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XC7VX485T-2FFG1157I: Xilinx Virtex-7 XT FPGA – Complete Product Guide

Product Details

The XC7VX485T-2FFG1157I is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Virtex-7 XT family, now under AMD. Designed for demanding signal processing, networking, and defense-grade applications, this device delivers exceptional logic density, DSP throughput, and I/O bandwidth in a compact 1157-pin FCBGA package. Whether you are building 10G–100G networking equipment, portable radar systems, or ASIC prototypes, the XC7VX485T-2FFG1157I offers the programmable horsepower your design needs.


What Is the XC7VX485T-2FFG1157I?

The XC7VX485T-2FFG1157I is a member of the Xilinx Virtex-7 XT FPGA series, fabricated on a 28 nm high-performance, low-power (HPL) process using high-k metal gate (HKMG) technology. It belongs to the extended temperature industrial grade (“I” suffix), making it suitable for environments ranging from –40°C to +100°C junction temperature. For engineers sourcing a proven Xilinx FPGA for next-generation systems, this device balances logic capacity, memory bandwidth, and transceiver performance in a single IC.

Part Number Breakdown

Understanding the XC7VX485T-2FFG1157I part number helps confirm you have the exact device for your design:

Segment Value Meaning
XC7V XC7V Xilinx 7 Series FPGA
X X Virtex-7 XT (extended transceiver) variant
485T 485T 485,760 logic cells
-2 -2 Speed grade 2 (standard commercial speed)
FFG FFG Flip-chip fine-pitch ball grid array package
1157 1157 1,157-pin package
I I Industrial temperature grade

XC7VX485T-2FFG1157I Key Specifications

The table below summarizes the critical electrical and physical specifications for the XC7VX485T-2FFG1157I:

Parameter Value
FPGA Family Virtex-7 XT
Logic Cells 485,760
Logic Blocks (CLBs) 75,900
Total RAM 37,080 Kbits (4.5 MB)
DSP Slices 2,800
Maximum User I/Os 600
Package 1157-pin FCBGA (FF1157)
Maximum Operating Frequency 710 MHz
Core Supply Voltage (Vccint) 0.97 V – 1.03 V
I/O Supply Voltage (Vcco) Up to 3.3 V
Process Technology 28 nm HPL HKMG
Temperature Grade Industrial (–40°C to +100°C Tj)
Clock Management MMCM + PLL
Configuration Security 256-bit AES with HMAC/SHA-256
Packaging Tray
RoHS Compliance Refer to datasheet/distributor

XC7VX485T-2FFG1157I Detailed Features

High-Density Logic Fabric

The XC7VX485T-2FFG1157I provides 485,760 logic cells organized into 75,900 Configurable Logic Blocks (CLBs). Each CLB contains look-up tables (LUTs), flip-flops, and carry logic, enabling efficient implementation of both random logic and arithmetic-intensive designs. The fabric’s interconnect architecture supports routing congestion management critical for high-utilization designs in ASIC prototyping and networking applications.

Advanced DSP Performance

With 2,800 DSP48E2 slices, the XC7VX485T-2FFG1157I is tailored for compute-intensive workloads. Each DSP slice features:

DSP Feature Specification
Multiplier Width 25 × 18 bits
Accumulator Width 48-bit
Pre-Adder Yes
Cascade Yes
Symmetric Coefficient Filtering Optimized support

This architecture delivers up to 4.7 TMAC/s of DSP throughput across the Virtex-7 XT family, making the XC7VX485T-2FFG1157I ideal for FIR filters, FFT engines, radar waveform generators, and machine learning inference.

Embedded Block RAM

The device integrates 37,080 Kbits (approximately 4.5 MB) of block RAM (BRAM), organized as 36 Kb dual-port BRAM primitives. Block RAM can be configured as FIFOs, shift registers, or lookup tables, providing on-chip storage for packet buffers, coefficient tables, and inter-module communication.

Clock Management Tiles (CMT)

The XC7VX485T-2FFG1157I includes mixed-mode clock manager (MMCM) and PLL blocks within clock management tiles (CMTs). These provide:

  • Phase-locked loop (PLL) and MMCM for frequency synthesis and deskewing
  • Low-jitter clock generation for high-speed serial interfaces
  • Dynamic phase shifting for timing optimization
  • Multiple output clocks per CMT

High-Speed Serial Transceivers

The Virtex-7 XT variant adds GTH (GigaTransceiver High-speed) serial transceivers operating at multi-gigabit rates, supporting industry standards including PCIe, 10GbE, CPRI, and JESD204B. The 1157-pin package exposes a subset of the full transceiver complement optimized for mid-density connectivity applications.

Integrated PCIe Block

An integrated hard PCIe block supports up to x8 Gen3 Endpoint and Root Port configurations, reducing resource usage compared to soft PCIe implementations and improving signal integrity through optimized silicon routing.

Configuration and Security

The XC7VX485T-2FFG1157I supports multiple configuration modes including:

Configuration Feature Description
AES Encryption 256-bit for bitstream protection
Authentication HMAC/SHA-256
SEU Detection Built-in single-event upset detection and correction
Memory Interfaces Commodity flash, SPI, BPI
Partial Reconfiguration Supported

The industrial-grade security features make this FPGA well suited for defense, aerospace, and secure communications applications.


XC7VX485T-2FFG1157I Package and Pinout

The XC7VX485T-2FFG1157I is housed in a 1157-ball flip-chip fine-pitch BGA (FCBGA) package, also commonly listed as FF1157. Key package attributes:

Package Attribute Detail
Package Type FCBGA (Flip-Chip Ball Grid Array)
Total Ball Count 1,157
User I/Os Available 600
I/O Bank Organization Multiple HR and HP banks
Solderable Interface BGA surface-mount

The flip-chip construction improves thermal performance and electrical characteristics compared to wire-bond packages, important at high clock frequencies and when driving high-speed differential I/Os.


Applications for the XC7VX485T-2FFG1157I

The combination of industrial temperature rating, high logic density, and DSP capability makes the XC7VX485T-2FFG1157I a strong fit for:

Application Area How the XC7VX485T-2FFG1157I Helps
10G/40G/100G Networking High transceiver count, PCIe Gen3, and MAC logic
Portable Radar / EW Systems DSP slices, industrial temp range, AES security
ASIC Prototyping Large logic cell count, partial reconfiguration
High-Performance Computing 4.7 TMAC/s DSP, 1.4 Tb/s I/O bandwidth
Medical Imaging Signal processing, BRAM buffering
Scientific Instrumentation ADC/DAC interfacing, data processing pipelines
Defense & Aerospace –40°C to +100°C operation, AES/HMAC security
Financial Computing Ultra-low-latency logic acceleration

XC7VX485T-2FFG1157I vs. Related Variants

Designers often compare the XC7VX485T-2FFG1157I against similar parts in the Virtex-7 XT lineup. The table below highlights key differences:

Part Number Logic Cells I/Os Package Temp Grade Speed
XC7VX485T-2FFG1157I 485,760 600 FF1157 Industrial -2
XC7VX485T-1FFG1157I 485,760 600 FF1157 Industrial -1 (slower)
XC7VX485T-2FFG1157C 485,760 600 FF1157 Commercial -2
XC7VX415T-2FFG1157I 412,160 350 FF1157 Industrial -2
XC7VX690T-2FFG1157I 693,120 600 FF1157 Industrial -2

Choose the XC7VX485T-2FFG1157I when you need:

  • Industrial temperature range in the 1157-pin form factor
  • Speed grade -2 performance
  • A balance between logic density and package size

Development Tools and Design Support

Xilinx Vivado Design Suite

The XC7VX485T-2FFG1157I is fully supported by the Vivado Design Suite from AMD (formerly Xilinx). Vivado provides:

  • Synthesis and implementation for 7 Series FPGAs
  • IP Integrator for block diagram design entry
  • Integrated Logic Analyzer (ILA) for in-system debugging
  • Timing constraint management via XDC files
  • Partial reconfiguration flow support

Designers migrating from ISE should note that ISE is not recommended for new Virtex-7 projects; Vivado is the primary and fully supported toolchain.

Reference IP Cores

AMD offers a broad library of IP cores validated for Virtex-7 devices, including:

  • AXI4 Interconnect and protocol bridges
  • PCIe DMA subsystem
  • 10G/25G Ethernet subsystem
  • High-speed serial (GT) wizard-generated transceiver logic

Ordering Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Manufacturer Part Number XC7VX485T-2FFG1157I
DigiKey Part Number 122-1688-ND
Packaging Tray
Minimum Order Quantity 1 unit (distributor dependent)
Series Virtex-7 XT

Always purchase from authorized distributors to ensure genuine, properly stored devices with full traceability.


Frequently Asked Questions (FAQ)

Q: What does the “I” suffix mean in XC7VX485T-2FFG1157I? The “I” designates the industrial temperature grade, specifying a junction temperature range of –40°C to +100°C, compared to the commercial grade (“C”) range of 0°C to +85°C.

Q: What is the difference between XC7VX485T-2FFG1157I and XC7VX485T-2FF1157I? The “FFG” variant is the standard tray-packaged device, while “FF” without the G may indicate a tube or alternative packaging. Electrically and functionally, both are identical. Always confirm package and packaging type with your distributor.

Q: Is the XC7VX485T-2FFG1157I still in production? As of 2026, the Virtex-7 XT family is in mature production. AMD has committed to extending support for 7 Series FPGAs through 2040. Inventory availability should be verified with authorized distributors.

Q: What programming tools are compatible with the XC7VX485T-2FFG1157I? The Vivado Design Suite (version 2013.1 and later) fully supports the XC7VX485T-2FFG1157I. The JTAG-compatible Xilinx Platform Cable USB II or compatible third-party cables can be used for programming and debugging.

Q: Does the XC7VX485T-2FFG1157I support partial reconfiguration? Yes. Partial reconfiguration allows portions of the FPGA fabric to be reprogrammed at runtime without disrupting active regions, enabling flexible and adaptive system designs.


Summary

The XC7VX485T-2FFG1157I is a proven, high-performance FPGA offering 485,760 logic cells, 600 user I/Os, 2,800 DSP slices, and 37,080 Kbits of block RAM in a 1157-pin FCBGA package — all rated for industrial temperatures. Its 28 nm HKMG process, integrated PCIe Gen3, AES-256 bitstream security, and comprehensive Vivado tool support make it a dependable choice for networking, defense, scientific computing, and ASIC emulation applications.

For engineers evaluating the broader range of high-density programmable logic solutions, exploring the full lineup of available Xilinx FPGA devices can help identify the optimal part for logic density, package, speed grade, and temperature requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.