Part Number: XC2S200-6FGG1254C | Manufacturer: Xilinx (AMD) | Family: Spartan-II | Package: 1254-Ball Fine Pitch BGA (Pb-Free)
The XC2S200-6FGG1254C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates in a 1254-ball fine-pitch BGA Pb-free package with a commercial temperature rating. Whether you are developing telecommunications systems, industrial automation controllers, or embedded computing solutions, the XC2S200-6FGG1254C provides the programmable logic density, speed, and I/O flexibility your design demands.
For engineers and procurement teams sourcing programmable logic devices, explore the full range of Xilinx FPGA products to find the ideal device for your application.
What Is the XC2S200-6FGG1254C? Decoding the Part Number
Understanding the part number helps engineers quickly identify device characteristics:
| Field |
Code |
Meaning |
| Device Family |
XC2S |
Xilinx Spartan-II |
| Logic Density |
200 |
200,000 System Gates |
| Speed Grade |
-6 |
Fastest commercial speed grade |
| Package Type |
FGG |
Fine-Pitch Ball Grid Array (Pb-Free / “G” = RoHS compliant) |
| Pin Count |
1254 |
1,254 solder balls |
| Temperature Range |
C |
Commercial (0°C to +85°C) |
Note: The double “G” in FGG denotes the Pb-free (lead-free / RoHS-compliant) version of the fine-pitch BGA package, making it suitable for designs that must meet EU RoHS and WEEE environmental directives.
XC2S200-6FGG1254C Key Specifications at a Glance
| Parameter |
Specification |
| Manufacturer |
Xilinx (now AMD) |
| Part Number |
XC2S200-6FGG1254C |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Speed Grade |
-6 (fastest) |
| Maximum Frequency |
Up to 263 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm |
| Package |
1254-Ball Fine-Pitch BGA (Pb-Free) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliance |
Yes (Pb-Free) |
Spartan-II Architecture: How the XC2S200 Is Built
Configurable Logic Blocks (CLBs)
The heart of the XC2S200 is its array of 1,176 Configurable Logic Blocks arranged in a 28 × 42 matrix. Each CLB contains:
- Two Slices, each with two 4-input Look-Up Tables (LUTs)
- Flip-flops with synchronous and asynchronous set/reset
- Fast carry and arithmetic logic
- Wide-input function multiplexers
This architecture enables the implementation of complex combinatorial and sequential logic, DSP functions, and state machines without requiring external ICs.
Distributed RAM and Block RAM
| Memory Type |
Capacity |
Use Case |
| Distributed RAM |
75,264 bits |
Small, fast, logic-embedded memory |
| Block RAM |
56,000 bits (56K) |
Large, dedicated dual-port SRAM blocks |
| Total On-Chip RAM |
~131K bits |
Combined on-chip storage |
The two columns of dedicated Block RAM placed symmetrically on either side of the CLB array provide high-bandwidth, dual-port memory access — ideal for FIFO buffers, lookup tables, and co-processor data storage.
Input/Output Blocks (IOBs) and User I/O
With 284 maximum user I/O pins, the XC2S200-6FGG1254C offers exceptional connectivity for a mid-range FPGA. The programmable IOBs support:
- Multiple I/O standards: LVTTL, LVCMOS2, LVCMOS18, GTL, GTLP, SSTL2, SSTL3, HSTL, and CTT
- Programmable drive strength and slew rate control
- Optional pull-up, pull-down, or keeper feedback resistors
- Input delay elements for setup time optimization
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock management capabilities including:
- Clock deskewing and jitter reduction
- Clock frequency synthesis (multiply/divide)
- Phase shifting for multi-clock domain designs
- Zero-delay buffering for board-level clock distribution
XC2S200-6FGG1254C Performance Specifications
Speed Grade -6: The Fastest Spartan-II Variant
| Timing Parameter |
Value |
| Maximum System Frequency |
263 MHz |
| Speed Grade |
-6 (best available) |
| Temperature Availability |
Commercial only (0°C to +85°C) |
| Logic Propagation Delay |
Optimized for high-speed paths |
The -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1254C the go-to choice for designs where raw performance is the primary requirement in controlled operating environments.
Package Details: 1254-Ball Fine-Pitch BGA (FGG)
Why Choose the FGG1254 Package?
The 1254-ball Fine-Pitch BGA (FGG) package is the largest available for the XC2S200, offering the maximum number of accessible I/O pins. Key package attributes include:
| Feature |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Ball Count |
1,254 |
| Package Lead-Free |
Yes (Pb-Free, denoted by double “G”) |
| Ball Material |
SAC (Tin-Silver-Copper alloy) |
| PCB Mounting |
Surface Mount Technology (SMT) |
| Environmental Compliance |
RoHS, WEEE compliant |
Spartan-II XC2S200 Available Package Comparison
| Package Code |
Type |
Pins |
Max I/O |
Pb-Free Option |
| PQ208 / PQG208 |
Plastic Quad Flat Pack |
208 |
140 |
Yes |
| FG256 / FGG256 |
Fine-Pitch BGA |
256 |
176 |
Yes |
| FG456 / FGG456 |
Fine-Pitch BGA |
456 |
284 |
Yes |
| FGG1254 |
Fine-Pitch BGA |
1,254 |
284 |
Yes (standard) |
The FGG1254 package provides the same 284 user I/O as the FGG456, but with a larger ball pitch and more ground/power balls, improving signal integrity and thermal performance in high-density PCB designs.
XC2S200-6FGG1254C vs. Other Spartan-II Family Members
| Device |
System Gates |
Logic Cells |
CLB Array |
Max I/O |
Block RAM |
| XC2S15 |
15,000 |
432 |
8 × 12 |
86 |
16K |
| XC2S30 |
30,000 |
972 |
12 × 18 |
92 |
24K |
| XC2S50 |
50,000 |
1,728 |
16 × 24 |
176 |
32K |
| XC2S100 |
100,000 |
2,700 |
20 × 30 |
176 |
40K |
| XC2S150 |
150,000 |
3,888 |
24 × 36 |
260 |
48K |
| XC2S200 |
200,000 |
5,292 |
28 × 42 |
284 |
56K |
The XC2S200 is the highest-density device in the Spartan-II family, offering the maximum CLB count, I/O, and block RAM of any device in this product line.
Top Applications for the XC2S200-6FGG1254C Spartan-II FPGA
Industrial & Embedded Control
- Motor drive controllers and servo systems
- Industrial fieldbus interfaces (CAN, Profibus, Modbus)
- Real-time sensor data acquisition systems
- Machine vision pre-processing
Telecommunications & Networking
- Line card logic and framer support
- Protocol bridging and conversion (SONET, SDH)
- Packet classification and filtering
- Network access controllers
Consumer Electronics & Computing
- High-speed peripheral interfaces
- Embedded processor co-processors
- Display and video pipeline control
- Connected printer and peripheral logic
Prototyping & ASIC Replacement
The Spartan-II XC2S200 is specifically positioned as a cost-effective alternative to mask-programmed ASICs. Unlike ASICs, it eliminates:
- Non-Recurring Engineering (NRE) costs
- Long ASIC tape-out development cycles
- The inherent risk of logic errors requiring a costly new mask set
- Hardware obsolescence — field re-programmability allows post-production logic updates
Configuration and Programming the XC2S200
Supported Configuration Modes
| Mode |
Description |
| Master Serial |
FPGA controls serial PROM (e.g., XCF01S) |
| Slave Serial |
External controller drives configuration |
| Master Parallel |
Faster configuration from parallel flash |
| Slave Parallel |
System processor loads configuration |
| JTAG Boundary Scan |
IEEE 1149.1 compliant in-system programming |
| Express Mode |
High-speed parallel configuration |
Recommended Configuration PROMs
Xilinx offers dedicated Serial PROMs (XCF family) for simple, standalone Spartan-II configuration. For more complex designs, parallel NOR flash devices can be used in Master Parallel mode.
Development Tool Support
| Tool |
Version |
Notes |
| Xilinx ISE Design Suite |
ISE 14.x (final) |
Legacy tool, fully supports Spartan-II |
| Xilinx Vivado |
Not supported |
Vivado targets 7-Series and newer |
| ModelSim / ISIM |
Supported |
Simulation and timing verification |
| ChipScope Pro |
Supported |
In-system logic analysis via JTAG |
Electrical and Thermal Characteristics
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply Voltage (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Supply Voltage (VCCO) |
1.14 |
— |
3.465 |
V |
| Commercial Temp Range |
0 |
— |
+85 |
°C |
| Input Low Voltage (VIL) |
— |
— |
0.8 |
V |
| Input High Voltage (VIH) |
2.0 |
— |
— |
V |
Why the XC2S200-6FGG1254C Is a Smart Choice for Legacy and Maintenance Designs
Long-Term Availability and Inventory
While the Spartan-II family is mature technology, the XC2S200-6FGG1254C continues to be available through authorized and independent distributors for:
- Equipment maintenance and repair — keeping fielded systems running
- Military and industrial retrofit programs — where form-fit-function replacements are needed
- Cost-sensitive volume production — lower price per unit versus newer FPGA families for simple logic requirements
Advantages Over Newer Alternatives for Specific Use Cases
| Consideration |
XC2S200-6FGG1254C |
Newer 7-Series |
| Core Voltage |
2.5V |
1.0V (more complex power) |
| Tool Complexity |
Low (ISE) |
Higher (Vivado) |
| Unit Cost |
Lower (mature node) |
Higher (advanced node) |
| Best For |
Legacy compatibility, simple logic |
High-speed, high-density new designs |
Ordering Information for XC2S200-6FGG1254C
How to Read the Full Part Number
XC 2S 200 - 6 FGG 1254 C
| | | | | | |
| | | | | | └── Temperature: C = Commercial (0°C to +85°C)
| | | | | └──────── Pin Count: 1254 balls
| | | | └───────────── Package: FGG = Fine-Pitch BGA, Pb-Free
| | | └──────────────── Speed Grade: -6 (fastest)
| | └──────────────────────── Logic Density: 200K gates
| └──────────────────────────── Sub-family: Spartan-II
└──────────────────────────────── Xilinx device
Related Part Numbers
| Part Number |
Difference |
| XC2S200-5FGG1254C |
Speed grade -5 (slower), same package |
| XC2S200-6FG456C |
Speed grade -6, standard (non Pb-free) 456-ball BGA |
| XC2S200-6FGG456C |
Speed grade -6, Pb-free 456-ball BGA |
| XC2S200-6PQG208C |
Speed grade -6, Pb-free 208-pin PQFP |
Frequently Asked Questions (FAQ)
Q: What is the difference between FG and FGG in the part number?
The “G” suffix in FGG indicates the Pb-free (lead-free) version of the fine-pitch BGA package. FG packages use standard tin-lead solder balls, while FGG packages use RoHS-compliant SAC alloy balls. For new designs, the FGG version is recommended to meet global environmental compliance regulations.
Q: Is the XC2S200-6FGG1254C still in production?
The Spartan-II family has been subject to product discontinuation notices (PDN). Engineers should verify current availability with authorized Xilinx/AMD distributors or specialized component suppliers. Stock is available through the aftermarket for maintenance and legacy design support.
Q: What is the maximum operating frequency?
The XC2S200 series achieves up to 263 MHz in the -6 speed grade under commercial temperature conditions.
Q: Can the XC2S200 be used in automotive applications?
The standard XC2S200-6FGG1254C is rated for commercial temperature range only (0°C to +85°C). Xilinx offered automotive temperature variants separately. Check with your distributor for availability of extended temperature parts.
Q: What programming software supports the XC2S200?
The Xilinx ISE Design Suite (version 14.7) is the recommended tool for Spartan-II design, synthesis, implementation, and programming. Vivado does not support the Spartan-II family.
Summary: XC2S200-6FGG1254C Product Highlights
The XC2S200-6FGG1254C delivers the top tier of Spartan-II performance in a fully RoHS-compliant, 1254-ball fine-pitch BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 131K bits of on-chip RAM, four DLLs, and the fastest -6 speed grade running at up to 263 MHz at 2.5V, this Xilinx FPGA remains a reliable, proven solution for commercial-grade programmable logic applications — especially for maintaining existing system designs, industrial automation, and telecommunications infrastructure.