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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC7VX485T-1FFG1927I: AMD Xilinx Virtex-7 XT FPGA – Full Specifications & Product Guide

Product Details

The XC7VX485T-1FFG1927I is a high-performance Xilinx FPGA from AMD’s Virtex-7 XT family, engineered on an advanced 28 nm high-k metal gate (HKMG) process. Designed for demanding signal processing, networking, and ASIC prototyping workloads, this device delivers an exceptional balance of logic density, DSP throughput, transceiver bandwidth, and power efficiency — making it one of the most capable programmable logic devices in its class.


Overview of the XC7VX485T-1FFG1927I

The XC7VX485T-1FFG1927I belongs to AMD Xilinx’s Virtex-7 XT sub-family, which is specifically optimized for transceiver-intensive, high-bandwidth applications. With 485,760 logic cells, 600 user I/O pins, and a 1927-pin FCBGA package, this FPGA is built to meet the throughput and integration requirements of next-generation communications, radar, and high-performance computing systems.

Built on a state-of-the-art, high-performance, low-power (HPL) 28 nm process, the XC7VX485T-1FFG1927I enables up to 1.4 Tb/s of I/O bandwidth and 4.7 TMAC/s DSP performance, while consuming up to 50% less power than previous-generation devices. It serves as a fully programmable alternative to ASSPs and ASICs across a broad range of industries.


Key Specifications at a Glance

Parameter Value
Part Number XC7VX485T-1FFG1927I
Manufacturer AMD (formerly Xilinx)
Family Virtex-7 XT
Logic Cells 485,760
Logic Units 303,600
DSP Slices 2,800
Max Operating Frequency 547.95 MHz
User I/O Pins 600
Package FCBGA-1927 (1924-BBGA / FCBGA)
Package Pins 1,927
Process Node 28 nm HKMG
Core Voltage (VCCINT) 1.0 V
Operating Temperature Range 0°C to +85°C (Industrial)
Configuration Voltage 1.8 V
Block RAM 68 Mb
RoHS Status RoHS Compliant

Detailed Technical Specifications

Logic and Fabric Architecture

The XC7VX485T-1FFG1927I is built around Xilinx’s 7-series configurable logic block (CLB) architecture, offering massive parallelism and routing flexibility for complex digital designs.

Fabric Resource Specification
Logic Cells 485,760
CLB Slices ~75,900
Flip-Flops ~607,200
LUT RAM Included in CLB slices
Max Distributed RAM 8,430 Kb
Block RAM (36 Kb blocks) 1,890 × 36 Kb
Total Block RAM 68 Mb

DSP Performance

The XC7VX485T-1FFG1927I integrates high-performance DSP48E1 slices that support advanced signal processing operations directly in hardware.

DSP Feature Specification
DSP48E1 Slices 2,800
Multiplier Width 25 × 18 bits
Accumulator Width 48-bit
Peak Performance 4.7 TMAC/s
Pre-adder Support Yes (optimized for symmetric FIR filters)
Cascade Chain Yes

I/O and Transceiver Resources

I/O Feature Specification
User I/O 600
Package FCBGA-1927
GTH Transceivers Up to 56 × 13.1 Gbps
Total Serial Bandwidth Up to 1.4 Tb/s
I/O Standards Supported LVDS, SSTL, HSTL, LVCMOS, and more
PCIe Support Up to Gen3 x8 (Endpoint & Root Port)
Max I/O Voltage 3.3 V

Clock Management

Clock Feature Specification
Clock Management Tiles (CMT) 14
PLLs per CMT 1
MMCMs per CMT 1
Global Clock Buffers 32
Regional Clock Buffers Supported

Memory Interface Capabilities

Memory Interface Maximum Supported Data Rate
DDR3 SDRAM Up to 1,866 Mb/s
LPDDR2 Supported
QDR II+ SRAM Supported
RLDRAM 2/3 Supported

Configuration Options

Configuration Method Supported
JTAG Yes
SPI Flash (Single/Dual/Quad) Yes
BPI Flash (Byte-wide Parallel) Yes
SelectMAP (×8 / ×16 / ×32) Yes
AES-256 Encryption Yes
HMAC/SHA-256 Authentication Yes
SEU Detection & Correction Built-in

Package Information

FCBGA-1927 Package Details

Package Parameter Value
Package Type Flip-Chip Ball Grid Array (FCBGA)
Pin Count 1,927
Body Size ~45 mm × 45 mm
Ball Pitch 1.0 mm
RoHS Compliant Yes

The FFG1927 suffix in the part number denotes the fine-pitch flip-chip ball grid array with 1,927 pins. The “I” at the end indicates the Industrial temperature grade (0°C to +85°C), suited for applications demanding greater reliability than commercial (-1C) variants.


Part Number Decoder

Understanding the XC7VX485T-1FFG1927I part number is essential for ordering and design verification:

Segment Meaning
XC Xilinx Commercial Device
7V 7-Series, Virtex Family
X XT Sub-family (transceiver-optimized)
485 Approximate logic cell density (485K)
T Transceiver-grade device
-1 Speed Grade 1 (slowest / most power-efficient in the family)
FFG Fine-pitch Flip-Chip Ball Grid Array
1927 Pin count (1,927 balls)
I Industrial temperature grade (0°C to +85°C)

Applications for the XC7VX485T-1FFG1927I

High-Speed Networking (10G to 100G)

The XC7VX485T-1FFG1927I’s GTH transceiver channels — capable of up to 13.1 Gbps each — make it ideal for line cards, switching fabrics, and optical transport equipment in 10GbE, 40GbE, and 100GbE network infrastructure.

Portable and Phased-Array Radar

The combination of high DSP throughput (4.7 TMAC/s) and wide I/O bandwidth enables demanding real-time radar signal processing workloads, including beamforming, pulse compression, and clutter filtering.

ASIC Prototyping and Emulation

With nearly 486K logic cells and rich interconnect resources, the XC7VX485T-1FFG1927I is widely used to prototype large ASIC designs before tape-out, enabling faster verification cycles and reduced development risk.

Wired Communications Infrastructure

PCIe Gen3 x8 support, wide memory interfaces, and high-bandwidth transceivers make this device an excellent fit for baseband processing, protocol bridging, and backplane connectivity in telecom and datacom equipment.

Defense and Aerospace

Operating across the full industrial temperature range with built-in AES-256 encryption and SEU correction, the XC7VX485T-1FFG1927I meets the stringent requirements of military and aerospace signal intelligence (SIGINT), electronic warfare (EW), and secure communications systems.

High-Performance Computing (HPC) and Data Acceleration

The FPGA’s low-latency reconfigurable fabric makes it a strong candidate for hardware acceleration in financial computing, scientific simulation, machine learning inference, and database query acceleration.


Power and Thermal Considerations

Typical Power Profile

Power Domain Voltage
Core (VCCINT) 1.0 V
Block RAM (VCCBRAM) 1.0 V
Auxiliary (VCCO) 1.8 V / 2.5 V / 3.3 V (I/O bank dependent)
GTH Transceivers (MGTAVCC) 1.0 V
GTH PLL (MGTAVTT) 1.2 V

The 28 nm HPL process allows the XC7VX485T-1FFG1927I to deliver significantly higher performance per watt compared to 40 nm predecessors. For thermal management, heatsinks, thermal interface materials (TIMs), or active cooling solutions are recommended for high-utilization designs.


Development and Design Tools

Supported EDA Software

Tool Description
Xilinx Vivado Design Suite Primary synthesis, implementation, and bitstream generation tool (recommended)
Xilinx ISE Design Suite Legacy tool (limited support for 7-series)
Xilinx Vitis High-level synthesis (HLS) and software development platform
Third-Party Synplify, Genus Supported via standard netlist flow

IP Cores and Reference Designs

AMD Xilinx provides a comprehensive library of validated IP cores for use with the XC7VX485T-1FFG1927I, including:

  • PCIe Gen3 Endpoint IP
  • 10G/100G Ethernet MAC
  • DDR3/4 MIG (Memory Interface Generator)
  • GTH transceiver wizard
  • AXI4 Interconnect and DMA IP
  • Video processing and image sensor pipelines

Ordering Information

Part Number Speed Grade Temperature Package
XC7VX485T-1FFG1927I -1 (Slowest) Industrial (0°C to +85°C) FCBGA-1927
XC7VX485T-2FFG1927I -2 (Standard) Industrial FCBGA-1927
XC7VX485T-1FFG1927C -1 Commercial (0°C to +85°C) FCBGA-1927

Comparison: XC7VX485T-1FFG1927I vs. Similar Virtex-7 Devices

Feature XC7VX485T-1FFG1927I XC7VX690T-1FFG1927I XC7VX415T-1FFG1927I
Logic Cells 485,760 693,120 412,160
DSP Slices 2,800 3,600 2,160
Block RAM 68 Mb 52.9 Mb 33.7 Mb
User I/O 600 600 600
GTH Transceivers 56 80 48
Package FCBGA-1927 FCBGA-1927 FCBGA-1927
Process 28 nm 28 nm 28 nm

Frequently Asked Questions (FAQ)

What is the XC7VX485T-1FFG1927I used for?

The XC7VX485T-1FFG1927I is used in high-bandwidth, compute-intensive applications including 10G–100G networking, ASIC prototyping, radar signal processing, defense electronics, and high-performance computing acceleration.

What programming tool is used for the XC7VX485T-1FFG1927I?

AMD Xilinx’s Vivado Design Suite is the recommended design environment. The device can also be programmed via JTAG using Vivado Hardware Manager, or through SPI/BPI flash for production deployment. Legacy ISE support is limited.

What does the “-1” speed grade mean?

The -1 speed grade is the slowest grade in the Virtex-7 family. It offers lower maximum clock frequencies compared to -2 and -3 grades, but also typically consumes less power and is more readily available. For many designs, especially those not pushing timing limits, -1 grade is the preferred cost-effective choice.

Is the XC7VX485T-1FFG1927I RoHS compliant?

Yes, the XC7VX485T-1FFG1927I is RoHS compliant, meeting the Restriction of Hazardous Substances directive requirements for lead-free manufacturing.

What is the operating temperature range?

The “I” suffix denotes the Industrial temperature grade, supporting operation from 0°C to +85°C — suitable for demanding environments where commercial-grade parts may not be adequate.

Can the XC7VX485T-1FFG1927I support PCIe?

Yes. The device includes integrated PCIe blocks supporting up to Gen3 x8 for both Endpoint and Root Port configurations, enabling direct integration with CPU and SoC platforms without external PCIe bridges.


Summary

The XC7VX485T-1FFG1927I is a proven, high-capability FPGA device from AMD’s Virtex-7 XT family that continues to serve demanding applications in networking, defense, radar, and HPC. Its combination of 485,760 logic cells, 2,800 DSP slices, 56 GTH transceivers, 600 user I/Os, and robust configuration security — all in a 1,927-pin FCBGA package on 28 nm HKMG technology — makes it a compelling programmable logic platform for engineers targeting high-performance, high-reliability designs.

Whether you are prototyping a next-generation ASIC, building a wideband radar receiver, or designing a 100G Ethernet line card, the XC7VX485T-1FFG1927I delivers the performance, integration, and design flexibility needed to succeed.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.