Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX690T-L2FFG1158E: Xilinx Virtex-7 FPGA – Complete Product Guide

Product Details

The XC7VX690T-L2FFG1158E is a high-performance, low-power Xilinx FPGA from AMD’s Virtex-7 XT family. Built on a 28nm high-k metal gate (HKMG) process, it delivers exceptional DSP throughput, transceiver bandwidth, and logic density — making it an ideal choice for demanding applications in telecommunications, data centers, test equipment, and high-speed signal processing.


What Is the XC7VX690T-L2FFG1158E?

The XC7VX690T-L2FFG1158E is a member of the Virtex-7 XT (Extended Transceiver) FPGA family manufactured by Xilinx (now AMD). The “L2” speed grade designation indicates it is an extended lower-power variant offering improved performance-per-watt compared to standard commercial speed grades. The FFG1158 suffix refers to its 1158-pin Flip-Chip Ball Grid Array (FCBGA) package, while the “E” suffix indicates an extended temperature/performance grade device.

This device is particularly suited for engineers who need the high-bandwidth transceiver capabilities of the Virtex-7 XT series in a smaller 1158-pin form factor, enabling more compact PCB designs without sacrificing core performance.


XC7VX690T-L2FFG1158E Key Specifications

General Product Information

Parameter Value
Manufacturer AMD / Xilinx
Part Number XC7VX690T-L2FFG1158E
Family Virtex-7 XT
Series XC7VX690T
Technology Process 28nm HPL (High-Performance Low-Power)
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Designator FFG1158
Number of Pins 1158
Speed Grade L2 (Low-Power Extended)
Temperature Grade Extended (E)
Operating Temperature 0°C to +100°C (junction)
RoHS Compliance Yes (Pb-free)

Logic Resources

Resource Quantity
Logic Cells 693,120
CLB Slices 108,300
LUT Elements (6-input) 433,200
Flip-Flops 866,400
Maximum Distributed RAM 10,888 Kb

Memory Resources

Memory Type Specification
Block RAM (BRAM) 52,920 Kb total
Block RAM Blocks (36 Kb) 1,470
BRAM Type True Dual-Port with built-in FIFO

DSP and Signal Processing

DSP Parameter Value
DSP48E1 Slices 3,600
Peak DSP Performance Up to 2,784 GMAC/s
DSP Slice Operating Speed 640 MHz

I/O and Transceiver Resources (FFG1158 Package)

I/O Parameter Value
Maximum User I/O (FFG1158) 350
I/O Standards Supported LVDS, LVCMOS, SSTL, HSTL, and more
SelectIO Technology High-performance (HP) banks
DDR3 Memory Interface Support Up to 1,866 Mb/s
GTH Transceivers 48 (up to 13.1 Gb/s per channel)
GTX Transceivers Included in XT family architecture
Transceiver Low-Speed Range 600 Mb/s
Transceiver High-Speed Range Up to 13.1 Gb/s
Aggregate Transceiver Bandwidth 1.4 Tb/s (system-level)

Clocking and Timing

Clock Resource Value
Clock Management Tiles (CMT) 14
MMCMs per CMT 1
PLLs per CMT 1
Maximum Clock Frequency Device- and design-dependent
XADC (Analog Interface) Dual 12-bit, 1 MSPS ADC

PCIe Interface

PCIe Feature Value
Integrated PCIe Blocks Up to 3
PCIe Generation Supported Gen 3 (x8)
Max PCIe Data Rate 8.0 Gb/s per lane
Max Payload Size Up to 1,024 bytes

Power Supply Requirements

Supply Rail Voltage
VCCINT (Core Voltage) 1.0V
VCCAUX 1.8V
VCCO (I/O Banks) 1.2V – 1.8V (HP banks)

Part Number Decoder: Understanding XC7VX690T-L2FFG1158E

Breaking down the part number helps procurement engineers, designers, and distributors quickly identify key attributes:

Code Segment Meaning
XC7V Xilinx 7-Series, Virtex family
X XT (Extended Transceiver) sub-family
690T 690K logic cell equivalent, T = Transceiver device
L2 Speed grade L2 — Low-power optimized, high performance
FFG Flip-Chip Fine-pitch BGA (Pb-free)
1158 1158 total package pins
E Extended temperature/performance grade

Key Features and Technology Highlights

28nm HPL Process Technology

The XC7VX690T-L2FFG1158E is built on Xilinx’s 28nm High-Performance Low-power (HPL) process using high-k metal gate (HKMG) transistors. This process node enables up to 50% lower power consumption compared to previous 40nm Virtex-6 generation devices, while simultaneously delivering significantly higher performance and logic density.

High-Performance 6-Input LUT Architecture

The device uses advanced 6-input lookup table (LUT) logic cells, which can be configured either as logic or as distributed RAM. This dual-purpose capability gives designers exceptional flexibility when partitioning on-chip memory and logic resources across complex designs.

GTH High-Speed Serial Transceivers

One of the most critical features of the Virtex-7 XT family is its integrated GTH transceivers capable of line rates from 600 Mb/s up to 13.1 Gb/s per channel. The transceivers include a dedicated low-power mode optimized for chip-to-chip links, making them ideal for backplane communications, optical modules, and high-speed serial fabric designs.

Integrated PCIe Gen 3 Block

The XC7VX690T-L2FFG1158E integrates up to three hardened PCI Express blocks, each supporting up to x8 Gen 3 operation. This enables designers to implement PCIe root ports or endpoints without consuming programmable fabric, reducing design complexity and improving timing closure.

High-Density Block RAM with FIFO Logic

With 1,470 dual-port 36 Kb block RAMs (totaling 52,920 Kb), this FPGA provides abundant on-chip memory for buffering, caching, and data-path storage. Each BRAM comes with built-in FIFO logic, simplifying the implementation of high-throughput data pipelines.

SelectIO High-Performance I/O Banks

The 350 user I/Os in the FFG1158 package are organized into High-Performance (HP) banks supporting I/O voltages from 1.2V to 1.8V. These banks support a wide range of industry-standard I/O protocols including LVDS, SSTL15, HSTL, and LVCMOS, with DDR3 memory interfaces running up to 1,866 Mb/s.

XADC Integrated Analog Interface

An on-chip XADC block incorporates dual 12-bit, 1 MSPS analog-to-digital converters with integrated thermal and supply voltage sensors. This enables real-time on-chip power and temperature monitoring without external measurement hardware.

Clock Management Tiles (CMT)

Fourteen CMTs, each containing one MMCM and one PLL, provide comprehensive clock synthesis, phase adjustment, and distribution resources. This makes it straightforward to implement multi-clock domain designs and high-precision timing architectures.


Applications and Use Cases

The XC7VX690T-L2FFG1158E is well-suited for a broad range of high-performance embedded and communication system applications:

Application Area Example Use Cases
Telecommunications 100G/400G line cards, OTN framing, SDH/SONET processing
Data Centers SmartNICs, network acceleration, hardware offload
Radar and Defense Signal acquisition, beamforming, waveform generation
Medical Imaging High-speed data capture, image reconstruction
Test & Measurement Oscilloscopes, logic analyzers, protocol analyzers
Wireless Infrastructure Baseband processing, CPRI/eCPRI interfaces
High-Performance Computing Hardware acceleration, custom compute fabrics
Video Broadcasting 4K/8K video processing, multi-channel encoding

XC7VX690T-L2FFG1158E vs. Related Part Numbers

Engineers frequently compare this device to similar parts in the same family. The table below highlights differences in speed grade and package:

Part Number Speed Grade Package Pins Temperature Grade
XC7VX690T-L2FFG1158E L2 (Low-Power) FFG1158 1158 Extended
XC7VX690T-2FFG1158I 2 FFG1158 1158 Industrial
XC7VX690T-2FFG1158C 2 FFG1158 1158 Commercial
XC7VX690T-3FFG1158E 3 (Fastest) FFG1158 1158 Extended
XC7VX690T-L2FFG1157E L2 (Low-Power) FFG1157 1157 Extended
XC7VX690T-2FFG1761C 2 FFG1761 1761 Commercial

The L2 speed grade is ideal for applications where power efficiency is prioritized alongside high performance, such as deployed line cards and space-constrained embedded systems.


Development Tools and Design Flow

Xilinx Vivado Design Suite

The XC7VX690T-L2FFG1158E is fully supported by AMD’s Vivado Design Suite, the primary design environment for 7-series and newer FPGAs. Vivado provides:

  • Logic synthesis and implementation
  • Timing analysis and constraint management
  • IP integrator for block-based design
  • Simulation and hardware debug

Legacy ISE Support

The device is also compatible with Xilinx ISE 14.7, allowing designers with existing ISE-based design flows to utilize this part without immediate migration to Vivado.

IP Cores Available

A rich ecosystem of Xilinx IP cores is available for this device, including PCIe endpoints, memory controllers (MIG), Ethernet MACs (TEMAC/CMAC), high-speed transceiver PHYs, and DSP libraries — all accessible through the Vivado IP Catalog.


Ordering and Procurement Information

Attribute Detail
Part Number XC7VX690T-L2FFG1158E
Manufacturer AMD (Xilinx)
Product Category Embedded FPGAs
Package 1158-pin FCBGA (FFG1158)
Lead-Free Yes (RoHS compliant)
Minimum Order Quantity Varies by distributor
Typical Lead Time Contact authorized distributor

Note: Always source from authorized distributors or directly from AMD/Xilinx to ensure genuine, traceable components. Counterfeit FPGAs are a known risk in the secondary market for high-value programmable devices.


Frequently Asked Questions (FAQ)

Q: What does the “L2” speed grade mean in XC7VX690T-L2FFG1158E? The “L2” speed grade designates a Low-Power variant of the standard speed grade 2. It is optimized for reduced static and dynamic power consumption while maintaining competitive performance levels. It is ideal for applications that require high compute density with strict power budgets.

Q: Is the XC7VX690T-L2FFG1158E footprint compatible with other 1158-pin Virtex-7 XT devices? Yes. The FFG1158 package is shared across several XC7VX690T variants (e.g., -2FFG1158C, -2FFG1158I, -3FFG1158E), making board-level migration between speed grades and temperature grades straightforward without PCB redesign.

Q: What transceiver type does the XC7VX690T-L2FFG1158E use? The Virtex-7 XT family uses GTH transceivers capable of operation from 600 Mb/s up to 13.1 Gb/s, with support for protocols such as CPRI, JESD204B, PCIe Gen3, SATA, and 10G/40G Ethernet.

Q: What design tools support this device? The XC7VX690T-L2FFG1158E is supported by Xilinx Vivado Design Suite and the legacy ISE 14.7 toolchain. Vivado is recommended for all new designs.

Q: Can this FPGA be used in industrial or extended temperature applications? The “E” suffix indicates an Extended grade device, rated for junction temperatures from 0°C to 100°C. This makes it suitable for demanding industrial, telecommunications infrastructure, and high-reliability embedded system applications.


Summary

The XC7VX690T-L2FFG1158E stands out as one of the most capable FPGA solutions in the Virtex-7 XT family for applications requiring the combination of large logic density, high-speed GTH transceivers, integrated PCIe Gen 3, and a compact 1158-pin footprint. Its 28nm HPL process technology and Low-Power L2 speed grade make it a strong candidate for next-generation communication, computing, and signal processing systems where both performance and power efficiency are mission-critical.

Whether you are designing high-speed networking ASICs replacements, building radar DSP platforms, or developing test equipment with demanding real-time requirements, the XC7VX690T-L2FFG1158E delivers the resources and flexibility to realize the most complex FPGA designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.