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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1251C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1251C is a high-performance Field Programmable Gate Array (FPGA) manufactured by Xilinx, belonging to the Spartan-II product family. With 200,000 system gates, 5,292 logic cells, and a 1251-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered for demanding applications that require flexible programmable logic in a compact, high-density form factor. Whether you are designing for telecommunications, industrial automation, or embedded computing, the XC2S200-6FGG1251C delivers reliable performance at a competitive price point.

For engineers and procurement teams sourcing Xilinx programmable logic devices, explore the full range at Xilinx FPGA.


What Is the XC2S200-6FGG1251C?

The XC2S200-6FGG1251C is a member of the Xilinx Spartan-II FPGA family, built on a 0.18 µm CMOS process technology and operating on a 2.5V core supply. The part number decodes as follows:

Part Number Segment Meaning
XC2S200 Spartan-II family, 200K system gates
-6 Speed grade 6 (fastest available, commercial only)
FGG Fine-Pitch Ball Grid Array (Pb-Free variant)
1251 1251-pin package
C Commercial temperature range (0°C to +85°C)

The “G” in FGG indicates a Pb-free (RoHS-compliant) package, making it suitable for modern eco-conscious manufacturing environments.


XC2S200-6FGG1251C Key Specifications

Core Logic Resources

Parameter Value
Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Electrical & Physical Characteristics

Parameter Value
Core Supply Voltage 2.5V
Process Technology 0.18 µm
Package Type FBGA (Fine-Pitch Ball Grid Array)
Pin Count 1,251
Speed Grade -6 (263 MHz max)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (Pb-Free, “G” suffix)

XC2S200-6FGG1251C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is built around a regular, flexible array of Configurable Logic Blocks (CLBs). Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry logic. With 1,176 CLBs in a 28×42 array, the XC2S200 provides substantial combinational and sequential logic capacity for complex design implementations.

Input/Output Blocks (IOBs)

Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). The XC2S200-6FGG1251C supports up to 284 user I/O pins, each configurable for multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, and HSTL. The IOBs also support input delays and optional registered inputs and outputs.

Delay-Locked Loops (DLLs)

The XC2S200 integrates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs enable zero-delay clock distribution, clock frequency synthesis, and phase shifting — critical features for high-speed synchronous designs.

Block RAM

Two columns of 56K bits total block RAM are placed on opposite sides of the die, between the CLB array and the IOB columns. This embedded memory provides fast, synchronous dual-port storage ideal for FIFOs, lookup tables, and data buffering.


Configuration Modes

The XC2S200-6FGG1251C supports multiple configuration modes, allowing flexible system integration:

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1 bit Yes
Slave Serial Input 1 bit Yes
Slave Parallel Input 8 bits No
Boundary-Scan (JTAG) N/A 1 bit No

During power-on and throughout configuration, all I/O drivers remain in a high-impedance state, ensuring safe system startup.


XC2S200-6FGG1251C vs. Other Spartan-II Devices

Understanding how the XC2S200-6FGG1251C compares to other members of the Spartan-II family helps engineers select the right device for their design requirements.

Device Logic Cells System Gates CLB Array Max I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the preferred choice for designs requiring maximum logic density.


Applications of the XC2S200-6FGG1251C

The XC2S200-6FGG1251C is suitable for a wide range of industrial and commercial applications:

Embedded Systems & SoC Prototyping

The large logic capacity and abundant I/O resources make the XC2S200 ideal for prototyping system-on-chip designs before committing to an ASIC.

Telecommunications & Networking

The four DLLs and high-speed I/O capabilities support line-rate data processing, framing logic, and protocol bridging in telecom line cards and network equipment.

Industrial Automation & Control

The commercial-grade XC2S200-6FGG1251C supports real-time control logic, motor drive management, and sensor interface designs in factory automation environments.

Video & Image Processing

The combination of distributed RAM and block RAM resources enables pipelining of video frame data, making this FPGA useful for image acquisition and basic processing tasks.

Wireless & Consumer Electronics

The Spartan-II family was specifically designed for high-volume applications where a fast programmable solution adds benefits over fixed ASICs, including the ability to update the design in the field without hardware replacement.


Advantages of the -6 Speed Grade

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the commercial temperature range. Key timing advantages include:

Timing Parameter Benefit
Maximum clock frequency Up to 263 MHz
Faster setup and hold times Enables tighter pipeline stages
Reduced propagation delay Supports higher-speed bus interfaces
Commercial temperature (0°C–85°C) Suitable for office, lab, and controlled industrial environments

Why Choose Pb-Free (FGG) Packaging?

The “G” in FGG denotes a Pb-free (lead-free) package finish, making the XC2S200-6FGG1251C:

  • RoHS compliant for sale and use in the European Union and other regulated markets
  • Compatible with standard lead-free soldering processes (SAC alloys)
  • Preferred by manufacturers adhering to environmental and sustainability standards
  • Drop-in compatible with standard FGG1251 land patterns — no PCB redesign required

Ordering Information & Part Number Decoder

Xilinx Spartan-II devices follow a structured ordering convention:

XC2S200 - 6 - FGG - 1251 - C
  |        |    |     |     |
  |        |    |     |     └─ Temperature: C = Commercial (0° to +85°C)
  |        |    |     └─────── Pin count: 1251
  |        |    └───────────── Package: FGG = Fine-Pitch BGA, Pb-Free
  |        └────────────────── Speed Grade: -6 (fastest, commercial only)
  └─────────────────────────── Device: Spartan-II, 200K gates

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1251C used for?

The XC2S200-6FGG1251C is used in embedded systems, telecommunications, industrial control, video processing, and consumer electronics where a high-density, reprogrammable logic device is required.

Is the XC2S200-6FGG1251C RoHS compliant?

Yes. The “G” in the package designator (FGG) confirms that this is a Pb-free, RoHS-compliant device.

What tools are used to program the XC2S200-6FGG1251C?

The device is supported by Xilinx ISE Design Suite. Configuration can be performed via JTAG (Boundary-Scan), Master Serial, Slave Serial, or Slave Parallel modes.

What is the difference between XC2S200-6FGG1251C and XC2S200-5FGG1251C?

The primary difference is speed grade. The -6 variant has the fastest timing characteristics and is available only in the commercial temperature range. The -5 variant is slightly slower but may be available in additional temperature grades.

Is the XC2S200-6FGG1251C still in production?

The Spartan-II family is a mature product line. Availability may vary by distributor. Always verify current stock with authorized suppliers before committing to a design.


Summary

The XC2S200-6FGG1251C is the flagship device of Xilinx’s Spartan-II FPGA family — offering 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, and the fastest -6 speed grade in a Pb-free 1251-pin FBGA package. Its combination of density, speed, I/O flexibility, and environmental compliance makes it an excellent choice for engineers who need maximum Spartan-II capability in a commercial-temperature design.

For sourcing and more information on Xilinx programmable logic solutions, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.