The XC2S200-6FGG1267C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. Designed for engineers who need powerful, reconfigurable digital logic at a cost-effective price point, this device delivers 200,000 system gates, 5,292 logic cells, and a large 1,267-pin Fine-Pitch Ball Grid Array (FGG) package — making it one of the most capable variants in the XC2S200 lineup. Whether you are developing industrial control systems, telecommunications hardware, or embedded processing platforms, the XC2S200-6FGG1267C offers the logic density, I/O flexibility, and clock performance your design demands.

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What Is the XC2S200-6FGG1267C? Part Number Breakdown

Understanding the part number helps buyers quickly confirm they have the right component:

Key Takeaway: The “G” in “FGG” confirms this is the RoHS-compliant, Pb-free package version — an important compliance detail for modern electronics manufacturing.

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XC2S200-6FGG1267C Core Specifications

The table below summarizes the most critical electrical and logic specifications for the XC2S200-6FGG1267C.

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XC2S200-6FGG1267C Detailed Technical Features

Configurable Logic Blocks (CLBs) — The Heart of the FPGA

The XC2S200 contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains:

• Look-Up Tables (LUTs) for implementing combinational logic functions
• Flip-Flops for sequential/registered logic
• Multiplexers enabling flexible routing between logic elements
• Carry and Arithmetic Logic for efficient adder and counter implementations

This CLB architecture enables engineers to implement virtually any digital logic function — from simple decoders to complex state machines — entirely within reconfigurable fabric.

Embedded Block RAM — Fast On-Chip Memory

The XC2S200-6FGG1267C includes 56K bits of dedicated Block RAM organized in two columns on the die. Block RAM provides:

• True dual-port access for simultaneous read/write operations
• High-speed, synchronous memory for FIFOs, lookup tables, and data buffers
• Independent width configuration on each port

In addition to Block RAM, the distributed RAM embedded within CLBs adds 75,264 bits of fast logic-level memory, bringing total on-chip memory resources to over 131,000 bits.

Delay-Locked Loops (DLLs) — Precision Clock Management

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide robust clock management capabilities:

• Clock de-skewing to minimize setup/hold timing violations
• Frequency synthesis (divide and multiply)
• Phase shifting for multi-phase clock generation
• Elimination of clock distribution delay across the device

DLLs are essential for high-speed designs in telecommunications, memory interfaces, and synchronous data processing.

Input/Output Blocks (IOBs) — Flexible Interface Support

With up to 284 user I/O pins, the FGG1267 package gives designers substantial interface flexibility. IOB features include:

• Programmable drive strength and slew rate control
• Support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL, SSTL, etc.)
• Optional internal pull-up, pull-down, and keeper circuits
• Boundary Scan (JTAG IEEE 1149.1) support for board-level testing

Configuration Modes

The XC2S200-6FGG1267C supports multiple configuration options for maximum system flexibility:

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Speed Grade -6: What Does It Mean for Your Design?

The -6 speed grade is the highest (fastest) speed grade available in the Spartan-II family, and it is exclusively available in the Commercial temperature range. A faster speed grade means:

• Shorter propagation delays through CLBs and routing
• Higher maximum clock frequency for your design
• Ability to meet tighter timing constraints in critical-path logic
• Better performance in high-throughput data processing applications

For designs that do not require the maximum speed grade, -5 and -4 variants are available in both Commercial and Industrial temperature ranges.

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Spartan-II Family Comparison Table

The XC2S200 sits at the top of the Spartan-II family. Here is how it compares to other devices in the lineup:

The XC2S200 offers the highest gate count, the most logic cells, the most I/O, and the largest embedded memory in the Spartan-II family — making it the best choice for complex designs where logic density is critical.

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Common Applications for the XC2S200-6FGG1267C

The combination of high logic density, ample I/O, and fast speed grade makes the XC2S200-6FGG1267C well suited for demanding applications across multiple industries:

Industrial Automation & Motor Control

High CLB count supports complex PID loops, multi-axis motor control algorithms, and real-time sensor data acquisition.

Telecommunications & Networking

DLLs and fast I/O standards enable implementation of serial data interfaces, protocol bridges, and line-rate packet processing.

Embedded Processing & DSP

Distributed RAM and Block RAM resources support soft-processor cores (e.g., PicoBlaze) and digital signal processing pipelines.

Medical Electronics

The device’s reconfigurability and high reliability make it appropriate for imaging systems, diagnostic instrument controllers, and patient monitoring equipment.

Defense & Aerospace

High-density logic with JTAG boundary scan supports mission-critical applications requiring in-field reconfiguration and rigorous testability.

Prototyping & ASIC Emulation

The Spartan-II family was specifically designed as a superior, lower-risk alternative to mask-programmed ASICs — field-programmable upgrades eliminate costly silicon respins.

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XC2S200-6FGG1267C vs. Similar Part Numbers

Buyers frequently encounter closely related part numbers. The table below clarifies key differences:

When searching for this component, note that “FGG” (with the extra G) denotes the Pb-free package, while “FG” without the second G indicates the standard (non-Pb-free) version.

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Development Tools & Software Support

The XC2S200-6FGG1267C is supported by Xilinx (now AMD) design tools. For legacy Spartan-II devices, the recommended design environment is:

• Xilinx ISE Design Suite — The primary synthesis, implementation, and bitstream generation tool for Spartan-II devices
• ChipScope Pro — In-circuit debug and signal analysis
• CORE Generator — IP core generation for common functions (FIFOs, memories, DSP blocks)
• ModelSim / ISim — RTL and gate-level simulation

Note: Spartan-II devices are not supported in the newer Vivado Design Suite. ISE 14.7 is the final supported version for this device family.

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Why Choose a Spartan-II FPGA Over an ASIC?

For designs that require significant digital logic without the cost and risk of a custom silicon tape-out, the XC2S200-6FGG1267C provides compelling advantages:

• No NRE (Non-Recurring Engineering) costs — eliminate mask set fees that can run $500K–$5M+ for ASICs
• Shorter time to market — design, synthesize, and deploy in weeks, not months
• In-field reconfigurability — update logic post-deployment without hardware replacement
• Risk reduction — iterate on design bugs without ordering new silicon

For volume production and mixed-signal requirements, an ASIC may eventually be justified. However, for development, low-to-mid volume production, and prototyping, the Spartan-II FPGA remains a proven, cost-effective choice.

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Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1267C? The XC2S200 Spartan-II family can achieve system clock frequencies up to approximately 200–263 MHz depending on the specific logic path and speed grade. The -6 speed grade delivers the highest performance in this family.

Q: Is the XC2S200-6FGG1267C RoHS compliant? Yes. The “G” suffix in “FGG” confirms this is the Pb-free, RoHS-compliant package.

Q: What is the operating temperature range? The “C” suffix denotes Commercial temperature range: 0°C to +85°C. Industrial temperature range (-40°C to +100°C) versions carry an “I” suffix, though speed grade -6 is only available in the Commercial range.

Q: Can the XC2S200-6FGG1267C be reprogrammed in the field? Yes. Like all Spartan-II FPGAs, the XC2S200 uses SRAM-based configuration that is reloaded at power-up from an external configuration source (e.g., serial PROM). The design can be updated by simply replacing the configuration bitstream.

Q: What is the core supply voltage? The XC2S200-6FGG1267C operates on a 2.5V core supply voltage (VCCINT = 2.5V). I/O banks support separate VCCO voltages for interfacing with 3.3V, 2.5V, and other logic families.

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Where to Buy the XC2S200-6FGG1267C

The XC2S200-6FGG1267C can be sourced from authorized distributors and specialty component suppliers. When purchasing, verify:

1. Exact part number — confirm FGG1267 package and -6 speed grade
2. Date code and lot traceability — important for production builds
3. RoHS/Pb-free compliance documentation if required by your product certification
4. Warranty and return policy — especially for obsolete or end-of-life components

For a comprehensive selection of Xilinx FPGA components including the XC2S200 series and the full Spartan-II family, PCBSync offers competitive pricing and verified inventory.

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Summary: XC2S200-6FGG1267C at a Glance

The XC2S200-6FGG1267C remains a capable, field-proven FPGA for engineers working with legacy Spartan-II designs or seeking a cost-effective high-density programmable logic device. Its combination of 200K gates, 284 I/O pins, abundant on-chip memory, and the high-performance -6 speed grade in the large FGG1267 package make it the most capable member of the Spartan-II family.