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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1254C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

Part Number: XC2S200-6FGG1254C | Manufacturer: Xilinx (AMD) | Family: Spartan-II | Package: 1254-Ball Fine Pitch BGA (Pb-Free)


The XC2S200-6FGG1254C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates in a 1254-ball fine-pitch BGA Pb-free package with a commercial temperature rating. Whether you are developing telecommunications systems, industrial automation controllers, or embedded computing solutions, the XC2S200-6FGG1254C provides the programmable logic density, speed, and I/O flexibility your design demands.

For engineers and procurement teams sourcing programmable logic devices, explore the full range of Xilinx FPGA products to find the ideal device for your application.


What Is the XC2S200-6FGG1254C? Decoding the Part Number

Understanding the part number helps engineers quickly identify device characteristics:

Field Code Meaning
Device Family XC2S Xilinx Spartan-II
Logic Density 200 200,000 System Gates
Speed Grade -6 Fastest commercial speed grade
Package Type FGG Fine-Pitch Ball Grid Array (Pb-Free / “G” = RoHS compliant)
Pin Count 1254 1,254 solder balls
Temperature Range C Commercial (0°C to +85°C)

Note: The double “G” in FGG denotes the Pb-free (lead-free / RoHS-compliant) version of the fine-pitch BGA package, making it suitable for designs that must meet EU RoHS and WEEE environmental directives.


XC2S200-6FGG1254C Key Specifications at a Glance

Parameter Specification
Manufacturer Xilinx (now AMD)
Part Number XC2S200-6FGG1254C
FPGA Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Max User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Speed Grade -6 (fastest)
Maximum Frequency Up to 263 MHz
Core Voltage 2.5V
Process Technology 0.18 µm
Package 1254-Ball Fine-Pitch BGA (Pb-Free)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-Free)

Spartan-II Architecture: How the XC2S200 Is Built

Configurable Logic Blocks (CLBs)

The heart of the XC2S200 is its array of 1,176 Configurable Logic Blocks arranged in a 28 × 42 matrix. Each CLB contains:

  • Two Slices, each with two 4-input Look-Up Tables (LUTs)
  • Flip-flops with synchronous and asynchronous set/reset
  • Fast carry and arithmetic logic
  • Wide-input function multiplexers

This architecture enables the implementation of complex combinatorial and sequential logic, DSP functions, and state machines without requiring external ICs.

Distributed RAM and Block RAM

Memory Type Capacity Use Case
Distributed RAM 75,264 bits Small, fast, logic-embedded memory
Block RAM 56,000 bits (56K) Large, dedicated dual-port SRAM blocks
Total On-Chip RAM ~131K bits Combined on-chip storage

The two columns of dedicated Block RAM placed symmetrically on either side of the CLB array provide high-bandwidth, dual-port memory access — ideal for FIFO buffers, lookup tables, and co-processor data storage.

Input/Output Blocks (IOBs) and User I/O

With 284 maximum user I/O pins, the XC2S200-6FGG1254C offers exceptional connectivity for a mid-range FPGA. The programmable IOBs support:

  • Multiple I/O standards: LVTTL, LVCMOS2, LVCMOS18, GTL, GTLP, SSTL2, SSTL3, HSTL, and CTT
  • Programmable drive strength and slew rate control
  • Optional pull-up, pull-down, or keeper feedback resistors
  • Input delay elements for setup time optimization

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock management capabilities including:

  • Clock deskewing and jitter reduction
  • Clock frequency synthesis (multiply/divide)
  • Phase shifting for multi-clock domain designs
  • Zero-delay buffering for board-level clock distribution

XC2S200-6FGG1254C Performance Specifications

Speed Grade -6: The Fastest Spartan-II Variant

Timing Parameter Value
Maximum System Frequency 263 MHz
Speed Grade -6 (best available)
Temperature Availability Commercial only (0°C to +85°C)
Logic Propagation Delay Optimized for high-speed paths

The -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1254C the go-to choice for designs where raw performance is the primary requirement in controlled operating environments.


Package Details: 1254-Ball Fine-Pitch BGA (FGG)

Why Choose the FGG1254 Package?

The 1254-ball Fine-Pitch BGA (FGG) package is the largest available for the XC2S200, offering the maximum number of accessible I/O pins. Key package attributes include:

Feature Detail
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Ball Count 1,254
Package Lead-Free Yes (Pb-Free, denoted by double “G”)
Ball Material SAC (Tin-Silver-Copper alloy)
PCB Mounting Surface Mount Technology (SMT)
Environmental Compliance RoHS, WEEE compliant

Spartan-II XC2S200 Available Package Comparison

Package Code Type Pins Max I/O Pb-Free Option
PQ208 / PQG208 Plastic Quad Flat Pack 208 140 Yes
FG256 / FGG256 Fine-Pitch BGA 256 176 Yes
FG456 / FGG456 Fine-Pitch BGA 456 284 Yes
FGG1254 Fine-Pitch BGA 1,254 284 Yes (standard)

The FGG1254 package provides the same 284 user I/O as the FGG456, but with a larger ball pitch and more ground/power balls, improving signal integrity and thermal performance in high-density PCB designs.


XC2S200-6FGG1254C vs. Other Spartan-II Family Members

Device System Gates Logic Cells CLB Array Max I/O Block RAM
XC2S15 15,000 432 8 × 12 86 16K
XC2S30 30,000 972 12 × 18 92 24K
XC2S50 50,000 1,728 16 × 24 176 32K
XC2S100 100,000 2,700 20 × 30 176 40K
XC2S150 150,000 3,888 24 × 36 260 48K
XC2S200 200,000 5,292 28 × 42 284 56K

The XC2S200 is the highest-density device in the Spartan-II family, offering the maximum CLB count, I/O, and block RAM of any device in this product line.


Top Applications for the XC2S200-6FGG1254C Spartan-II FPGA

Industrial & Embedded Control

  • Motor drive controllers and servo systems
  • Industrial fieldbus interfaces (CAN, Profibus, Modbus)
  • Real-time sensor data acquisition systems
  • Machine vision pre-processing

Telecommunications & Networking

  • Line card logic and framer support
  • Protocol bridging and conversion (SONET, SDH)
  • Packet classification and filtering
  • Network access controllers

Consumer Electronics & Computing

  • High-speed peripheral interfaces
  • Embedded processor co-processors
  • Display and video pipeline control
  • Connected printer and peripheral logic

Prototyping & ASIC Replacement

The Spartan-II XC2S200 is specifically positioned as a cost-effective alternative to mask-programmed ASICs. Unlike ASICs, it eliminates:

  • Non-Recurring Engineering (NRE) costs
  • Long ASIC tape-out development cycles
  • The inherent risk of logic errors requiring a costly new mask set
  • Hardware obsolescence — field re-programmability allows post-production logic updates

Configuration and Programming the XC2S200

Supported Configuration Modes

Mode Description
Master Serial FPGA controls serial PROM (e.g., XCF01S)
Slave Serial External controller drives configuration
Master Parallel Faster configuration from parallel flash
Slave Parallel System processor loads configuration
JTAG Boundary Scan IEEE 1149.1 compliant in-system programming
Express Mode High-speed parallel configuration

Recommended Configuration PROMs

Xilinx offers dedicated Serial PROMs (XCF family) for simple, standalone Spartan-II configuration. For more complex designs, parallel NOR flash devices can be used in Master Parallel mode.

Development Tool Support

Tool Version Notes
Xilinx ISE Design Suite ISE 14.x (final) Legacy tool, fully supports Spartan-II
Xilinx Vivado Not supported Vivado targets 7-Series and newer
ModelSim / ISIM Supported Simulation and timing verification
ChipScope Pro Supported In-system logic analysis via JTAG

Electrical and Thermal Characteristics

Parameter Min Typical Max Unit
Core Supply Voltage (VCCINT) 2.375 2.5 2.625 V
I/O Supply Voltage (VCCO) 1.14 3.465 V
Commercial Temp Range 0 +85 °C
Input Low Voltage (VIL) 0.8 V
Input High Voltage (VIH) 2.0 V

Why the XC2S200-6FGG1254C Is a Smart Choice for Legacy and Maintenance Designs

Long-Term Availability and Inventory

While the Spartan-II family is mature technology, the XC2S200-6FGG1254C continues to be available through authorized and independent distributors for:

  • Equipment maintenance and repair — keeping fielded systems running
  • Military and industrial retrofit programs — where form-fit-function replacements are needed
  • Cost-sensitive volume production — lower price per unit versus newer FPGA families for simple logic requirements

Advantages Over Newer Alternatives for Specific Use Cases

Consideration XC2S200-6FGG1254C Newer 7-Series
Core Voltage 2.5V 1.0V (more complex power)
Tool Complexity Low (ISE) Higher (Vivado)
Unit Cost Lower (mature node) Higher (advanced node)
Best For Legacy compatibility, simple logic High-speed, high-density new designs

Ordering Information for XC2S200-6FGG1254C

How to Read the Full Part Number

XC  2S  200  -  6  FGG  1254  C
|   |   |       |  |    |     |
|   |   |       |  |    |     └── Temperature: C = Commercial (0°C to +85°C)
|   |   |       |  |    └──────── Pin Count: 1254 balls
|   |   |       |  └───────────── Package: FGG = Fine-Pitch BGA, Pb-Free
|   |   |       └──────────────── Speed Grade: -6 (fastest)
|   |   └──────────────────────── Logic Density: 200K gates
|   └──────────────────────────── Sub-family: Spartan-II
└──────────────────────────────── Xilinx device

Related Part Numbers

Part Number Difference
XC2S200-5FGG1254C Speed grade -5 (slower), same package
XC2S200-6FG456C Speed grade -6, standard (non Pb-free) 456-ball BGA
XC2S200-6FGG456C Speed grade -6, Pb-free 456-ball BGA
XC2S200-6PQG208C Speed grade -6, Pb-free 208-pin PQFP

Frequently Asked Questions (FAQ)

Q: What is the difference between FG and FGG in the part number?

The “G” suffix in FGG indicates the Pb-free (lead-free) version of the fine-pitch BGA package. FG packages use standard tin-lead solder balls, while FGG packages use RoHS-compliant SAC alloy balls. For new designs, the FGG version is recommended to meet global environmental compliance regulations.

Q: Is the XC2S200-6FGG1254C still in production?

The Spartan-II family has been subject to product discontinuation notices (PDN). Engineers should verify current availability with authorized Xilinx/AMD distributors or specialized component suppliers. Stock is available through the aftermarket for maintenance and legacy design support.

Q: What is the maximum operating frequency?

The XC2S200 series achieves up to 263 MHz in the -6 speed grade under commercial temperature conditions.

Q: Can the XC2S200 be used in automotive applications?

The standard XC2S200-6FGG1254C is rated for commercial temperature range only (0°C to +85°C). Xilinx offered automotive temperature variants separately. Check with your distributor for availability of extended temperature parts.

Q: What programming software supports the XC2S200?

The Xilinx ISE Design Suite (version 14.7) is the recommended tool for Spartan-II design, synthesis, implementation, and programming. Vivado does not support the Spartan-II family.


Summary: XC2S200-6FGG1254C Product Highlights

The XC2S200-6FGG1254C delivers the top tier of Spartan-II performance in a fully RoHS-compliant, 1254-ball fine-pitch BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 131K bits of on-chip RAM, four DLLs, and the fastest -6 speed grade running at up to 263 MHz at 2.5V, this Xilinx FPGA remains a reliable, proven solution for commercial-grade programmable logic applications — especially for maintaining existing system designs, industrial automation, and telecommunications infrastructure.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.