q: Is the -6 speed grade available in industrial temperature range?
No. Per Xilinx’s official datasheet, the -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). Industrial temperature range (-40°C to +85°C) parts are only available in -4 and -5 speed grades.
Summary
The XC2S200-6FGG1270C is the fastest, highest-pin-count commercial variant of the Xilinx Spartan-II XC2S200 FPGA. It offers 200,000 system gates, 5,292 logic cells, 263 MHz operation, and an expansive 1270-pin Pb-free FBGA package. Backed by four on-chip DLLs, 75K bits of distributed RAM, 56K bits of block RAM, and a comprehensive set of supported I/O standards, it remains a capable platform for telecom, industrial, and embedded processing designs — particularly in legacy system sustaining and high-I/O applications.
For sourcing, datasheets, and compatible Xilinx FPGA alternatives, browse our complete Xilinx FPGA catalog.
