Meta Description: Buy the XC2S200-6FGG1266C Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, speed grade -6, and 1,266-pin FBGA package. Full specs, features, and applications guide.
Focus Keyword: XC2S200-6FGG1266C

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The XC2S200-6FGG1266C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for engineers who need a powerful yet affordable programmable logic solution, this device delivers 200,000 system gates, 5,292 logic cells, and a large 1,266-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re developing communications equipment, industrial automation systems, or embedded processing platforms, the XC2S200-6FGG1266C offers the performance, flexibility, and I/O density to meet demanding design requirements.

For a broader look at the full Xilinx programmable logic portfolio, visit Xilinx FPGA.

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What Is the XC2S200-6FGG1266C?

The XC2S200-6FGG1266C is a member of the Xilinx Spartan-II FPGA family, manufactured on an advanced 0.18µm CMOS process technology. The part number breaks down as follows:

The Spartan-II family was designed as a cost-effective alternative to mask-programmed ASICs, offering full in-field reprogrammability without the non-recurring engineering (NRE) costs associated with custom silicon.

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XC2S200-6FGG1266C Key Specifications

Core Logic Resources

Device Performance

Package Information

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XC2S200-6FGG1266C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1266C is its array of 1,176 Configurable Logic Blocks (CLBs), arranged in a 28×42 grid. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinational or sequential logic function. This architecture provides engineers with an exceptionally flexible design canvas for building custom digital circuits.

Block RAM and Distributed Memory

Embedded Block RAM

The XC2S200-6FGG1266C includes 56K bits of dedicated Block RAM, arranged in two columns on opposite sides of the die. Block RAM is ideal for FIFOs, data buffers, look-up tables, and local memory storage within FPGA designs.

Distributed RAM

In addition to Block RAM, the device supports 75,264 bits of distributed RAM, built from the LUT resources within the CLB array. This provides flexible, fine-grained memory resources that can be placed close to the logic that uses them.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1266C incorporates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs support clock deskewing, frequency synthesis, and phase shifting, enabling precise clock management across complex multi-clock designs.

Input/Output Blocks (IOBs)

The device features a rich set of programmable Input/Output Blocks (IOBs) along the perimeter of the die. IOBs support multiple I/O standards, including LVTTL, LVCMOS, GTL, SSTL, and more, giving designers maximum flexibility in interfacing with external components.

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Spartan-II Family Comparison Table

The XC2S200-6FGG1266C is the largest and most capable device in the Spartan-II lineup. The table below shows how it compares to smaller family members:

The XC2S200-6FGG1266C’s 1,266-pin FBGA package allows access to a high number of I/O pins, making it ideal for designs that need to interface with multiple buses, peripherals, or high-bandwidth external devices simultaneously.

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Configuration Modes

The XC2S200-6FGG1266C supports multiple configuration modes to suit different system architectures:

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, ensuring safe operation during system startup.

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Top Applications for the XC2S200-6FGG1266C

Communications and Networking

The XC2S200-6FGG1266C’s high gate count, fast speed grade, and large I/O pin count make it an excellent choice for implementing communication protocols, network interface cards, and data routing functions. Its ability to handle high-speed data processing with multiple simultaneous I/O interfaces addresses the demands of modern communications equipment.

Industrial Automation and Control

In industrial environments, the XC2S200-6FGG1266C is used for motor control, process automation, and real-time control systems. Its in-field reprogrammability means that control algorithms can be updated or upgraded without requiring hardware changes, reducing system lifecycle costs.

Embedded Processing Platforms

Designers can implement soft-core processor systems inside the XC2S200-6FGG1266C, combining custom logic peripherals with embedded processing in a single programmable device.

Medical and Diagnostic Equipment

The reliability, reconfigurability, and high I/O density of the XC2S200-6FGG1266C support medical imaging systems, patient monitoring devices, and diagnostic instruments where precise digital control is critical.

Security and Surveillance Systems

For applications requiring high data integrity and parallel processing, such as biometric identification, surveillance systems, and access control platforms, the XC2S200-6FGG1266C delivers the logic density and speed needed.

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XC2S200-6FGG1266C vs. Other Package Variants

The XC2S200 silicon is available in multiple packages. The FGG1266 is the largest package option, providing access to the maximum number of user I/O pins. Here is a comparison of common XC2S200 package variants:

The FGG1266 package is particularly suited for applications requiring maximum I/O expansion, high-pin-count PCB designs, and designs that benefit from the Pb-free construction for RoHS compliance.

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Why Choose the XC2S200-6FGG1266C Over an ASIC?

One of the most compelling advantages of the XC2S200-6FGG1266C is its position as a programmable alternative to custom ASICs. The key advantages include:

• No NRE Costs – There are no non-recurring engineering expenses associated with mask creation or fabrication, making prototyping and low-volume production significantly more cost-effective.
• Faster Time-to-Market – FPGA-based designs can be developed, tested, and deployed far faster than custom ASICs, which require lengthy fabrication cycles.
• In-Field Reprogrammability – Design updates, bug fixes, and feature additions can be deployed remotely by reconfiguring the device, something that is impossible with mask-programmed ASICs.
• Reduced Design Risk – FPGA designs can be fully simulated and tested before deployment, lowering the risk of costly silicon respins.

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Design Tools and Software Support

The XC2S200-6FGG1266C is supported by Xilinx’s ISE Design Suite, which provides a complete RTL-to-bitstream design flow including:

• HDL Synthesis (VHDL / Verilog)
• Place and Route
• Timing Analysis and Simulation
• Bitstream Generation and Configuration

While the newer Vivado Design Suite is optimized for 7-Series and later Xilinx devices, the ISE Design Suite remains the primary tool for Spartan-II development.

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Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1266C?

The -6 speed grade is the fastest available in the Spartan-II Commercial temperature range, supporting operation at up to 263 MHz. A lower speed grade number indicates faster timing performance.

Is the XC2S200-6FGG1266C RoHS compliant?

Yes. The double “G” in the FGG package designation indicates that this variant uses Pb-free (lead-free) solder ball material, making it compliant with RoHS environmental regulations.

What is the core operating voltage of the XC2S200-6FGG1266C?

The XC2S200-6FGG1266C operates from a 2.5V core supply voltage while supporting I/O voltages of 1.5V, 1.8V, 2.5V, and 3.3V depending on the selected I/O standard.

Can the XC2S200-6FGG1266C be reconfigured in the field?

Yes. Like all FPGAs, the XC2S200-6FGG1266C can be reconfigured at any time by loading a new bitstream. This makes it ideal for products that require post-deployment firmware updates or feature upgrades.

What is the maximum number of user I/O pins available on the XC2S200?

The XC2S200 device supports up to 284 maximum user I/O pins (excluding the four global clock/user input pins). The FGG1266 package provides access to this full I/O complement.

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Summary: XC2S200-6FGG1266C at a Glance

The XC2S200-6FGG1266C is a proven, high-performance FPGA that continues to serve a wide range of legacy and new embedded design applications. Its large gate count, full-featured I/O, high-pin-count package, Pb-free construction, and fastest Commercial speed grade make it a strong choice for engineers sourcing Spartan-II devices for communications, industrial, medical, and security applications.