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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC7VX485T-2FFG1157I: Xilinx Virtex-7 XT FPGA — Complete Product Guide

Product Details

The XC7VX485T-2FFG1157I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the powerful Virtex-7 XT family. Designed for demanding applications that require maximum logic capacity, ultra-fast signal processing, and robust I/O bandwidth, this device delivers enterprise-class programmable logic in a compact 1157-pin FCBGA package. Whether you are working in telecommunications, aerospace, defense, scientific computing, or high-speed networking, the XC7VX485T-2FFG1157I offers a compelling combination of performance, power efficiency, and flexibility. For engineers and buyers sourcing premium Xilinx FPGA components, this part represents one of the most capable mid-to-high-range Virtex-7 options available on the market today.


What Is the XC7VX485T-2FFG1157I?

The XC7VX485T-2FFG1157I is a member of AMD Xilinx’s Virtex-7 XT FPGA family, fabricated on a state-of-the-art 28 nm High-K Metal Gate (HKMG) process node. The “XT” designation within the Virtex-7 family indicates an emphasis on high-speed transceiver performance and enhanced I/O capabilities, making this part particularly well-suited for connectivity-intensive workloads.

Part Number Breakdown

Understanding the XC7VX485T-2FFG1157I part number is key to identifying the exact configuration:

Segment Meaning
XC7V Virtex-7 FPGA family
X XT (Extended Transceiver) sub-family
485T 485,760 equivalent logic cells (T = with transceivers)
-2 Speed grade 2 (standard commercial performance tier)
FFG Flip-Chip Fine-pitch Ball Grid Array package type
1157 1,157-pin package footprint
I Industrial temperature range (–40°C to +100°C)

XC7VX485T-2FFG1157I Key Specifications

The table below summarizes the critical electrical, logical, and physical specifications for the XC7VX485T-2FFG1157I:

Parameter Value
FPGA Family Virtex-7 XT
Manufacturer AMD (Xilinx)
Logic Cells (Equivalent) 485,760
Logic Blocks (CLBs) 75,900
Total RAM Bits 37,080 Kbit (37,080,960 bits)
Block RAM 37,969,920 bits (approx. 4,621 Kbytes)
Number of I/Os 600
Maximum Operating Frequency 710 MHz
Clock Management MMCM + PLL
Core Supply Voltage (Min) 970 mV (0.97 V)
Core Supply Voltage (Max) 1.03 V
I/O Supply Voltage 3.3 V
Package FCBGA (Flip-Chip Ball Grid Array)
Pin Count 1,157
Process Node 28 nm HKMG
Speed Grade –2
Temperature Grade Industrial (–40°C to +100°C)
Configuration Interface SelectMAP, JTAG, SPI, BPI
AES Encryption 256-bit with HMAC/SHA-256

Core Architecture and Logic Resources

Configurable Logic Blocks (CLBs) and LUTs

The XC7VX485T-2FFG1157I contains 75,900 logic blocks, translating to approximately 485,760 equivalent logic cells. Each CLB in the Virtex-7 architecture includes six-input Look-Up Tables (LUTs) and flip-flops, enabling fine-grained logic optimization for both area-critical and performance-critical designs. This level of logic density makes the XC7VX485T-2FFG1157I suitable for complex ASIC prototyping and multi-function system integration on a single chip.

Block RAM (BRAM) Architecture

With over 37 Megabits of on-chip Block RAM, the device supports large embedded data buffers, FIFO queues, and local memory architectures essential for high-throughput signal processing pipelines. The BRAM is organized as dual-port, 36Kb primitive blocks (also usable as two independent 18Kb units), making memory partitioning flexible and design-friendly.

DSP48E1 Slices for High-Performance Arithmetic

The Virtex-7 XT DSP48E1 slice features a 25×18-bit multiplier, a 48-bit accumulator, and a pre-adder stage. This makes the XC7VX485T-2FFG1157I exceptionally powerful for DSP-intensive applications such as:

  • Digital filtering (FIR, IIR)
  • Fast Fourier Transforms (FFT)
  • Radar signal processing
  • High-frequency trading (HFT) acceleration
  • Image and video processing pipelines

The architecture supports up to 4.7 TMAC/s DSP throughput at the family level, making the Virtex-7 XT a leader in programmable DSP performance.


I/O and Clock Management

High-Performance I/O Banks

The XC7VX485T-2FFG1157I provides 600 user I/Os distributed across multiple I/O banks supporting both High-Performance (HP) and High-Range (HR) I/O standards. HP banks support voltage levels from 1.0 V to 1.8 V, while HR banks extend support up to 3.3 V, offering compatibility with a wide array of external interfaces and memory standards including DDR3, LPDDR2, and QDR II+.

Mixed-Mode Clock Manager (MMCM) and PLL

The device integrates multiple Clock Management Tiles (CMTs), each containing one MMCM and one PLL. These provide:

  • Low-jitter clock synthesis and multiplication
  • Phase shifting and duty-cycle correction
  • Spread-spectrum clock generation support
  • Independent clock domain management for multi-clock designs

The maximum internal operating frequency reaches 710 MHz, supporting demanding real-time applications.


Connectivity and Transceiver Features

High-Speed Serial Transceivers

As an XT-class Virtex-7 device, the XC7VX485T-2FFG1157I includes GTX/GTH high-speed serial transceivers capable of operating at multi-gigabit data rates. These transceivers are fully compliant with industry-standard protocols and support line rates essential for:

  • 10GbE and 40GbE Ethernet networking
  • PCIe Gen3 endpoint and root port configurations (up to x8)
  • CPRI/OBSAI for wireless infrastructure
  • SATA/SAS storage interfaces
  • Interlaken and CEI interconnect standards

Integrated PCIe Block

The device includes a hardened PCI Express block supporting up to Gen3 x8 configurations, eliminating the need for soft-IP PCIe implementations and freeing up fabric resources for application logic.


Security and Configuration

AES-256 Encryption with Authentication

The XC7VX485T-2FFG1157I supports 256-bit AES encryption combined with HMAC/SHA-256 authentication for bitstream protection. This is critical for IP protection in commercial and military-grade products. The device also includes built-in Single Event Upset (SEU) detection and correction, making it suitable for radiation-aware and high-reliability deployment scenarios.

Configuration Options

Configuration Mode Description
Master SPI Boot from commodity SPI Flash memory
Master BPI Boot from parallel NOR Flash
SelectMAP High-speed parallel configuration interface
JTAG Standard IEEE 1149.1 boundary scan and in-system programming
Slave Serial / Parallel External configuration controller modes

Package and Physical Specifications

FCBGA-1157 Package Details

Physical Parameter Value
Package Type Flip-Chip Ball Grid Array (FCBGA)
Total Pins 1,157
Package Designation FFG1157
Mounting Type Surface Mount
RoHS Compliance Check manufacturer documentation
Lead Finish Contact distributor for HASL/ENIG options

The FCBGA package delivers excellent thermal performance and signal integrity for high-speed designs, with a fine-pitch ball arrangement that supports dense PCB routing while maintaining reliable solder joint integrity.


Temperature and Operating Conditions

Industrial Temperature Grade (“I” Suffix)

The “I” suffix in XC7VX485T-2FFG1157I designates the industrial temperature range, meaning the device is guaranteed to operate within specifications across the following conditions:

Parameter Min Max
Junction Temperature (Tj) –40°C +100°C
VCCINT (Core Voltage) 0.970 V 1.03 V
VCCAUX (Auxiliary) 1.764 V 1.836 V
VCCO (I/O Supply, 3.3V banks) 3.135 V 3.465 V

Industrial-grade devices are essential in environments subject to wide temperature swings, vibration, and long operational lifetimes, such as:

  • Industrial automation and control systems
  • Telecommunications base stations
  • Aerospace electronics
  • Military and defense platforms
  • Scientific instrumentation

Software Tools and Design Flow

Xilinx Vivado Design Suite

The XC7VX485T-2FFG1157I is fully supported by the Xilinx Vivado Design Suite, AMD Xilinx’s flagship IDE for FPGA development. Vivado provides:

  • IP Integrator for block-based design assembly
  • High-level synthesis (HLS) via Vitis HLS
  • Static timing analysis and power estimation
  • In-circuit debugging with ILA (Integrated Logic Analyzer)
  • One-click implementation targeting the FFG1157 package

Note: The older ISE Design Suite does not support Virtex-7 devices. Vivado 2013.1 or later is required for full XC7VX485T support.


Typical Applications

The XC7VX485T-2FFG1157I is engineered to handle the most challenging compute and connectivity workloads across a broad range of industries:

Industry Typical Application
Telecommunications 10G/40G/100G line cards, protocol processing
Aerospace & Defense Radar signal processing, EW, secure communications
Scientific Computing Accelerator boards, real-time data acquisition
Financial Technology Ultra-low latency market data and order execution
Medical Imaging MRI/CT reconstruction, ultrasound beamforming
ASIC Prototyping Pre-silicon validation and emulation platforms
Industrial Automation Machine vision, motor control, sensor fusion
Networking & Storage NVMe-oF, PCIe switching, FPGA SmartNICs

Ordering and Availability

The XC7VX485T-2FFG1157I is stocked and distributed by major authorized electronic component distributors. When placing an order or sourcing this part, confirm the following details to ensure you receive the correct device:

Ordering Attribute Detail
Manufacturer Part Number XC7VX485T-2FFG1157I
Manufacturer AMD (formerly Xilinx)
DigiKey Part Number 122-1790-ND (verify with distributor)
Package 1156/1157-BBGA, FCBGA
Quantity Pricing Contact distributor for volume breaks
Lead Time Varies; check live inventory
Authorized Distributors DigiKey, Mouser, Avnet, Arrow

Tip: Always purchase from authorized distributors or the manufacturer directly to avoid counterfeit components, particularly for industrial and defense applications.


Comparison: XC7VX485T-2FFG1157I vs. Related Virtex-7 Variants

Part Number Logic Cells I/Os Package Temp Grade Speed Grade
XC7VX485T-2FFG1157I 485,760 600 FCBGA-1157 Industrial –2
XC7VX485T-1FFG1157I 485,760 600 FCBGA-1157 Industrial –1
XC7VX485T-2FFG1158C 485,760 600 FCBGA-1158 Commercial –2
XC7VX485T-2FFG1761I 485,760 700 FCBGA-1761 Industrial –2
XC7VX690T-2FFG1157I 693,120 600 FCBGA-1157 Industrial –2

Choose the XC7VX485T-2FFG1157I when you need industrial temperature coverage, speed grade –2 performance, and the compact 1157-pin footprint. Step up to the FFG1761 package for applications requiring more than 600 user I/Os.


Summary

The XC7VX485T-2FFG1157I is a production-proven, industrial-grade Virtex-7 XT FPGA that combines 485,760 equivalent logic cells, 600 user I/Os, 37 Mb of Block RAM, 710 MHz maximum clock speed, and industry-leading DSP throughput in a 1157-pin FCBGA package. Its 28 nm HKMG process technology delivers up to 50% lower power compared to prior-generation Virtex-6 devices, without sacrificing logic density or raw speed. With support for hardened PCIe Gen3, GTX/GTH multi-gigabit transceivers, AES-256 bitstream encryption, and a full Vivado design flow, this device is an outstanding choice for engineers building next-generation communications, defense, industrial, and scientific computing systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.