Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC7VX690T-L2FFG1930E: Xilinx Virtex-7 XT FPGA – Full Product Guide

Product Details

The XC7VX690T-L2FFG1930E is a high-performance, low-power Xilinx FPGA from AMD’s Virtex-7 XT family. Built on an advanced 28nm high-k metal gate (HKMG) process technology, this device delivers exceptional logic density, DSP throughput, and I/O bandwidth — making it an ideal choice for signal processing, high-speed networking, and demanding embedded applications.

This product description covers everything engineers and procurement teams need to know: part number decoding, full technical specifications, key features, application use cases, and ordering information.


What Is the XC7VX690T-L2FFG1930E?

The XC7VX690T-L2FFG1930E is a member of the Virtex-7 XT (Extended Transceiver) FPGA family from Xilinx (now AMD). The “XT” designation indicates this device is optimized for high-speed serial connectivity, featuring GTX and GTH transceivers capable of reaching up to 11.3 Gb/s per channel.

The “L2” speed grade denotes a low-power variant of the -2 speed grade, balancing performance with power efficiency. This makes the XC7VX690T-L2FFG1930E particularly attractive for power-sensitive deployments such as telecommunications infrastructure, aerospace systems, and high-density computing platforms.


Part Number Breakdown

Understanding the part number helps engineers quickly identify the exact device characteristics:

Field Value Meaning
XC XC Xilinx Commercial
7V 7V 7 Series, Virtex Family
X X XT (Extended Transceiver) Sub-Family
690T 690T Density/Configuration (693,120 Logic Cells)
L2 L2 Low-Power Speed Grade (-2 equivalent)
FFG FFG Flip-Chip Fine-Pitch BGA Package
1930 1930 1930-pin Package
E E Extended Temperature Range (0°C to +100°C)

Key Technical Specifications

Core Logic Resources

Parameter Value
FPGA Family Virtex-7 XT
Logic Cells 693,120
Configurable Logic Blocks (CLBs) 108,300
LUT6 Elements 433,200
Flip-Flops 866,400
Process Node 28nm HPL (High-Performance Low-Power)
Core Voltage (VCCINT) 0.97V – 1.03V

Memory Resources

Parameter Value
Block RAM (36Kb each) 1,470
Total Block RAM 52,920 Kbits
Distributed RAM Configurable via LUTs
FIFO Support Built-in FIFO logic in each Block RAM

DSP Performance

Parameter Value
DSP48E1 Slices 3,600
Peak DSP Performance 4.7 TMAC/s
DSP Arithmetic Width 25×18 multiplier with 48-bit accumulator

I/O and Connectivity

Parameter Value
Maximum User I/O 1,000
Package Pins 1,930 (FCBGA)
SelectIO Standards Supported LVDS, SSTL, HSTL, LVCMOS, and more
DDR3 Interface Support Up to 1,866 Mb/s
I/O Bandwidth Up to 1.4 Tb/s

High-Speed Serial Transceivers

Parameter Value
GTX Transceivers 80
GTH Transceivers 0 (GTX-only variant)
Transceiver Speed Range 600 Mb/s to 11.3 Gb/s
Low-Power Mode Yes (optimized for chip-to-chip links)

Clocking

Parameter Value
CMT (Clock Management Tiles) 14
MMCMs per CMT 1
PLLs per CMT 1
Maximum Clock Frequency 710 MHz (fabric)

Package and Physical Characteristics

Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code FFG1930
Pin Count 1,930
Temperature Grade E (Extended: 0°C to +100°C)
RoHS Compliance Yes
Pb-Free Yes

XC7VX690T-L2FFG1930E vs. Similar Speed Grades

Engineers often compare the L2, -2, and -3 speed grades. Here’s a quick comparison:

Part Number Speed Grade Temperature Use Case
XC7VX690T-L2FFG1930E L2 (Low-Power -2) Extended (E) Power-sensitive systems
XC7VX690T-2FFG1930C -2 (Standard) Commercial (C) General commercial use
XC7VX690T-3FFG1930E -3 (Fastest) Extended (E) Maximum performance apps
XC7VX690T-1FFG1930I -1 (Economy) Industrial (I) Cost-sensitive industrial

Top Features of the XC7VX690T-L2FFG1930E

Advanced 6-Input LUT Architecture

The device uses real 6-input Look-Up Tables (LUT6) configurable as distributed memory, enabling compact, high-speed logic implementations that reduce routing overhead compared to older 4-LUT architectures.

High-Speed GTX Transceivers

With 80 GTX transceivers capable of operating from 600 Mb/s up to 11.3 Gb/s, the XC7VX690T-L2FFG1930E can handle demanding serial protocols including PCIe, 10G/40G/100G Ethernet, Interlaken, OTN, and CPRI/OBSAI in wireless backhaul applications.

Integrated PCIe Interface Block

The device includes a hardened PCIe Gen 3 x8 interface block, reducing resource utilization and design complexity when interfacing with host CPUs and SSD controllers.

XADC Analog Interface

An on-chip Xilinx Analog-to-Digital Converter (XADC) provides dual 12-bit, 1 MSPS ADC channels with integrated thermal and voltage supply sensors — enabling real-time system health monitoring without external components.

Low-Power “L2” Operation

The “L2” speed grade is engineered to deliver the same switching performance as a standard -2 device while consuming significantly less static and dynamic power — a key advantage in deployments where thermal management and power budgets are tightly constrained.

SSI (Stacked Silicon Interconnect) Technology

The XC7VX690T family leverages AMD’s Stacked Silicon Interconnect technology, which connects multiple silicon dies using a passive silicon interposer, enabling logic densities that exceed what is practical on a single die.


Supported I/O Standards

The XC7VX690T-L2FFG1930E supports a wide range of I/O voltage standards:

Standard Voltage Application
LVCMOS33 3.3V General purpose logic
LVCMOS18 1.8V Low-power interfaces
LVDS 1.2–1.8V High-speed differential
SSTL15 1.5V DDR3 memory interfaces
HSTL 1.2–1.5V High-speed parallel buses
LVPECL 2.5V Clock distribution

Typical Applications

Wireless Base Station and LTE/5G Infrastructure

The combination of GTX transceivers and DSP density makes this device well-suited for CPRI/eCPRI fronthaul, baseband processing, and beamforming in 4G/5G radio equipment.

100G Optical Networking

With support for OTN (Optical Transport Network) and high-speed Ethernet line cards, the XC7VX690T-L2FFG1930E is widely used in data center switch fabrics and long-haul optical transport systems.

High-Performance Computing (HPC) Acceleration

The FPGA’s large DSP slice count and high memory bandwidth make it effective for accelerating financial analytics, genomics, AI inference, and matrix operations in HPC environments.

Military and Aerospace

The extended temperature range (E-grade) and high reliability of the Virtex-7 platform make it a strong fit for radar signal processing, electronic warfare, and satellite communication payloads.

Medical Imaging

High-speed data acquisition, real-time image reconstruction, and connectivity to sensor arrays make this FPGA suitable for CT, MRI, and ultrasound imaging systems.


Design Tool Support

The XC7VX690T-L2FFG1930E is fully supported by AMD’s Vivado Design Suite, which provides:

  • Synthesis and place-and-route
  • IP integrator for rapid subsystem assembly
  • Timing closure and power analysis
  • In-circuit debug via ILA (Integrated Logic Analyzer)
  • High-Level Synthesis (HLS) for algorithm designers

Legacy designs using Xilinx ISE 14.7 are also supported.


Ordering Information

Parameter Detail
Manufacturer AMD / Xilinx
Part Number XC7VX690T-L2FFG1930E
FPGA Family Virtex-7 XT
Package 1930-pin FCBGA
Speed Grade L2 (Low-Power)
Temperature Range Extended (0°C to +100°C)
Lifecycle Status Active
Moisture Sensitivity Level (MSL) 3
Packaging Tray

Frequently Asked Questions

Q: What is the difference between the XC7VX690T-L2FFG1930E and XC7VX690T-2FFG1930C? The L2 variant is a low-power version of the -2 speed grade intended for extended temperature range applications (0°C to +100°C). The -2C is a standard commercial grade device rated 0°C to +85°C. They share the same die and package but differ in validated operating conditions and power profiles.

Q: Is the XC7VX690T-L2FFG1930E pin-compatible with the XC7VX690T-2FFG1930C? Yes — both use the FFG1930 package, making them footprint-compatible for PCB design reuse.

Q: What transceiver protocols are natively supported? The GTX transceivers support PCIe Gen 3, 10GbE, CPRI, OTN (OTU2/OTU3), SATA/SAS, and custom serial protocols. Soft IP cores from AMD’s IP catalog expand support further.

Q: Which Vivado version should I use? AMD recommends using Vivado 2018.3 or later for best device support and IP compatibility with the Virtex-7 family.


Summary

The XC7VX690T-L2FFG1930E offers an exceptional balance of logic density, transceiver performance, DSP throughput, and power efficiency within the Virtex-7 XT family. Its 693,120 logic cells, 80 GTX transceivers (up to 11.3 Gb/s), 3,600 DSP slices, and 52,920 Kbits of block RAM make it one of the most capable mid-to-high-density FPGAs available in the 28nm generation. The L2 low-power speed grade and extended temperature rating further extend its suitability across a broad range of demanding applications, from wireless infrastructure and 100G networking to aerospace signal processing and HPC acceleration.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.