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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC7VX980T-L2FFG1926E: AMD Xilinx Virtex-7 FPGA — Full Specifications & Buyer’s Guide

Product Details

The XC7VX980T-L2FFG1926E is a high-performance, low-power Xilinx FPGA from the AMD Xilinx Virtex-7 XT family. Built on a 28 nm high-k metal gate (HKMG) process, this device delivers up to 980K logic cell capacity, 1.4 Tb/s of I/O bandwidth, and 4.7 TMAC/s DSP performance — all while consuming significantly less power than previous-generation devices. Whether you are designing for high-speed data processing, signal intelligence, or advanced communications infrastructure, the XC7VX980T-L2FFG1926E is engineered to meet the most demanding requirements.


What Is the XC7VX980T-L2FFG1926E?

The XC7VX980T-L2FFG1926E is part of the Virtex-7 XT FPGA subfamily, AMD Xilinx’s flagship product line for ultra-high-bandwidth applications. The part number breaks down as follows:

Segment Meaning
XC7V Xilinx 7-Series Virtex family
X980T XT (Extended Transceiver) device with ~980K logic cells
-L2 Low-power speed grade 2 (L-grade for extended temperature)
FFG1926 Flip-chip fine-pitch BGA, 1926-ball package
E Extended temperature range (–40°C to +100°C)

This device is classified under Embedded – FPGAs (Field Programmable Gate Arrays) and manufactured by AMD (formerly Xilinx).


XC7VX980T-L2FFG1926E Key Specifications

General Device Overview

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XC7VX980T-L2FFG1926E
Family Virtex-7 XT
Technology Node 28 nm HKMG
Logic Cells 979,200
Logic Blocks 153,000
Package 1926-Ball FCBGA (Flip-Chip BGA)
Number of Pins 1,924 (user I/O)
User I/O Count 720
Speed Grade -L2 (Low-Power Grade)
Operating Voltage (VCCINT) 1.0 V
Operating Temperature –40°C to +100°C (Extended / E-grade)
RoHS Compliance Yes
Packaging / Container Tray

Memory & DSP Resources

Resource Specification
Total Block RAM 54,000 Kb (54 Mb)
Block RAM Configuration 36 Kb dual-port with built-in FIFO
DSP Slices 3,600
DSP Performance 4.7 TMAC/s
Distributed RAM Available via 6-input LUT fabric

I/O & Transceiver Capabilities

Feature Specification
Total I/O Bandwidth 1.4 Tb/s
User I/O Pins 720
High-Speed Serial Transceivers (GTX) Up to 80
Transceiver Data Rate (min) 600 Mb/s
Transceiver Data Rate (max) Up to 11.3 Gb/s (GTX)
DDR3 Interface Support Up to 1,866 Mb/s via SelectIO
PCIe Support PCIe Gen3 x8 Endpoint & Root Port

Package & Physical Details

Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Ball Count 1926
Package Designation FFG1926
Mounting Style Surface Mount Technology (SMT)
Operating Temperature Range –40°C to +100°C

Understanding the Part Number: XC7VX980T-L2FFG1926E Decoded

Engineers and procurement teams frequently search for a specific orderable part number to verify compatibility. Here is how every character in XC7VX980T-L2FFG1926E maps to a hardware attribute:

  • XC — Xilinx Commercial device series
  • 7V — 7-Series Virtex (7th generation)
  • X — XT subfamily (optimized for transceiver density)
  • 980T — Approximately 980,000 logic cell equivalent; “T” indicates Transceiver-heavy variant
  • -L2 — Low-power speed grade 2; lower power consumption vs standard -2
  • FFG — Flip-chip fine-pitch BGA package
  • 1926 — 1926-ball package (1,924 user I/O available)
  • E — Extended industrial temperature range (–40°C to +100°C)

Core Architecture Features of the Virtex-7 XC7VX980T

Advanced 6-Input LUT Fabric

The XC7VX980T-L2FFG1926E is built around Xilinx’s proven 6-input look-up table (LUT) architecture. Each LUT can be configured as a logic element or as distributed RAM/shift register, enabling flexible, high-density logic implementation without sacrificing routing resources.

36 Kb Dual-Port Block RAM with FIFO

On-chip memory is organized into 36 Kb dual-port block RAM tiles, each featuring built-in FIFO logic. This simplifies data buffering architectures significantly, reducing the need for external memory controllers in many pipelined designs.

High-Performance SelectIO Technology

The SelectIO interface supports DDR3 data rates up to 1,866 Mb/s, making the XC7VX980T-L2FFG1926E well-suited for memory-intensive applications such as image processing, financial computing, and radar signal processing.

Multi-Gigabit GTX Transceivers

The device integrates up to 80 GTX transceivers operating from 600 Mb/s to 11.3 Gb/s. A special low-power mode is available, optimized for chip-to-chip interfaces where signal integrity and power efficiency are paramount.

PCIe Gen3 Hard IP Block

An integrated PCIe block supports up to x8 Gen3, enabling seamless connection to high-speed CPU and memory subsystems without consuming soft logic resources. This is particularly valuable in FPGA-accelerated computing and network appliance designs.


Typical Applications for the XC7VX980T-L2FFG1926E

Given its massive logic capacity, high-speed transceivers, and extensive DSP resources, the XC7VX980T-L2FFG1926E targets the following application domains:

Application Domain Why This FPGA Fits
Wired & Wireless Communications 80 GTX transceivers, PCIe Gen3, 1.4 Tb/s I/O BW
High-Performance Computing (HPC) 980K logic cells + 4.7 TMAC/s DSP
Defense & Aerospace Extended temperature range, high reliability
ASIC Prototyping Largest Virtex-7 XT capacity for complex SoC emulation
Radar & Signal Processing Dense DSP slices + high-speed SerDes
Data Center Acceleration PCIe Gen3 x8 + large on-chip BRAM
Test & Measurement High pin count, broad I/O standard support

XC7VX980T-L2FFG1926E vs Similar Virtex-7 XT Variants

Buyers often compare multiple orderable configurations of the same base device. The table below compares the XC7VX980T-L2FFG1926E against the most closely related variants:

Part Number Speed Grade Package I/O Count Temp Range Logic Cells
XC7VX980T-L2FFG1926E -L2 (Low Power) FFG1926 720 –40°C to +100°C 979,200
XC7VX980T-2FFG1926C -2 (Commercial) FFG1926 720 0°C to +85°C 979,200
XC7VX980T-1FFG1926I -1 (Industrial) FFG1926 720 –40°C to +100°C 979,200
XC7VX980T-L2FFG1930E -L2 (Low Power) FFG1930 900 –40°C to +100°C 979,200
XC7VX980T-2FFG1930C -2 (Commercial) FFG1930 900 0°C to +85°C 979,200

Key insight: The “L2” speed grade offers lower static power consumption compared to the standard “-2” grade, making the XC7VX980T-L2FFG1926E particularly attractive for thermally constrained or battery-sensitive deployments. The FFG1926 package provides 720 user I/Os; if your design requires up to 900 I/Os, consider the FFG1930 package variant.


Design Tools & Software Support

The XC7VX980T-L2FFG1926E is fully supported by AMD’s design toolchain:

Tool Version Notes
Vivado Design Suite Supported from 2013.1 v1.08 onwards (recommended)
ISE Design Suite Supported from ISE 14.5 v1.08
Xilinx Power Estimator (XPE) Required for accurate power budgeting
UG586 Memory Interface Guide Required for DDR3 PHY implementation

The Vivado Design Suite is the recommended toolchain for all new designs targeting Virtex-7 devices. It provides IP integrator, synthesis, implementation, and bitstream generation all in one unified flow.


Ordering Information

Attribute Detail
Manufacturer Part Number XC7VX980T-L2FFG1926E
Manufacturer AMD (Xilinx)
DigiKey Part Number 122-1989-ND
Package Form Tray
Minimum Order Quantity 1
RoHS Status RoHS Compliant

Frequently Asked Questions (FAQ)

What does the “L2” speed grade mean in XC7VX980T-L2FFG1926E?

The “L” prefix in the speed grade designation indicates a low-power variant. The -L2 grade is optimized for reduced static power consumption versus the standard commercial -2 grade, while maintaining the same performance characteristics. This makes it suitable for applications where thermal management is a design constraint.

What is the maximum transceiver data rate for XC7VX980T-L2FFG1926E?

The GTX transceivers in the XC7VX980T support data rates from 600 Mb/s up to 11.3 Gb/s per lane, with a special low-power mode available for chip-to-chip interfaces.

Is the XC7VX980T-L2FFG1926E suitable for industrial and defense applications?

Yes. The “E” temperature suffix confirms an extended temperature range of –40°C to +100°C, making it suitable for industrial, defense, and aerospace deployments where commercial-grade temperature ratings are insufficient.

How many user I/Os does the XC7VX980T-L2FFG1926E have?

The FFG1926 package configuration provides 720 user I/O pins. If your design requires more I/Os, the FFG1930 package variant of the same device offers 900 user I/Os.

What PCIe generation does the XC7VX980T support?

The device integrates a hard PCIe IP block supporting PCIe Gen3 x8 for both Endpoint and Root Port designs, enabling high-bandwidth connections to host processors and other system components.


Summary

The XC7VX980T-L2FFG1926E is AMD Xilinx’s flagship Virtex-7 XT FPGA in a 1926-ball FCBGA package with low-power speed grade and extended temperature support. With 979,200 logic cells, 54 Mb of on-chip block RAM, 3,600 DSP slices, up to 80 GTX transceivers, and PCIe Gen3 x8 integration — all built on a 28 nm HKMG process — this device offers the logic density and I/O performance required for the most demanding FPGA applications in communications, defense, HPC, and data center acceleration.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.