The XC7VX690T-1FFG1761C is a high-performance Xilinx FPGA from the AMD Xilinx Virtex-7 XT family, designed for demanding applications that require maximum logic density, high-speed serial connectivity, and exceptional DSP throughput. Built on a 28nm high-k metal gate (HKMG) process node, this device delivers a powerful combination of programmability and performance that makes it a preferred choice for ASIC prototyping, 100G networking, signal processing, and advanced compute systems.
What Is the XC7VX690T-1FFG1761C?
The XC7VX690T-1FFG1761C is a Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx). It belongs to the Virtex-7 XT sub-family — the “XT” designation indicating an optimized transceiver-rich architecture. With 693,120 logic cells, 850 user I/Os, and a 1761-pin FCBGA package, this FPGA is engineered for system integrators and hardware designers who need a production-grade, high-density programmable device in a commercially-graded package.
The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC7V |
Xilinx 7-Series Virtex |
| X |
XT (transceiver-optimized) sub-family |
| 690T |
693K logic cells density tier |
| -1 |
Speed Grade 1 (slowest / most power-efficient) |
| FFG |
Flip-Chip Fine-pitch BGA package type |
| 1761 |
1761-pin ball count |
| C |
Commercial temperature grade (0°C to 85°C) |
XC7VX690T-1FFG1761C Key Specifications
Core Device Parameters
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Series |
Virtex-7 XT |
| Part Number |
XC7VX690T-1FFG1761C |
| Technology Node |
28nm HKMG |
| Logic Cells |
693,120 |
| Configurable Logic Blocks (CLBs) |
108,300 |
| Look-Up Tables (LUTs) |
433,200 |
| Flip-Flops |
866,400 |
| DSP Slices |
3,600 |
| Block RAM (36 Kb each) |
1,470 blocks (52,920 Kbits total) |
I/O and Package Specifications
| Parameter |
Value |
| Package Type |
1760-BBGA, FCBGA (Flip-Chip BGA) |
| Total Package Pins |
1,761 |
| Maximum User I/Os |
850 |
| I/O Standards Supported |
LVCMOS, LVDS, SSTL, HSTL, and more |
| DDR3 Interface Support |
Up to 1,866 Mb/s |
| Mounting Type |
Surface Mount |
Electrical and Thermal Specifications
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
0.97V – 1.03V (nominal 1.0V) |
| Operating Temperature (TJ) |
0°C to 85°C (Commercial Grade) |
| RoHS Status |
RoHS3 Compliant |
| Product Status |
Active |
| Packaging Format |
Tray |
High-Speed Transceiver Specifications
| Parameter |
Value |
| GTX Transceivers |
80 |
| Transceiver Speed Range |
600 Mb/s – 6.6 Gb/s |
| Maximum Transceiver Rate |
Up to 11.3 Gb/s (GTH-class capable) |
| Low-Power Mode |
Yes (chip-to-chip optimization) |
| Total Serial Bandwidth |
Up to 1.4 Tb/s |
XC7VX690T-1FFG1761C Features and Architecture
Advanced 6-Input LUT Logic Fabric
The XC7VX690T-1FFG1761C is built around Xilinx’s proven 6-input Look-Up Table (LUT) architecture. Each LUT can be configured as a distributed RAM or shift register, providing highly flexible, high-performance logic that efficiently maps complex combinational and sequential functions. With 433,200 LUTs and 866,400 registers, this FPGA provides deep pipelining capability for demanding, high-throughput designs.
High-Density Block RAM for On-Chip Buffering
The device integrates 1,470 dual-port 36 Kb block RAM tiles, totaling 52,920 Kbits of on-chip memory. Each tile includes built-in FIFO logic, making this FPGA ideal for packet buffering, frame memory, lookup table storage, and co-processor scratchpad applications. The block RAM supports both simple dual-port and true dual-port modes, with byte-wide write enables and optional ECC.
DSP48E1 Slices for High-Throughput Signal Processing
With 3,600 DSP48E1 slices, the XC7VX690T-1FFG1761C delivers approximately 4.7 TMAC/s of DSP compute capability. Each DSP48E1 slice contains a 25×18-bit two’s complement multiplier cascaded with a 48-bit accumulator. These slices are chained together in applications such as FIR filters, FFTs, matrix multiplication, and radar signal processing, eliminating the need for external DSP co-processors in many designs.
SelectIO High-Performance I/O Technology
The device supports Xilinx’s SelectIO technology, providing access to a wide range of programmable I/O standards including LVCMOS, LVDS, SSTL15, and HSTL. It supports DDR3 memory interfaces at data rates up to 1,866 Mb/s, making it suitable for high-bandwidth memory subsystems in ASIC prototyping boards and network processing cards.
Multi-Gigabit GTX Transceivers
The XC7VX690T-1FFG1761C includes 80 GTX transceivers capable of operating from 600 Mb/s to 6.6 Gb/s. These transceivers feature:
- Built-in 8b/10b, 64b/66b, and 64b/67b encoding/decoding
- Pre-emphasis and equalization for long-trace and backplane applications
- A dedicated low-power mode optimized for chip-to-chip communication
- Compliance with PCIe Gen2, SATA, CPRI, JESD204B, and other protocols
XADC: On-Chip Analog Intelligence
The integrated XADC (Xilinx Analog-to-Digital Converter) block provides two 12-bit, 1 MSPS ADC channels with on-chip thermal and supply voltage sensors. This enables real-time monitoring of junction temperature and power rails without external ICs, simplifying board design and improving system reliability during prolonged operation.
Clock Management Tiles (CMTs)
The FPGA includes multiple Clock Management Tiles (CMTs), each containing a Phase-Locked Loop (PLL) and a Mixed-Mode Clock Manager (MMCM). These allow designers to synthesize, multiply, divide, and phase-shift clock signals with low jitter, supporting complex multi-clock domain designs common in networking and video processing systems.
XC7VX690T-1FFG1761C vs. Other Speed Grades
The XC7VX690T is available in multiple speed grades. The -1 speed grade in the commercial (C) temperature range is the most power-efficient variant for designs that do not require maximum frequency headroom. The table below compares the major speed grade options in the 1761-pin package:
| Part Number |
Speed Grade |
Temp Grade |
Target Use Case |
| XC7VX690T-1FFG1761C |
-1 (Standard) |
Commercial (0–85°C) |
Production designs, power-sensitive |
| XC7VX690T-2FFG1761C |
-2 (Fast) |
Commercial (0–85°C) |
High-frequency commercial systems |
| XC7VX690T-3FFG1761C |
-3 (Fastest) |
Commercial (0–85°C) |
Maximum performance, low volume |
| XC7VX690T-2FFG1761I |
-2 (Fast) |
Industrial (–40–100°C) |
Harsh environments, extended life |
Target Applications for the XC7VX690T-1FFG1761C
The XC7VX690T-1FFG1761C is a versatile FPGA suited for a broad range of high-performance applications:
1. 100G Ethernet and High-Speed Networking
With 80 GTX transceivers delivering over 1.4 Tb/s of aggregate serial bandwidth, this FPGA is a natural fit for line cards, packet processors, and network fabric switches operating at 40G to 100G.
2. ASIC Prototyping
The 693,120-cell logic fabric provides enough capacity to prototype mid-to-large ASICs. The high I/O count and DDR3 interface support accelerate pre-silicon verification cycles.
3. Radar and Electronic Warfare Signal Processing
The 3,600 DSP slices enable real-time FFT, beamforming, and matched filter processing. The commercial temperature grade supports lab and rack-mounted systems in benign environments.
4. Test and Measurement Equipment
High-density logic and analog-grade XADC sensing make this FPGA suitable for protocol analyzers, arbitrary waveform generators, and BERT instruments.
5. Video Processing and Broadcast Infrastructure
The large LUT and block RAM count accommodates multi-channel video pipeline designs for 4K/8K broadcast encoding, image processing, and FPGA-based machine vision.
6. Medical Imaging Systems
For CT, MRI, and ultrasound signal chains operating in regulated but non-extreme-temperature environments, the XC7VX690T-1FFG1761C offers the compute density and I/O flexibility required.
Development Toolchain and Design Support
AMD Xilinx provides comprehensive software support for the XC7VX690T-1FFG1761C through the Vivado Design Suite. Key toolchain capabilities include:
| Tool |
Description |
| Vivado Design Suite |
RTL synthesis, implementation, bitstream generation |
| Vivado Simulator |
Functional and timing simulation |
| IP Integrator |
Block design environment with pre-validated IP cores |
| Vivado HLS (Vitis HLS) |
C/C++ to RTL high-level synthesis |
| ChipScope Pro / ILA |
In-system debugging via JTAG |
| Power Estimator |
Early-stage power analysis |
The device is fully supported from Vivado 2013.x onwards. Xilinx also provides verified IP cores for PCIe, Ethernet MAC (10G/100G), Memory Controllers, and JESD204B through the Vivado IP catalog and Xilinx IP licensing.
Ordering Information
| Field |
Detail |
| Manufacturer Part Number |
XC7VX690T-1FFG1761C |
| Manufacturer |
AMD (Xilinx) |
| FPGA Family |
Virtex-7 XT |
| Package |
1760-BBGA, FCBGA |
| Speed Grade |
-1 |
| Temperature Grade |
Commercial (C), 0°C to 85°C TJ |
| Mounting |
Surface Mount (SMD) |
| RoHS Compliance |
RoHS3 Compliant |
| Packaging |
Tray |
| Product Status |
Active |
| Manufacturer Lead Time |
~40 weeks (standard) |
Frequently Asked Questions (FAQ)
Q: What is the difference between XC7VX690T-1FFG1761C and XC7VX690T-2FFG1761C? The primary difference is the speed grade. The -1 variant operates at a lower maximum frequency and consumes less dynamic power, while the -2 variant supports higher clock frequencies at slightly higher power. Both have identical logic resources and package pinouts, making them pin-compatible for board-level substitution.
Q: Is the XC7VX690T-1FFG1761C RoHS compliant? Yes. The device carries RoHS3 compliance, confirming it meets the latest EU Restriction of Hazardous Substances directive requirements.
Q: What design software is required for the XC7VX690T-1FFG1761C? AMD’s Vivado Design Suite is the primary tool. A free WebPACK edition covers basic use; however, the Virtex-7 family typically requires a paid Vivado license for full implementation support.
Q: Can this FPGA be used in industrial-temperature applications? The -1FFG1761C suffix designates a commercial-grade part (0°C to 85°C junction temperature). For industrial or extended-temperature environments, engineers should specify the I-suffix variants such as XC7VX690T-2FFG1761I.
Q: What PCB design considerations apply to the 1761-pin FCBGA package? The 1761-ball FCBGA footprint requires a high-layer-count PCB (typically 10–16 layers) with impedance-controlled routing, power planes for VCCINT/VCCO/VCCAUX rails, and attention to signal integrity for the GTX transceiver lanes. AMD Xilinx provides PCB guidelines in the Virtex-7 FPGA packaging and pinout specification.
Summary
The XC7VX690T-1FFG1761C is one of the most capable commercial-grade FPGAs in the AMD Xilinx 7-Series portfolio. Its combination of 693,120 logic cells, 80 GTX transceivers, 3,600 DSP slices, and 52,920 Kbits of block RAM makes it an ideal platform for bandwidth-intensive, compute-heavy, and high-throughput system designs. Whether deployed in networking infrastructure, defense-grade signal processors, or ASIC emulation platforms, this device delivers the programmability and performance headroom that advanced system architects demand.
