Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU035-1FFVA1156E: Xilinx Kintex UltraScale FPGA – Full Specifications & Buyer’s Guide

Product Details

The XCKU035-1FFVA1156E is a high-performance Xilinx FPGA from AMD Xilinx’s Kintex® UltraScale™ family, built on a cutting-edge 20nm process node. Combining excellent price-to-performance ratio with low power consumption, this device is a top choice for engineers designing next-generation DSP, networking, medical imaging, and wireless infrastructure systems.


What Is the XCKU035-1FFVA1156E?

The XCKU035-1FFVA1156E belongs to the Kintex UltraScale product family — AMD Xilinx’s mid-range FPGA lineup optimized for the best price/performance/watt at 20nm. The “XCKU035” designates the device size within the KU series, “-1” indicates Speed Grade 1, “FFVA1156” identifies the 1156-pin FCBGA package, and “E” denotes the extended temperature grade.

This FPGA is fully supported by the Xilinx Vivado Design Suite, enabling seamless design entry, synthesis, implementation, and verification in one environment.


XCKU035-1FFVA1156E Key Specifications

General Overview Table

Parameter Value
Manufacturer AMD Xilinx (formerly Xilinx, Inc.)
Part Number XCKU035-1FFVA1156E
Product Family Kintex® UltraScale™
Process Technology 20nm
Speed Grade -1
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Designator FFVA1156
Total Pins 1156
Temperature Grade E (Extended)
Operating Temperature (TJ) –40°C to 100°C
VCCINT Supply Voltage 0.95V (0.922V – 0.979V range)
RoHS Compliant Yes
Lifecycle Status Production

Logic & Memory Resources

Resource XCKU035
System Logic Cells 444,343
CLB Logic Blocks 203,128
Total Block RAM (Mb) 19,000 Kb (~19 Mb)
Total RAM Bits 19,456,000
DSP Slices High ratio (optimized for signal processing)
Max User I/Os 520
MMCM / PLL Yes

Package & I/O Details

Feature Details
Package Code FCBGA-1156
Ball Pitch 1.0mm
Package Shape Square BGA
Number of I/O Pins 520 (user-accessible)
Total Ball Count 1156
Footprint Compatibility Footprint-compatible with Kintex UltraScale+ A1156 packages

Transceiver & Interface Capabilities

Interface Specification
GTH Transceivers Supported (up to 12.5 Gb/s in SF/FB packages)
GTY Transceivers Up to 16.3 Gb/s
Clocking Fine-granular clock gating, ASIC-like clocking
Memory Interface DDR3/DDR4 SDRAM
PCIe PCIe Gen3 support
Ethernet 100G+ capable

XCKU035-1FFVA1156E Part Number Decoder

Understanding the part number helps confirm you are ordering the correct variant:

Code Segment Meaning
XC Xilinx Commercial Device
KU Kintex UltraScale Family
035 Device Size (mid-range KU density)
-1 Speed Grade 1 (standard performance, 0.95V VCCINT)
FF Flip-Chip Fine-Pitch BGA package type
VA Package variant identifier
1156 Total number of balls/pins
E Extended temperature grade (–40°C to 100°C)

XCKU035-1FFVA1156E vs. Other XCKU035 Variants

Part Number Speed Grade Package Pins Temp Grade
XCKU035-1FFVA1156E -1 FCBGA 1156 Extended
XCKU035-1FFVA1156C -1 FCBGA 1156 Commercial
XCKU035-1FFVA1156I -1 FCBGA 1156 Industrial
XCKU035-2FFVA1156E -2 FCBGA 1156 Extended
XCKU035-2FFVA1156C -2 FCBGA 1156 Commercial
XCKU035-3FFVA1156E -3 FCBGA 1156 Extended
XCKU035-1FBVA676E -1 FCBGA 676 Extended
XCKU035-1FBVA900E -1 FCBGA 900 Extended

Note: The “-1FFVA1156E” variant offers Speed Grade 1 performance in the maximum 1156-pin FCBGA form factor with extended temperature support — ideal for demanding embedded and industrial deployments.


Top Applications for the XCKU035-1FFVA1156E

100G Networking & Data Centers

The XCKU035-1FFVA1156E delivers the packet processing throughput required for 100G line-rate networking, deep packet inspection, and SmartNIC designs. Its GTY transceivers and high logic density make it an industry-standard choice for data center acceleration.

DSP-Intensive Signal Processing

With a high DSP-to-logic ratio, the XCKU035-1FFVA1156E is purpose-built for compute-heavy workloads such as radar processing, OFDM, FIR filtering, and FFT engines — all achievable without an external DSP processor.

Medical Imaging Systems

Next-generation medical imaging platforms — including ultrasound, MRI reconstruction, and CT data pipelines — rely on the real-time processing capabilities of Kintex UltraScale FPGAs like the XCKU035-1FFVA1156E.

8K4K Video Processing

The device supports the high-bandwidth fabric required for 8K4K video capture, encode/decode pipelines, and real-time image scaling and format conversion.

Wireless Infrastructure (4G/5G)

The XCKU035-1FFVA1156E is widely adopted in heterogeneous wireless deployments including TD-LTE Radio Units, Remote Radio Head DFE, and 5G baseband units — applications demanding low latency, high DSP throughput, and tight power budgets.


Why Choose the XCKU035-1FFVA1156E?

✅ Best Price/Performance/Watt at 20nm

Kintex UltraScale devices are Xilinx’s value-optimized mid-range FPGAs. The 20nm node delivers up to 40% lower power compared to previous-generation devices, without sacrificing logic capacity or memory bandwidth.

✅ High Signal Processing Bandwidth

The XCKU035 offers the highest signal processing bandwidth in its mid-range class, combining abundant DSP slices, large Block RAM resources, and high-speed transceivers.

✅ Next-Generation Transceivers

GTH and GTY serial transceivers deliver multi-gigabit connectivity for protocols including PCIe Gen3, 100G Ethernet, JESD204B, and custom high-speed serial links.

✅ Footprint Scalability

The A1156 package is footprint-compatible across Kintex UltraScale and Kintex UltraScale+ families, enabling easy design migration to higher-density or lower-power variants without PCB redesign.

✅ Extended Temperature Support

The “E” temperature grade supports junction temperatures from –40°C to 100°C, making the XCKU035-1FFVA1156E suitable for embedded industrial, defense-adjacent, and harsh-environment deployments.

✅ Vivado Design Suite Integration

Full support in AMD’s Vivado Design Suite ensures access to IP cores, optimized synthesis flows, timing closure tools, and high-level synthesis (HLS) acceleration.


Power Supply Requirements

Supply Rail Typical Voltage Function
VCCINT 0.95V Core logic supply
VCCAUX 1.8V Auxiliary circuits
VCCO 1.2V – 3.3V I/O bank supply (per bank)
VCCBRAM 0.95V Block RAM supply
VCCINT_IO 0.95V I/O logic supply

Use the Xilinx Power Estimator (XPE) tool to calculate accurate power estimates for your specific design configuration.


Development & Design Tools

Tool Purpose
Vivado Design Suite Primary design, synthesis, and implementation
Xilinx Power Estimator (XPE) Power analysis and supply sizing
Vivado HLS / Vitis HLS High-level synthesis from C/C++
ChipScope Pro / ILA In-system debugging
SDK / Vitis Unified Platform Embedded software development

Ordering Information

Field Value
Manufacturer Part Number XCKU035-1FFVA1156E
Manufacturer AMD (Xilinx)
Package 1156-Pin FCBGA
ECCN 3E001 (check with distributor for latest export classification)
Lead-Free / RoHS Yes
Container Tray

Frequently Asked Questions (FAQ)

What does the “-1” speed grade mean on the XCKU035-1FFVA1156E?

Speed Grade -1 is the standard performance tier for Kintex UltraScale devices, operating at VCCINT = 0.95V. Speed Grade -2 and -3 offer progressively higher performance, while -1L offers a low-power option at 0.90V VCCINT with the same -1 timing specification at 0.95V.

Is the XCKU035-1FFVA1156E footprint-compatible with Kintex UltraScale+ devices?

Yes. Devices in the A1156 package footprint are compatible between Kintex UltraScale and Kintex UltraScale+ families, enabling design migration or density scaling without modifying the PCB.

What programming tools are required for the XCKU035-1FFVA1156E?

The XCKU035-1FFVA1156E is programmed and developed using the AMD Vivado Design Suite. Bitstream download can be performed via JTAG or through supported configuration interfaces (SPI, BPI, etc.).

What is the maximum I/O count for the XCKU035-1FFVA1156E?

In the 1156-pin FCBGA package, the XCKU035 supports up to 520 user I/Os — the maximum I/O count available for this device density.

Can the XCKU035-1FFVA1156E operate in industrial temperature environments?

The “E” temperature grade supports extended junction temperatures (–40°C to 100°C TJ). For full industrial-grade qualification, consider the “I” suffix variant (XCKU035-1FFVA1156I).


Summary

The XCKU035-1FFVA1156E is a production-status, extended-temperature Kintex UltraScale FPGA delivering 444,343 logic cells, 520 user I/Os, high-speed GTH/GTY transceivers, and rich on-chip memory — all in a 1156-pin FCBGA package on a power-efficient 20nm process. Whether you are designing for 100G networking, wireless infrastructure, medical imaging, or high-throughput DSP, the XCKU035-1FFVA1156E provides an outstanding blend of capability, scalability, and cost-effectiveness.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.