The XC2S200-6FGG1243C is a high-performance Field Programmable Gate Array (FPGA) manufactured by Xilinx, part of the industry-proven Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1243-ball Fine-Pitch BGA (FGG1243) package — making it one of the most capable members of the Spartan-II lineup for complex embedded designs.
Whether you are an engineer sourcing components for telecommunications, industrial control, or digital signal processing, this guide provides everything you need to know about the XC2S200-6FGG1243C, including full technical specifications, package details, I/O capabilities, and how it compares to other Spartan-II devices.
What Is the XC2S200-6FGG1243C? – Part Number Decoded
Understanding the part number helps engineers quickly identify the exact variant they need:
| Field |
Value |
Meaning |
| XC2S200 |
Device Type |
Xilinx Spartan-II, 200K system gates |
| -6 |
Speed Grade |
Fastest commercial speed grade (-6) |
| FGG |
Package Type |
Fine-Pitch Ball Grid Array (Pb-Free) |
| 1243 |
Pin Count |
1,243 balls |
| C |
Temperature Range |
Commercial (0°C to +85°C) |
Note: The “G” in FGG denotes a Pb-free (RoHS-compliant) package, a critical detail for regulatory and environmental compliance in modern PCB assembly.
XC2S200-6FGG1243C Key Technical Specifications
The table below summarizes the core electrical and logic specifications of the XC2S200-6FGG1243C, drawn from the official Xilinx Spartan-II datasheet (DS001).
Core Logic & Memory Specifications
| Parameter |
XC2S200-6FGG1243C Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 (package-dependent) |
| Technology Node |
0.18 µm |
| Core Voltage |
2.5V |
Performance & Timing Specifications
| Parameter |
Value |
| Speed Grade |
-6 (fastest in Spartan-II) |
| Maximum Frequency |
Up to 263 MHz |
| DLL (Delay-Locked Loop) |
4 (one per corner of die) |
| Block RAM Columns |
2 |
| Temperature Range |
0°C to +85°C (Commercial) |
Package Specifications
| Parameter |
Value |
| Package |
FGG1243 (Fine-Pitch Ball Grid Array) |
| Total Balls |
1,243 |
| RoHS Compliance |
Yes (Pb-Free, “G” suffix) |
| Package Style |
Fine-Pitch BGA |
| Mounting Type |
Surface Mount |
XC2S200-6FGG1243C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1243C contains 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables engineers to implement complex combinational and sequential logic efficiently.
Distributed RAM
With 75,264 bits of distributed RAM, the XC2S200 supports fast, single-cycle on-chip memory without consuming separate block RAM resources. This is particularly useful in applications requiring small FIFOs, shift registers, or lookup tables within the logic fabric.
Block RAM
The device includes 56K bits of dedicated block RAM, organized in two columns on opposite sides of the die. Block RAM supports true dual-port access, making it ideal for buffering, data storage, and communication interfaces in embedded designs.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management capabilities including clock deskewing, frequency synthesis, and phase shifting. This eliminates clock distribution delay and ensures reliable, high-frequency system operation.
Input/Output Blocks (IOBs)
The FGG1243 package provides access to up to 284 user I/O pins, supporting a wide range of I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB includes programmable slew rate control, input delay, and optional pull-up/pull-down resistors.
Spartan-II Family Comparison – Where Does the XC2S200 Fit?
The table below positions the XC2S200 within the full Spartan-II device family, helping engineers select the right size for their project:
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
96 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
216 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
384 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
600 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
864 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
1,176 |
284 |
75,264 bits |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, the most CLBs, and the largest memory resources — all in a 2.5V platform optimized for cost-sensitive, high-volume production.
XC2S200-6FGG1243C Available Package Options
Xilinx offered the XC2S200 in multiple package options. The table below clarifies the available variants for the XC2S200 device:
| Part Number |
Package |
Pin Count |
Pb-Free |
Speed Grade |
Temp Range |
| XC2S200-6PQ208C |
PQFP |
208 |
No |
-6 |
Commercial |
| XC2S200-6PQG208C |
PQFP |
208 |
Yes |
-6 |
Commercial |
| XC2S200-6FG256C |
FBGA |
256 |
No |
-6 |
Commercial |
| XC2S200-6FGG256C |
FBGA |
256 |
Yes |
-6 |
Commercial |
| XC2S200-6FGG456C |
FBGA |
456 |
Yes |
-6 |
Commercial |
| XC2S200-6FGG1243C |
Fine-Pitch BGA |
1,243 |
Yes |
-6 |
Commercial |
The FGG1243 package is the highest pin-count variant and provides the maximum I/O flexibility for designs that require dense board-level connectivity.
Typical Applications of the XC2S200-6FGG1243C
The XC2S200-6FGG1243C is a versatile FPGA well-suited to a broad range of embedded and signal processing applications:
Telecommunications & Networking
Line cards, protocol bridges, framing logic, and high-speed data path implementations in routers, switches, and access equipment.
Digital Signal Processing (DSP)
FIR/IIR filter banks, FFT engines, modems, and baseband processing pipelines that benefit from parallel logic execution.
Industrial & Embedded Control
Motor drive controllers, machine vision preprocessing, sensor fusion, and real-time control loops where deterministic timing is critical.
Consumer Electronics & Connected Peripherals
Video processing, image scaling, USB/PCI interface glue logic, and custom I/O expansion in printers and display systems.
Prototyping & ASIC Emulation
The XC2S200-6FGG1243C is widely used as an ASIC replacement and prototyping platform — its in-field reprogrammability allows design iterations without the NRE cost and lead time of mask-programmed ASICs.
Why Choose the XC2S200-6FGG1243C? – Key Advantages
- Largest gate count in the Spartan-II family — 200,000 system gates and 5,292 logic cells
- Fastest -6 speed grade — Commercial-only speed grade offering maximum performance
- Pb-free FGG1243 package — RoHS compliant, suitable for modern manufacturing environments
- Reprogrammable in the field — eliminates hardware replacement for design updates
- Low-cost alternative to ASICs — avoids NRE costs and lengthy ASIC development cycles
- Comprehensive I/O standard support — LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and more
- Four on-chip DLLs — for precise clock management, skew elimination, and frequency synthesis
- Proven 0.18µm process — reliable performance in commercial-grade applications
XC2S200-6FGG1243C vs. Competitor FPGAs
| Feature |
XC2S200-6FGG1243C (Xilinx) |
Altera Cyclone EP1C12 |
Lattice ispXPGA |
| Gates |
200,000 |
~250,000 |
~200,000 |
| Core Voltage |
2.5V |
1.5V |
3.3V |
| Speed Grade |
-6 (263 MHz) |
~200 MHz |
~200 MHz |
| Block RAM |
56K bits |
239,616 bits |
64K bits |
| DLL / PLL |
4 DLLs |
2 PLLs |
2 PLLs |
| Package |
BGA-1243 |
BGA-256 |
BGA-484 |
| RoHS |
Yes |
Yes |
Yes |
For engineers requiring a proven, high-speed Xilinx FPGA with large pin count and maximum Spartan-II gate density, the XC2S200-6FGG1243C remains a competitive choice. Explore the full range of available Xilinx FPGA options for current-generation alternatives and upgrade paths.
Programming & Design Tools for the XC2S200-6FGG1243C
Xilinx ISE Design Suite
The XC2S200-6FGG1243C is supported by the Xilinx ISE Design Suite (Legacy), which includes:
- XST – Xilinx Synthesis Technology for VHDL/Verilog synthesis
- NGDBuild / MAP / PAR – Place-and-route tools
- BitGen – Bitstream generation for device configuration
- iMPACT – JTAG-based device programming and boundary scan
Configuration Modes
The Spartan-II supports multiple configuration modes:
- Master Serial – using Xilinx XCF/XC18V PROMs
- Slave Serial – for daisy-chaining multiple devices
- Master Parallel (SelectMAP) – high-speed configuration via 8-bit bus
- JTAG (Boundary Scan) – IEEE 1149.1 compliant, ideal for in-system programming
XC2S200-6FGG1243C Ordering & Availability
When ordering the XC2S200-6FGG1243C, engineers should verify:
| Consideration |
Details |
| Lead Status |
Not Recommended for New Designs (NRND) – use for legacy board support |
| Temperature Range |
Commercial only (0°C to +85°C) for -6 speed grade |
| RoHS Status |
Pb-Free (FGG suffix with “G”) — RoHS compliant |
| Authorized Distributors |
Digi-Key, Mouser, Arrow, Avnet, and specialty IC brokers |
| Alternative Part |
For new designs, consider Xilinx Spartan-6 or AMD Spartan-7 families |
Important: Xilinx (now AMD) has classified the Spartan-II family as Not Recommended for New Designs (NRND). The XC2S200-6FGG1243C is best suited for maintaining existing designs or legacy board replacements. For new projects, the Spartan-6 (XC6S series) or Spartan-7 families offer far greater performance, lower power, and modern tool support.
Frequently Asked Questions – XC2S200-6FGG1243C
What does the “-6” speed grade mean on the XC2S200-6FGG1243C?
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). It delivers the best timing performance and is suited for designs running at higher clock frequencies.
Is the XC2S200-6FGG1243C RoHS compliant?
What is the difference between FG and FGG packages?
The FGG (with double “G”) designation indicates the Pb-free version of the Fine-Pitch BGA package. The standard FG suffix denotes a conventional tin-lead package. Functionally and Can the XC2S200-6FGG1243C be used in new designs?
Xilinx has classified the entire Spartan-II family as Not Recommended for New Designs (NRND). While the part may still be available through distributors and brokers, engineers What programming software supports the XC2S200-6FGG1243C?
The part is supported by Xilinx ISE Design Suite (legacy software). Vivado does not support Spartan-II devices. ISE 14.7 is the last version and remains available for download from the AMD/Xilinx support portal.
Summary
The XC2S200-6FGG1243C is the top-tier member of the Xilinx Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, and four DLLs in a high pin-count Pb-free FGG1243 BGA package. Its -6 speed grade delivers peak Spartan-II performance, and its RoHS compliance makes it suitable for modern assembly environments.
While it is classified as NRND for new designs, the XC2S200-6FGG1243C continues to serve engineers maintaining legacy systems, supporting existing PCB layouts, or requiring proven Spartan-II compatibility. For new development projects requiring Xilinx FPGA silicon, explore modern alternatives with long-term production commitments and updated toolchain support.
