The XC2S200-6FGG1261C is a high-density, 2.5V Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, it delivers up to 200,000 system gates, 5,292 logic cells, and a 1261-ball Fine Pitch BGA (FGG) package — making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded systems. Whether you are looking for specifications, a datasheet summary, or sourcing information, this complete guide covers everything you need to know about the XC2S200-6FGG1261C.

What Is the XC2S200-6FGG1261C? – Product Overview

The XC2S200-6FGG1261C is a member of the Xilinx Spartan-II FPGA family, manufactured using advanced 0.18 µm CMOS process technology. It operates on a 2.5V core voltage and is built specifically for the commercial temperature range (0°C to +85°C), as indicated by the “-6C” speed grade and “C” temperature suffix in the part number.

The “FGG1261” designation refers to the 1261-ball Fine Pitch Ball Grid Array (FBGA) package — the largest footprint available in the XC2S200 product line — providing a maximum number of user I/O pins for complex, high-pin-count designs.

For a broader overview of compatible Xilinx programmable logic devices, visit Xilinx FPGA.

XC2S200-6FGG1261C Part Number Decoder

Understanding the part number is essential for procurement and design engineering. Here is a full breakdown:

Note: The “G” in “FGG” denotes the RoHS-compliant, Pb-free packaging option. The standard (non-Pb-free) equivalent would be “FG1261.”

XC2S200-6FGG1261C Key Specifications

Core Technical Parameters

Clock and Timing Specifications

XC2S200-6FGG1261C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1261C features a 28 × 42 CLB array containing 1,176 CLBs. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture gives designers enormous flexibility for implementing combinational and sequential logic.

Input/Output Blocks (IOBs)

The device supports up to 284 user-configurable I/O pins. Each IOB supports a wide variety of I/O standards including LVTTL, LVCMOS, GTL, GTL+, HSTL, SSTL2, SSTL3, CTT, and AGP. The large 1261-ball BGA package maximizes available I/O for complex multi-bus designs.

Block RAM

Two columns of dedicated block RAM are embedded in the XC2S200-6FGG1261C, providing 56K bits (56,000 bits) of true dual-port synchronous SRAM. Each block RAM can be configured as 4K × 1, 2K × 2, 1K × 4, or 512 × 8 (with or without parity).

Distributed RAM

The CLB LUTs can also be configured as distributed RAM, yielding up to 75,264 bits of additional on-chip storage — a significant resource for FIFOs, shift registers, and small lookup tables embedded within the logic fabric.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — positioned at the four corners of the die — provide:

• Zero-delay clock buffering
• Clock deskew across the device
• Frequency synthesis (multiply/divide)
• Phase shifting (0°, 90°, 180°, 270°)

XC2S200 Family Comparison Table

The XC2S200-6FGG1261C is the largest device in the Spartan-II family. Here is how it compares to sibling devices:

The XC2S200 offers the highest logic density, maximum I/O, and largest memory capacity within the Spartan-II product line.

Package Options for the XC2S200

The XC2S200 is available in several package variants. The FGG1261 is the largest and highest pin-count option:

The FGG1261 package in the XC2S200-6FGG1261C is ideal for board designs where maximum I/O density and routing flexibility are required.

XC2S200-6FGG1261C vs. Similar FPGAs

For most new designs, the Spartan-3 or Spartan-6 series offers a better performance-per-watt ratio. However, the XC2S200-6FGG1261C remains widely sourced for legacy system maintenance, repairs, and long-lifecycle industrial equipment.

Key Features of the XC2S200-6FGG1261C

#### Superior ASIC Alternative

The Spartan-II XC2S200-6FGG1261C avoids the high initial cost, long development cycles, and inflexibility of mask-programmed ASICs. Its field-programmability allows in-system design upgrades without hardware replacement.

#### High-Speed -6 Speed Grade

The -6 speed grade is the fastest available for the Spartan-II family and is exclusive to the commercial temperature range. It supports system clock frequencies up to 263 MHz, enabling demanding real-time processing applications.

#### Pb-Free, RoHS-Compliant Packaging

The “FGG” designation confirms RoHS-compliant, lead-free solder ball packaging, meeting international environmental regulations for electronic components.

#### Versatile I/O Standard Support

With support for 13+ I/O standards, the XC2S200-6FGG1261C can interface with a wide range of memory, bus, and communication peripherals without additional level-translation circuitry.

#### Hierarchical Routing Architecture

A powerful multi-level routing hierarchy — including single-length, double-length, hex, and long lines — ensures efficient signal distribution across the entire device with minimal timing overhead.

Typical Applications for the XC2S200-6FGG1261C

The XC2S200-6FGG1261C FPGA is ideally suited for the following application areas:

Configuration and Programming

Configuration Modes

The XC2S200-6FGG1261C supports four standard configuration modes:

Supported Configuration PROMs

The device is compatible with Xilinx XC18V and XCF PROM families for persistent configuration storage.

Development Tools

The XC2S200-6FGG1261C is supported by Xilinx ISE Design Suite (the primary toolchain for Spartan-II devices). Note that Vivado Design Suite does not support legacy Spartan-II devices — ISE 14.7 is the recommended and final software release for this family.

Ordering Information & Procurement Guide

How to Read the Full Part Number

XC  2S  200  -6  FGG  1261  C
│   │    │    │   │     │    └── Temperature: C = Commercial (0°C to +85°C)
│   │    │    │   │     └─────── Pin count: 1261
│   │    │    │   └───────────── Package: FGG = Fine Pitch BGA, Pb-Free
│   │    │    └───────────────── Speed grade: -6 (fastest)
│   │    └────────────────────── Gate count: 200K
│   └─────────────────────────── Family: Spartan-II (2S)
└─────────────────────────────── Xilinx commercial prefix

Availability Notes

The XC2S200-6FGG1261C is a mature, end-of-life (EOL) component. While Xilinx (AMD) discontinued active production per PDN2004-01, it remains available through:

• Authorized distributors with legacy stock
• Independent component distributors (ICDs)
• Component brokers specializing in obsolete and allocated parts

Tip for procurement teams: Always verify authenticity and request certificates of conformance (CoC) and country of origin (CoO) when sourcing from the open market.

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1261C?

The -6 speed grade is the fastest available in the Spartan-II family. It offers the lowest propagation delays and is rated for commercial temperature use only (0°C to +85°C). Industrial temperature variants use the -5I speed grade.

Is the XC2S200-6FGG1261C RoHS compliant?

Yes. The “FGG” in the part number indicates the lead-free (Pb-free), RoHS-compliant package. The non-Pb-free equivalent would carry the “FG” designation.

What software do I use to program the XC2S200-6FGG1261C?

Use Xilinx ISE Design Suite 14.7, the final version that officially supports Spartan-II devices. Vivado is not compatible with this family.

Can the XC2S200-6FGG1261C replace an XC2S200-6FG1261C?

Yes, functionally. The FGG1261 is the Pb-free version of the FG1261 package. They are pin-compatible and electrically equivalent; the difference is only in the solder ball composition.

What is the maximum number of I/O pins on the XC2S200-6FGG1261C?

The XC2S200 device supports up to 284 user I/O pins (excluding the four dedicated global clock/user input pins). The FGG1261 package provides the maximum I/O access for this device.

Summary: Why Choose the XC2S200-6FGG1261C?

The XC2S200-6FGG1261C remains a reliable, well-documented, and widely-understood FPGA for engineers maintaining legacy systems or designing cost-optimized solutions that do not require the latest silicon. Its combination of 200,000 system gates, 5,292 logic cells, 284 I/O pins, dedicated DLLs, and the large 1261-ball BGA package makes it one of the most capable devices in the Spartan-II product line.

For engineers evaluating this device alongside other programmable logic options from the same manufacturer, the Xilinx FPGA resource page provides a comprehensive comparison of available families and their performance characteristics.