The XCKU035-1FFVA1156E is a high-performance Xilinx FPGA from AMD Xilinx’s Kintex® UltraScale™ family, built on a cutting-edge 20nm process node. Combining excellent price-to-performance ratio with low power consumption, this device is a top choice for engineers designing next-generation DSP, networking, medical imaging, and wireless infrastructure systems.
What Is the XCKU035-1FFVA1156E?
The XCKU035-1FFVA1156E belongs to the Kintex UltraScale product family — AMD Xilinx’s mid-range FPGA lineup optimized for the best price/performance/watt at 20nm. The “XCKU035” designates the device size within the KU series, “-1” indicates Speed Grade 1, “FFVA1156” identifies the 1156-pin FCBGA package, and “E” denotes the extended temperature grade.
This FPGA is fully supported by the Xilinx Vivado Design Suite, enabling seamless design entry, synthesis, implementation, and verification in one environment.
XCKU035-1FFVA1156E Key Specifications
General Overview Table
| Parameter |
Value |
| Manufacturer |
AMD Xilinx (formerly Xilinx, Inc.) |
| Part Number |
XCKU035-1FFVA1156E |
| Product Family |
Kintex® UltraScale™ |
| Process Technology |
20nm |
| Speed Grade |
-1 |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Designator |
FFVA1156 |
| Total Pins |
1156 |
| Temperature Grade |
E (Extended) |
| Operating Temperature (TJ) |
–40°C to 100°C |
| VCCINT Supply Voltage |
0.95V (0.922V – 0.979V range) |
| RoHS Compliant |
Yes |
| Lifecycle Status |
Production |
Logic & Memory Resources
| Resource |
XCKU035 |
| System Logic Cells |
444,343 |
| CLB Logic Blocks |
203,128 |
| Total Block RAM (Mb) |
19,000 Kb (~19 Mb) |
| Total RAM Bits |
19,456,000 |
| DSP Slices |
High ratio (optimized for signal processing) |
| Max User I/Os |
520 |
| MMCM / PLL |
Yes |
Package & I/O Details
| Feature |
Details |
| Package Code |
FCBGA-1156 |
| Ball Pitch |
1.0mm |
| Package Shape |
Square BGA |
| Number of I/O Pins |
520 (user-accessible) |
| Total Ball Count |
1156 |
| Footprint Compatibility |
Footprint-compatible with Kintex UltraScale+ A1156 packages |
Transceiver & Interface Capabilities
| Interface |
Specification |
| GTH Transceivers |
Supported (up to 12.5 Gb/s in SF/FB packages) |
| GTY Transceivers |
Up to 16.3 Gb/s |
| Clocking |
Fine-granular clock gating, ASIC-like clocking |
| Memory Interface |
DDR3/DDR4 SDRAM |
| PCIe |
PCIe Gen3 support |
| Ethernet |
100G+ capable |
XCKU035-1FFVA1156E Part Number Decoder
Understanding the part number helps confirm you are ordering the correct variant:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 035 |
Device Size (mid-range KU density) |
| -1 |
Speed Grade 1 (standard performance, 0.95V VCCINT) |
| FF |
Flip-Chip Fine-Pitch BGA package type |
| VA |
Package variant identifier |
| 1156 |
Total number of balls/pins |
| E |
Extended temperature grade (–40°C to 100°C) |
XCKU035-1FFVA1156E vs. Other XCKU035 Variants
| Part Number |
Speed Grade |
Package |
Pins |
Temp Grade |
| XCKU035-1FFVA1156E |
-1 |
FCBGA |
1156 |
Extended |
| XCKU035-1FFVA1156C |
-1 |
FCBGA |
1156 |
Commercial |
| XCKU035-1FFVA1156I |
-1 |
FCBGA |
1156 |
Industrial |
| XCKU035-2FFVA1156E |
-2 |
FCBGA |
1156 |
Extended |
| XCKU035-2FFVA1156C |
-2 |
FCBGA |
1156 |
Commercial |
| XCKU035-3FFVA1156E |
-3 |
FCBGA |
1156 |
Extended |
| XCKU035-1FBVA676E |
-1 |
FCBGA |
676 |
Extended |
| XCKU035-1FBVA900E |
-1 |
FCBGA |
900 |
Extended |
Note: The “-1FFVA1156E” variant offers Speed Grade 1 performance in the maximum 1156-pin FCBGA form factor with extended temperature support — ideal for demanding embedded and industrial deployments.
Top Applications for the XCKU035-1FFVA1156E
100G Networking & Data Centers
The XCKU035-1FFVA1156E delivers the packet processing throughput required for 100G line-rate networking, deep packet inspection, and SmartNIC designs. Its GTY transceivers and high logic density make it an industry-standard choice for data center acceleration.
DSP-Intensive Signal Processing
With a high DSP-to-logic ratio, the XCKU035-1FFVA1156E is purpose-built for compute-heavy workloads such as radar processing, OFDM, FIR filtering, and FFT engines — all achievable without an external DSP processor.
Medical Imaging Systems
Next-generation medical imaging platforms — including ultrasound, MRI reconstruction, and CT data pipelines — rely on the real-time processing capabilities of Kintex UltraScale FPGAs like the XCKU035-1FFVA1156E.
8K4K Video Processing
The device supports the high-bandwidth fabric required for 8K4K video capture, encode/decode pipelines, and real-time image scaling and format conversion.
Wireless Infrastructure (4G/5G)
The XCKU035-1FFVA1156E is widely adopted in heterogeneous wireless deployments including TD-LTE Radio Units, Remote Radio Head DFE, and 5G baseband units — applications demanding low latency, high DSP throughput, and tight power budgets.
Why Choose the XCKU035-1FFVA1156E?
✅ Best Price/Performance/Watt at 20nm
Kintex UltraScale devices are Xilinx’s value-optimized mid-range FPGAs. The 20nm node delivers up to 40% lower power compared to previous-generation devices, without sacrificing logic capacity or memory bandwidth.
✅ High Signal Processing Bandwidth
The XCKU035 offers the highest signal processing bandwidth in its mid-range class, combining abundant DSP slices, large Block RAM resources, and high-speed transceivers.
✅ Next-Generation Transceivers
GTH and GTY serial transceivers deliver multi-gigabit connectivity for protocols including PCIe Gen3, 100G Ethernet, JESD204B, and custom high-speed serial links.
✅ Footprint Scalability
The A1156 package is footprint-compatible across Kintex UltraScale and Kintex UltraScale+ families, enabling easy design migration to higher-density or lower-power variants without PCB redesign.
✅ Extended Temperature Support
The “E” temperature grade supports junction temperatures from –40°C to 100°C, making the XCKU035-1FFVA1156E suitable for embedded industrial, defense-adjacent, and harsh-environment deployments.
✅ Vivado Design Suite Integration
Full support in AMD’s Vivado Design Suite ensures access to IP cores, optimized synthesis flows, timing closure tools, and high-level synthesis (HLS) acceleration.
Power Supply Requirements
| Supply Rail |
Typical Voltage |
Function |
| VCCINT |
0.95V |
Core logic supply |
| VCCAUX |
1.8V |
Auxiliary circuits |
| VCCO |
1.2V – 3.3V |
I/O bank supply (per bank) |
| VCCBRAM |
0.95V |
Block RAM supply |
| VCCINT_IO |
0.95V |
I/O logic supply |
Use the Xilinx Power Estimator (XPE) tool to calculate accurate power estimates for your specific design configuration.
Development & Design Tools
| Tool |
Purpose |
| Vivado Design Suite |
Primary design, synthesis, and implementation |
| Xilinx Power Estimator (XPE) |
Power analysis and supply sizing |
| Vivado HLS / Vitis HLS |
High-level synthesis from C/C++ |
| ChipScope Pro / ILA |
In-system debugging |
| SDK / Vitis Unified Platform |
Embedded software development |
Ordering Information
| Field |
Value |
| Manufacturer Part Number |
XCKU035-1FFVA1156E |
| Manufacturer |
AMD (Xilinx) |
| Package |
1156-Pin FCBGA |
| ECCN |
3E001 (check with distributor for latest export classification) |
| Lead-Free / RoHS |
Yes |
| Container |
Tray |
Frequently Asked Questions (FAQ)
What does the “-1” speed grade mean on the XCKU035-1FFVA1156E?
Speed Grade -1 is the standard performance tier for Kintex UltraScale devices, operating at VCCINT = 0.95V. Speed Grade -2 and -3 offer progressively higher performance, while -1L offers a low-power option at 0.90V VCCINT with the same -1 timing specification at 0.95V.
Is the XCKU035-1FFVA1156E footprint-compatible with Kintex UltraScale+ devices?
Yes. Devices in the A1156 package footprint are compatible between Kintex UltraScale and Kintex UltraScale+ families, enabling design migration or density scaling without modifying the PCB.
What programming tools are required for the XCKU035-1FFVA1156E?
The XCKU035-1FFVA1156E is programmed and developed using the AMD Vivado Design Suite. Bitstream download can be performed via JTAG or through supported configuration interfaces (SPI, BPI, etc.).
What is the maximum I/O count for the XCKU035-1FFVA1156E?
In the 1156-pin FCBGA package, the XCKU035 supports up to 520 user I/Os — the maximum I/O count available for this device density.
Can the XCKU035-1FFVA1156E operate in industrial temperature environments?
The “E” temperature grade supports extended junction temperatures (–40°C to 100°C TJ). For full industrial-grade qualification, consider the “I” suffix variant (XCKU035-1FFVA1156I).
Summary
The XCKU035-1FFVA1156E is a production-status, extended-temperature Kintex UltraScale FPGA delivering 444,343 logic cells, 520 user I/Os, high-speed GTH/GTY transceivers, and rich on-chip memory — all in a 1156-pin FCBGA package on a power-efficient 20nm process. Whether you are designing for 100G networking, wireless infrastructure, medical imaging, or high-throughput DSP, the XCKU035-1FFVA1156E provides an outstanding blend of capability, scalability, and cost-effectiveness.