Meta Description: Buy XC2S200-6FGG1262C – Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, 1,262-ball FGG package. Full specs, pinout, applications & datasheet guide.
What Is the XC2S200-6FGG1262C? Overview of the Xilinx Spartan-II FPGA
The XC2S200-6FGG1262C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It features 200,000 system gates, 5,292 configurable logic cells, and is housed in a 1,262-ball Fine-Pitch Ball Grid Array (FGG) package — making it one of the highest pin-count options in the Spartan-II lineup. With its -6 commercial speed grade, this device is engineered for demanding digital design applications where performance, I/O density, and low power consumption are critical.
The Spartan-II series was designed as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1262C eliminates costly ASIC non-recurring engineering (NRE) fees, reduces time-to-market, and allows field upgrades without hardware replacement — capabilities that make it ideal for both prototyping and production deployments.
For a broader look at Xilinx FPGA solutions and families, visit Xilinx FPGA.
XC2S200-6FGG1262C Part Number Decoder
Understanding the part number is essential when sourcing or substituting this component. Each segment of XC2S200-6FGG1262C carries specific technical meaning:
| Part Number Segment |
Meaning |
| XC |
Xilinx product identifier |
| 2S |
Spartan-II FPGA family |
| 200 |
200,000 system gates (logic capacity) |
| -6 |
Speed grade -6 (fastest commercial grade) |
| FGG |
Fine-Pitch Ball Grid Array (Pb-free packaging, “G” = RoHS-compliant) |
| 1262 |
1,262 total package balls/pins |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1262C Key Technical Specifications
Core Logic Specifications
| Parameter |
Value |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
Electrical & Timing Specifications
| Parameter |
Value |
| Core Supply Voltage |
2.5V |
| I/O Standard Voltage |
3.3V / 2.5V (multi-standard support) |
| Process Technology |
0.18 µm CMOS |
| Maximum Clock Frequency |
263 MHz |
| Speed Grade |
-6 (Commercial) |
Package & Physical Specifications
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch Ball Grid Array, Pb-free) |
| Total Pins / Balls |
1,262 |
| Temperature Range |
Commercial: 0°C to +85°C |
| RoHS Compliance |
Yes (Pb-free “G” suffix) |
| Configuration Bits |
1,335,840 |
XC2S200-6FGG1262C vs. Other XC2S200 Package Options
The XC2S200 die is available in multiple packages. The 1,262-ball FGG package provides the highest user I/O density in the family. Here is how it compares:
| Part Number |
Package |
Total Balls/Pins |
Notes |
| XC2S200-6PQ208C |
PQFP 208-pin |
208 |
Through-hole alternative |
| XC2S200-6FG256C |
FBGA 256-ball |
256 |
Compact SMD package |
| XC2S200-6FGG456C |
FGG 456-ball (Pb-free) |
456 |
Mid-density I/O |
| XC2S200-6FGG1262C |
FGG 1,262-ball (Pb-free) |
1,262 |
Highest I/O count |
Note: The “-6” speed grade is exclusively available in the Commercial temperature range. Industrial temperature variants use the “-5I” or “-4I” speed grades.
Spartan-II Family Comparison: Where Does XC2S200 Fit?
The XC2S200 is the top-tier device in the Spartan-II family. The table below shows the complete family to help designers select the right density:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
75,264 bits |
56K |
XC2S200-6FGG1262C Internal Architecture Explained
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1262C contains 1,176 CLBs arranged in a 28×42 grid. Each CLB contains four logic cells, where every logic cell includes a 4-input Look-Up Table (LUT), dedicated carry logic, and a storage flip-flop. This architecture allows efficient implementation of both combinational and sequential digital logic.
Block RAM
The device includes 56K bits of block RAM organized in two columns located on opposite sides of the die. Block RAM supports dual-port operation and is ideal for FIFOs, frame buffers, lookup tables, and small embedded memory arrays.
Distributed RAM
With 75,264 bits of distributed RAM, designers can implement small memories directly inside the CLB fabric, minimizing routing delays and maximizing throughput for data-intensive designs.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock management features including clock deskewing, frequency synthesis, and phase shifting. This is critical for high-speed synchronous designs operating at or near the 263 MHz maximum clock frequency.
Input/Output Blocks (IOBs)
The 284 user-configurable IOBs support multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and HSTL. Each IOB includes optional input/output registers, pull-up/pull-down resistors, and programmable slew-rate control.
Configuration Modes for XC2S200-6FGG1262C
The XC2S200-6FGG1262C supports four configuration modes, selectable via the M0, M1, and M2 mode pins:
| Configuration Mode |
M0 |
M1 |
M2 |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
0 |
0 |
0 |
Output |
1-bit |
Yes |
| Slave Parallel |
0 |
1 |
0 |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
1 |
0 |
0 |
N/A |
1-bit |
No |
| Slave Serial |
1 |
1 |
0 |
Input |
1-bit |
Yes |
During power-on and throughout configuration, all I/O drivers remain in a high-impedance state to prevent bus contention.
XC2S200-6FGG1262C Applications and Use Cases
#### Telecommunications and Networking
The high I/O count of the FGG1262 package and the device’s 263 MHz operating speed make the XC2S200-6FGG1262C well-suited for line-card designs, protocol bridging, and packet processing in telecom equipment. It can implement standards such as PCI, LVDS, and multi-gigabit serial interfaces.
#### Industrial Automation and Motor Control
In industrial environments, this FPGA handles real-time motor control algorithms, programmable logic controller (PLC) emulation, and multi-axis servo control. Its reconfigurability allows manufacturers to update control algorithms without board redesign.
#### Medical and Diagnostic Equipment
The device’s reliability and field-upgradeable nature make it valuable in imaging systems (ultrasound, X-ray digitizers), patient monitoring equipment, and diagnostic instruments where design updates may be required post-deployment.
#### Communications Signal Processing
The XC2S200-6FGG1262C supports hardware-accelerated signal processing tasks such as FFT, FIR filtering, and digital down-conversion — common in software-defined radio (SDR) front-ends, modems, and wireless base stations.
#### Consumer and Embedded Electronics
Its cost-effective profile makes it practical for display controllers, set-top box logic, and embedded co-processing in consumer devices where a full SoC would be excessive.
#### Security and Surveillance Systems
With sufficient logic capacity to implement encryption engines (AES, DES), the XC2S200-6FGG1262C finds use in network security appliances, biometric authentication systems, and access control hardware.
Development Tools for XC2S200-6FGG1262C
| Tool |
Description |
| Xilinx ISE Design Suite |
Primary design tool for Spartan-II; supports synthesis, place-and-route, simulation |
| ModelSim / ISim |
HDL simulation for VHDL and Verilog designs |
| ChipScope Pro |
On-chip logic analyzer for real-time debug |
| iMPACT |
JTAG-based configuration and programming tool |
| CORE Generator |
IP core generation for common functions (FIFOs, DSP, memory controllers) |
Note: Xilinx Vivado does not support the Spartan-II family. ISE Design Suite (version 14.7 or earlier) is required.
XC2S200-6FGG1262C Ordering Information and Availability
| Attribute |
Detail |
| Manufacturer |
Xilinx (now AMD) |
| Part Number |
XC2S200-6FGG1262C |
| Family |
Spartan-II |
| RoHS Status |
Compliant (Pb-free package) |
| Temperature Grade |
Commercial (C) |
| Speed Grade |
-6 |
| Package |
FGG1262 |
| Lifecycle Status |
Not Recommended for New Designs (NRND) |
Important: The XC2S200-6FGG1262C carries an NRND (Not Recommended for New Designs) status from AMD/Xilinx. For new projects, consider migrating to the Spartan-6, Artix-7, or Spartan-7 FPGA families. However, for legacy system maintenance, repair, and field servicing, this part remains available through authorized and independent distributors.
Frequently Asked Questions (FAQ) About XC2S200-6FGG1262C
What does the “-6” speed grade mean on the XC2S200-6FGG1262C?
The -6 speed grade is the fastest available grade in the Spartan-II family and is exclusively offered in the commercial temperature range (0°C to +85°C). A lower number indicates faster propagation delays and higher maximum clock frequency — up to 263 MHz for the XC2S200.
What is the difference between FGG and FG packaging?
Both refer to Fine-Pitch Ball Grid Array (BGA) packages. The “G” suffix in FGG indicates a Pb-free (lead-free, RoHS-compliant) package. An “FG” part (without the second G) uses standard leaded solder. For new designs and most markets, the Pb-free FGG variant is preferred.
Is the XC2S200-6FGG1262C pin-compatible with other XC2S200 packages?
No. Different packages (PQ208, FG256, FGG456, FGG1262) are not pin-compatible with each other. The FGG1262 package offers the highest I/O count (284 user I/Os) and requires a PCB designed specifically for the 1,262-ball BGA footprint.
Can I use Vivado to program the XC2S200-6FGG1262C?
No. Xilinx Vivado does not support Spartan-II devices. You must use Xilinx ISE Design Suite 14.7 (the final ISE release) for all synthesis, implementation, and programming tasks.
What is a suitable modern replacement for the XC2S200-6FGG1262C?
For new designs, AMD/Xilinx recommends migrating to the Spartan-6 (XC6S), Artix-7 (XC7A), or Spartan-7 (XC7S) families, which offer substantially more logic resources, lower power consumption, and active manufacturer support.
Summary: Why Choose XC2S200-6FGG1262C for Legacy and Maintenance Designs?
The XC2S200-6FGG1262C remains a well-understood, proven component with a strong ecosystem of existing designs. Its key advantages for legacy use include:
- Highest I/O density in the XC2S200 package lineup (284 user I/Os via FGG1262)
- Fastest commercial speed grade (-6) with up to 263 MHz clock operation
- Pb-free RoHS-compliant packaging for regulatory compliance
- Established design ecosystem with ISE Design Suite support
- Field reconfigurability for in-system firmware updates without hardware swap
- 56K bits of block RAM and 75,264 bits of distributed RAM for data-intensive tasks
Whether you are maintaining an existing product line, sourcing a replacement for a legacy system, or completing a long-running production run, the XC2S200-6FGG1262C delivers the performance and reliability that engineers have depended on for over two decades.
